• Damages and fractures to substrates and circuits due to mechanical stress
• Damages to PCB due to accumulated debris
• Constant need for new bits, custom dies, and blades
• Lack of versatility - each new application requires ordering of custom tools
• Not suitable for high precision, multi-dimensional or complicated cuts
• Ineffective for depaneling smaller boards

Lasers provide superior PCB depaneling/singulation with higher precision, lower stress on components, and increased throughput. Laser depaneling adapts to various applications through simple setting changes, eliminating tool maintenance, lead times for replacement parts, and substrate damage from mechanical torque.

• No mechanical stress on substrates or circuits
• Eliminates tooling costs and consumables
• Versatile operation with simple setting adjustments
• Fiducial recognition for precise, clean cuts
• Optical recognition prior to depaneling process
• Compatible with virtually any substrate (Rogers, FR4, ChemA, Teflon, ceramics, metals)
• Exceptional cut quality with tolerances under 50 microns
• No design limitations - cuts complex contours and multidimensional boards

• Global Technical Support: Engineers available for overseas machinery training and support
• Comprehensive Warranty: One year warranty for machines (excluding accessories) with free replacement parts
• Responsive Service: Prompt customer support and problem resolution
• Proven Expertise: 12 years experience in PCB separator machines with continuous R&D improvements