Aluminium AL7050 5-Axis Wire EDM Spare Parts with 0.002mm Accuracy and HRC 58-62 Hardness
Electrical discharge wire cutting (wire-walking) is an electrothermal production process that uses electrical discharge to remove material from the workpiece. This advanced method improves upon traditional EDM techniques, offering compatibility with nearly all conductive materials while enabling complex designs and shapes.
| Attribute | Value |
|---|---|
| Name | CNC wire EDM Parts |
| Material | Carbon steel, stainless steel, aluminum, titanium, nickel, alloy steel |
| Hardness | HRC 58-62 |
| Main Process | Centerless Grinding And Mitsubishi EDM |
| Key Processes | PG machining, WEDM, EDM, Surface Grinding |
| Accuracy For Grinding | 0.001mm |
| Main Machining | Grinding, EDM, WEDM |
| Tolerance | ±0.005mm |
| EDM Accuracy | 0.002mm |
| Quality Control | 100% inspection |
| OEM Service | Yes |
- Non-contact reduction manufacturing process using charged fine wires and dielectric fluids
- Versatile precision machining for complex shapes and geometries
- Ideal for applications requiring strict tolerances (aerospace, medical industries)
- High processing precision with efficient production rates
- Reduced manufacturing costs compared to traditional methods
Custom parts with complex shapes and high precision requirements
Engine components, turbine blades, and landing gear parts
Dental implants, surgical instruments, and syringe components
- Exceptional cutting precision with minimal post-processing
- Ideal for small parts and highly detailed projects
- Capable of complex geometries beyond traditional CNC capabilities
- Burr-free cuts with no material deformation
- Continuous, uninterrupted processing
Besides Wire EDM, drilling EDM (tubular electrodes for fine/deep holes) and sinker EDM (shaped electrodes) offer alternative processing methods.
Laser cutting uses thermal energy while wire EDM employs electrical discharge for material removal.
Deionized water serves as an effective coolant with low carbon properties, helping regulate dielectric temperature during processing.
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