ceramic capacitor AIDE CAPACITOR 0805X7R222K501NT for networking communication and power supply circuits

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Product Description

Product Overview

High-reliability Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding high-voltage applications. These capacitors are essential components for coupling, wave filtering, and resonance in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. They offer robust performance and are built with advanced ceramic dielectric and electrode materials.

Product Attributes

Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
Certifications: RoHS/REACH compliant

Technical Specifications

Item	Description	Specification
Application Field	Coupling, wave filtering, resonant in high voltage circuits
	Switch power supplier
	AC-DC power charger, DC-DC power charger
	Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps
Testing Conditions	Normal Condition	Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Testing Conditions	Relative Condition	Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description	Dimension Code Examples	0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
	Temperature Characteristic	C0G (030 PPM/), X7R (15%), X5R (15%)
	Nominal Electrostatic Capacity	8R08.0, 10010, 101100 (pF)
	Tolerance of Electrostatic Capacity	B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
	Rated Voltage (DC)	25025, 251250, 2522500 (V)
	Terminal Composition	Au/Ag-Ni-Sn (From the inside out)
	Packing	T Tape/Reel, P Bag packing (PE)
Construction & Dimension	Construction Items	1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer
	Dimensions (mm)	Part Number \| L \| W \| T \| WB
	0201 (0603)	0.600.10	0.300.05	0.300.05	0.100.05
	0402 (1005)	1.000.15	0.500.15	0.500.10	0.200.10
	0603 (1608)	1.600.20	0.800.15	0.800.15	0.300.10
	0805 (2012)	2.000.20	1.250.20	0.800.20	0.500.20
	1206 (3216)	3.200.30	1.600.30	1.000.20	0.600.30
	1210 (3225)	3.200.30	2.500.30	2.70	0.800.30
	1808 (4520)	4.500.40	2.000.20	2.70	0.800.30
	1812 (4532)	4.500.40	3.200.30	3.50	0.800.30
	1825 (4563)	4.500.40	6.300.50	3.50	0.800.30
	2220 (5750)	5.700.50	5.000.50	3.50	1.000.40
2225 (5763)	5.700.50	6.300.50	6.20	1.000.40
Specification & Testing Method	Temperature	-55~+125
	Visual/Dimension	1. No Damage, 2. Dimension meet Spec. Tested by Naked eye (Visual inspection) and Digital calliper.
	Static Capacity	NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF).
	Dissipation Factor (DF)	NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Testing frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); 110%KHz, Voltage 1V0.2rms (Cr>1000pF). X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. See Note 1 for exceptions.
	IR Insulation Resistance	NPO: IR50000M, C10nF; IRCr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IRCr100S, C25nF. Testing condition: Rated voltage, 605s, Humidity:75%, Temperature:255, Current :50mA.
	Hi-pot (DC)	No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S.
	Solderability	Soldering area90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
	Resistance to the heat of soldering	Visual-No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
	Electrostatic Capacity Change Rate	NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%.
	Flexural Strength	No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%.
	Terminal Bonding Strength	No visual damage. Applied Force: 5N, Duration: 101S.
	Thermal Shock	NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. 5 cycles. Test after 242hours normal temp & humidity.
	Temperature Moisture Exposure	Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IRCr25S; X7R/X7T/X7P: IR1000M or IRCr25S. Test after 242hours normal temp & humidity (402, 90~95%RH, 50024 hours).
High Temperature Exposure	Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IRCr40S; X7R/X7T/X7P: IR2000M or IRCr50S. Test after 48hours under normal pressure & temperature (1253, 100048 hours, Voltage dependent on rating).
PCB Flexural Strength	No crack and other defect. IR tested.
Embossed Plastic Taping	Tape Size (0805)	A: 1.550.20, B: 2.350.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.50 Max
	Tape Size (1206)	A: 1.950.20, B: 3.600.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.1, J: 1.50 -0/+0.10, T: 1.85 Max
	Tape Size (1210)	A: 2.700.10, B: 3.420.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.55 -0/+0.10, T: 3.2 Max
	Tape Size (1808)	A: 2.200.10, B: 4.950.10, C: 12.000.10, D: 5.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.05, H: 4.000.10, J: 1.50 -0/+0.10, T: 3.0 Max
	Tape Size (1812)	A: 3.660.10, B: 4.950.10, C: 12.000.10, D: 5.500.05, E: 1.750.10, F: 8.000.10, G: 2.000.05, H: 4.000.10, J: 1.55 -0/+0.10, T: 4.0 Max
Paper Tape Reel Packing	Paper Tape Size (1005)	W1: 0.240.02, L1: 0.450.02, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.30 Below
	Paper Tape Size (0201)	W1: 0.370.10, L1: 0.670.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below
	Paper Tape Size (0402)	W1: 0.650.10, L1: 1.150.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below
Paper Tape Size (0603)	A: 1.100.10, B: 1.900.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max
Paper Tape Size (0805)	A: 1.450.15, B: 2.300.15, C: 8.00.15, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max
Paper Tape Size (1206)	A: 1.800.20, B: 3.400.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max
Reel Dimensions	7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max.
Top Tape Peeling Strength	Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity	Refer to table for Paper T/R and Plastic T/R quantities per size.
Soldering Method	RReflow Soldering, WWave Soldering. Refer to table for recommended methods by size, characteristics, rated voltage, and capacitance.
Soldering Temperature Profile	Keep temperature difference between soldering temperature and surface temperature of chips as T150 during preheating.