Multilayer Chip Ceramic Capacitors FH 0402X106M100NT Suitable for DC Blocking Coupling and Bypassing
Product Overview
The GH-ZD4132E Multilayer Chip Ceramic Capacitors (MLCC) are designed for surface mounting and offer a wide range of dielectric materials, including Class I (High Frequency types like COG, COH, HG, LG, PH, RH, SH, TH, UJ, SL) and Class II (X7R, X5R, X7S, X6S, Y5V, Z5U). These capacitors are suitable for various applications requiring stable electrical properties, temperature compensation, or high capacitance in diverse circuit types such as DC-blocking, coupling, bypassing, and frequency discrimination. The product line includes standard and middle-to-high voltage variants, engineered for reliability and performance in demanding electronic circuits.
Product Attributes
- Manufacturer: Not specified (Implied from document context)
- Product Type: Multilayer Chip Ceramic Capacitors (MLCC)
- Dielectric Materials: COG, COH, HG, LG, PH, RH, SH, TH, UJ, SL (Class I); X7R, X5R, X7S, X6S, Y5V, Z5U (Class II)
- Terminal Material Styles: Pure Silver (S), Pure Copper (C), Nickel Barrier (N)
- Packaging Styles: Bulk Bag (B), Taping Package (T)
Technical Specifications
Note: Detailed specifications for dimensions, capacitance ranges, and voltage ratings vary significantly by size code and dielectric type. The table below provides a representative overview of available sizes and general categories. Refer to the full document for comprehensive data.
| Size Code (Metric) | Size Code (Imperial) | Dimensions (L x W x T) [mm] | General Dielectric Types | Voltage Range | Capacitance Range (Example) |
|---|---|---|---|---|---|
| 1005 | 0201 | 0.4 x 0.2 x 0.2 | All Dielectric | 50V | 0.1pF - 220pF (COG) |
| 1608 | 0603 | 0.6 x 0.3 x 0.3 | All Dielectric | 50V | 0.1pF - 10F (Various Dielectrics) |
| 2012 | 0805 | 1.0 x 0.5 x 0.5 | Y5V/Z5U | 50V | 0.47F - 1F |
| 2012 | 0805 | 1.0 x 0.5 x 0.5 | Excluding Y5V/Z5U | 50V | 0.1F - 10F |
| 2012 | 0805 | 2.0 x 1.25 x 0.8 (or 1.25) | Excluding Y5V/Z5U | > 50V (High Voltage) | 0.1F - 4.7F |
| 3216 | 1206 | 1.6 x 0.8 x 0.8 (or 1.25, 1.6) | All Dielectric | 50V | 0.1F - 3.3F (Various Dielectrics) |
| 3216 | 1206 | 3.2 x 1.6 x 0.8 (or 1.0, 1.25, 1.6) | Excluding Y5V/Z5U | > 50V (High Voltage) | 0.1F - 0.47F |
| 3225 | 1210 | 3.2 x 2.5 x 2.8 (or other thickness) | All Dielectric | 50V | 0.1F - 10F (Various Dielectrics) |
| 3225 | 1210 | 3.2 x 2.5 x 2.8 (or other thickness) | NPO, X7R | > 50V (High Voltage) | 1.0F - 6.8F (NPO), 0.15F - 2.2F (X7R) |
| 4520 | 1808 | 4.5 x 2.0 x 2.2 | All Dielectric | 50V | 0.22nF - 4.7F (Various Dielectrics) |
| 4520 | 1808 | 4.5 x 2.0 x 2.2 | NPO, X7R | > 50V (High Voltage) | 2.0F - 4.7F (NPO), 0.22F - 2.2F (X7R) |
| 4532 | 1812 | 4.5 x 3.2 x 3.5 | All Dielectric | 50V | 0.47nF - 100F (Various Dielectrics) |
| 4532 | 1812 | 4.5 x 3.2 x 3.5 | NPO, X7R | > 50V (High Voltage) | 3.0F - 10F (NPO), 0.27F - 0.56F (X7R) |
| 5750 | 2220 | 5.7 x 5.0 x 3.5 | All Dielectric | 50V | 5.0F - 27F (NPO), 22nF - 2.2F (X7R) |
| 5750 | 2220 | 5.7 x 5.0 x 3.5 | NPO, X7R | > 50V (High Voltage) | 5.0F - 27F (NPO), 22nF - 2.2F (X7R) |
| 5763 | 2225 | 5.7 x 6.3 x 6.2 | All Dielectric | 50V | 5.0F - 27F (NPO), 2.2nF - 1.5F (X7R) |
| 5763 | 2225 | 5.7 x 6.3 x 6.2 | NPO, X7R | > 50V (High Voltage) | 5.0F - 27F (NPO), 2.2nF - 1.5F (X7R) |
Reliability and Testing
The product undergoes various reliability tests including capacitance, dissipation factor (DF), insulation resistance (IR), dielectric withstanding voltage (DWV), solderability, resistance to soldering heat, flexure strength, termination adhesion, temperature cycling, humidity load, and life testing. Specific test methods and criteria are detailed in the document.
Storage and Handling
Storage Conditions: Temperature 5~40, Relative Humidity 20~70%. Guaranteed solderability period is 12 months under delivered package conditions.
Precautions for Use: MLCCs may fail in short or open circuit modes. Avoid operating beyond specified ratings. Follow recommended soldering profiles and techniques to prevent chip cracking, burning, or explosion. Ensure optimal solder amount and use appropriate soldering methods (Reflow, Wave, or Manual) with careful temperature control.
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