Multilayer Ceramic Capacitor FH 0805B102K101NT with Monolithic Structure and Excellent Solderability
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Product Description
Product Overview
GENERAL MLCCs are multilayer ceramic capacitors featuring a monolithic structure for high reliability. They offer excellent solderability for reflow and wave soldering applications. These capacitors are available in Class I (COG, COH) and Class II (X7R, X7S, X7T, X6S, X6T, X5R) dielectric materials, catering to diverse circuit needs from stable high-frequency applications to general-purpose filtering, coupling, bypassing, and frequency discrimination. They adhere to GB/T 21041-2007 and GB/T 21042-2007 standards.
Product Attributes
- Brand: GENERAL MLCC
- Dielectric Materials: COG, COH, X7R, X7S, X7T, X6S, X6T, X5R
- Terminal Material: Pure Copper, Three-layer Plating
- Packaging: Bulk, Tape & Reel
Technical Specifications
| Feature | Description |
|---|---|
| Structure | Monolithic multilayer structure |
| Solderability | Excellent, suitable for reflow and wave soldering |
| Class I Dielectrics (COG, COH) | Highly stable with temperature, voltage, and time. Suitable for low-loss, high-stability high-frequency circuits. |
| Class II Dielectrics (X7R, X7S, X7T, X6S, X6T, X5R) | High dielectric constant, higher capacitance than Class I. Stable temperature characteristics. Suitable for general-purpose circuits like DC blocking, coupling, bypassing, and frequency discrimination. |
| Standards | GB/T 21041-2007, GB/T 21042-2007 |
| Applications | Filtering, coupling, resonance, bypassing, high-frequency electronic circuits. |
| Model Representation | Size, Dielectric Type, Capacitance, Capacitance Tolerance, Rated Voltage, Terminal Material, Packaging Type |
| Product Structure Components | 1. Ceramic Dielectric, 2. Inner Electrode, 3. Outer Electrode, 4. Nickel Layer, 5. Tin Layer |
| Temperature Coefficient/Characteristics (Example: COG) | Reference Temp: 20C, Nominal Temp Coefficient: 0 30 ppm/C, Operating Temp Range: -55C to 125C |
| Temperature Coefficient/Characteristics (Example: X7R) | Reference Temp: 20C, Nominal Temp Coefficient: 15%, Operating Temp Range: -55C to 125C |
| Size (Imperial/Metric) | 1005 (0402), 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532) |
| Capacitance Range & Voltage (Example: C0G, 1005 size) | 0.1pF (10V, 16V, 25V, 50V), 0.2pF (10V, 16V, 25V, 50V), ... 100pF (25V, 50V), ... 1nF (25V, 50V) |
| Capacitance Range & Voltage (Example: X7R, 0201 size) | 120pF (6.3V, 10V, 16V, 25V, 50V), 180pF (6.3V, 10V, 16V, 25V, 50V), ... 1F (6.3V, 10V, 16V, 25V, 50V) |
| Reliability Test: Capacitance | Specified Tolerance Level |
| Reliability Test: Insulation Resistance (IR) (Class I) | C10 nF, Ri50000M; C10 nF, RiCR500S (Test Voltage: Rated Voltage) |
| Reliability Test: Dissipation Factor (DF, tan) (Class I) | 1/(400+20C) (Test Frequency: 1MHz10% for C |
| Reliability Test: Dielectric Withstanding Voltage (DWV) | No dielectric breakdown or damage. (Test Voltage: Class I: 300% rated voltage, Class II: 250% rated voltage) |
| Reliability Test: Soldering Heat Resistance | C/C 2.5% or 0.25pF (whichever is larger); DF same as initial; IR same as initial; Appearance: No visible damage. |
| Reliability Test: Bending Strength | C/C: Class I: 5% or 0.5pF (whichever is larger); Class II: 10% |
| Reliability Test: Terminal Strength | No visible damage. Applied force T: 0402: 2N, 0603: 5N |
| Reliability Test: Temperature Cycling | C/C: Class I: 1% or 1pF (whichever is larger); Class II: -15% ~+15% |
| Reliability Test: Damp Heat Load | C/C: Class I: 7.5% or 0.75pF (whichever is larger); Class II: 12.5%; DF 2x initial; IR: Class I Ri5000M or RiCR50S; Class II Ri1000M or RiCR10S |
| Reliability Test: Life Test | C/C: Class I: 3% or 0.3pF (whichever is larger); Class II: -20% ~ +20%; DF 2x initial; IR: Class I Ri4000M or RiCR40S; Class II Ri2000M or RiCR50S |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70% |
| Shelf Life | 12 months (for good solderability when properly packaged and delivered) |
| Recommended Soldering Method | Reflow Soldering (R), Wave Soldering (W) |
| Recommended Reflow Soldering Peak Temp (Pb-Sn) | 230250 |
| Recommended Reflow Soldering Peak Temp (Lead-free) | 240260 |
| Recommended Wave Soldering Peak Temp (Pb-Sn) | 230260 |
| Recommended Wave Soldering Peak Temp (Lead-free) | 240270 |
Note: All specifications are subject to change without notice. Please refer to the latest version.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina