High Voltage Multi layer Ceramic Capacitors FH 0603CG200J500NT Suitable for Analog and Digital Modems
Product Overview
The High-Voltage Multi-layer Ceramic Capacitors (MLCC) are designed for surface-mount applications, offering excellent high-voltage reliability. Built upon advanced MLCC technology, these components are ideal for various DC high-voltage circuits, contributing to improved electronic circuit performance. They feature a monolithic structure of laminated layers for high reliability, superior soldering and resistance to soldering capabilities suitable for reflow and peak soldering, and high, stable capacitance. These capacitors adhere to GB/T 21041-2007 and GB/T 21042-2007 standards.
Key Applications: Analog & Digital Modems, LAN/WAN Interface, Lighting Ballast Circuits, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
Product Attributes
- Manufacturer: FENGHUA (implied from context)
- Dielectric Materials: C0G (Class I), X7R (Class II)
- Termination Styles: Nickel Barrier Termination (N), MLCC with Flexible Solderable Termination (A)
- Package Styles: Braided 7 inch disc packing (T), Braided 13 inch disc packing (D)
Technical Specifications
| Feature | Description |
|---|---|
| Product Name | High-Voltage Multi-layer Ceramic Capacitors |
| Series | High Voltage Series Of Ceramic Chip Capacitors |
| Available Sizes (EIA) | 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2220, 2225 |
| Temperature Coefficient/Characteristics | C0G: 030ppm/ (-55125) X7R: 15% (-55125) |
| Capacitance Range & Voltage | Refer to detailed tables for C0G and X7R dielectrics across various sizes and voltage ratings (e.g., 0.5pF to 10F, 100V to 5000V). |
| Dielectric Withstanding Voltage Test Method | Varies based on rated voltage (Vr): 100V (250% Vr, 5s), 100V<Vr<500V (200% Vr, 5s), 500VVr1000V (150% Vr, 5s), 1000V<Vr2000V (120% Vr, 5s), 2000V<Vr5000V (120% Vr, 5s, max 10mA). Max current generally 50mA, reduced to 10mA for 2000V-5000V. |
| Reliability Tests | Includes Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Solderability, Resistance to Soldering Heat, Resistance to Flexure, Temperature Cycle, Termination Adhesion, Humidity Load, and Life Test. Specific parameters and test conditions are detailed in the document. |
| Packaging | Paper Taping (7" & 13" reels), Embossed Taping (7" & 13" reels). Specific dimensions and quantities vary by size and type. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20~70%. Guaranteed solderability period: 12 months. |
| Soldering Recommendations | Reflow soldering, Wave soldering, Manual soldering. Recommended temperature profiles and conditions are provided. Temperature difference between soldering and chip surface should be 150 during preheating. |
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