frequency stability quartz crystal CHANGXING ELECTRONICS 8DSC270G0020L designed for DSC and PDA devices

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Product Description

Product Overview

The Seam3225 is a high-precision Quartz Crystal Resonator designed for demanding applications in wireless communication. It offers high frequency stability and is particularly effective in reducing EMI effects, making it an ideal choice for Bluetooth devices, wireless communication sets, DSCs, PDAs, and mobile phones. This product is RoHS Compliant and Pb Free.

Product Attributes

Brand: CHANGXING ELECTRONICS CO.,LTD.
Product Series: 8D Series
Sealing Type: Seam Sealing
Compliance: RoHS Compliant / Pb Free
Crystal Cutting Type: AT CUT (thickness shear mode)

Technical Specifications

Parameter	Model/Value	Units	Notes
Nominal Frequency	27.000000	MHz	Fund
Frequency Tolerance (at 25 3 )	10	ppm
Load Capacitance	20	pF
Operating Temperature Range	-40+85
Storage Temperature Range	-55+125
Aging (1st Year)	3	ppm
Frequency Tolerance (Over Operating Temp. Range)	30	ppm
Shunt Capacitance C0	5	Max.	pF
Motional Capacitance C1	-
Effective Resistance Rr	40	Max.
Pulling Sensitivity TS	-		ppm/pF
Drive Level	100	Max.	uW
Insulation Resistance	500	Min.	M
Spurious Response	-3.0	Max.	dB
Dimensions (L x W x H)	3.20 x 2.50 x 0.70	mm	(Approximate based on visual representation)
Reel Quantity	3,000	pcs per reel	(WHITE)

Packing

EIA-481-2 Standard Reel Quantity: 3,000 pcs per reel (WHITE).

Material Composition Declaration

Part Name	Material Name	Material Mass (mg)	Material Mass (%)	Constituent Name	CAS No.	Material Analysis (%)
Base	Ceramics	23.09	23.09%	Al2O3	1344-28-1	92.40%
				SiO2	7631-86-9	4.31%
				Cr2o3	1308-38-9	1.50%
				MgO	1309-48-4	0.69%
				CaO	1305-78-8	1.10%
Electrode	Metal	20.91	20.91%	Fe	7439-89-6	40.70%
				Ni	7440-02-0	21.80%
				Co	7440-48-4	12.80%
				Ag	7440-22-4	21.00%
				Cu	7440-50-8	3.70%
Metallizing (Metal)		6.40	6.40%	W	7440-33-7	62.50%
				Au	7440-57-5	4.61%
				Ni	7440-02-0	32.89%
Cover		15.01	15.01%	Ni	7440-02-0	47.71%
				Co	7440-48-4	15.44%
Adhesive	Polymer	3.62	3.62%	Ni	7440-02-0	26.11%
				Ni (Plating)	7440-02-0	10.74%
Solder	Metal	36.95	36.95%	Ag	7440-22-4	75.00%
				Crystalline Silicon Dioxide		5.00%
				Petroleum Solvent		5.00%
				Silicone Resin		15.00%
Wafer	Quartz	0.45	2.60%	SiO2	14808-60-7	100.00%
Metallizing		0.20	1.15%	Cr	7440-47-3	5.56%
				Ag	7440-22-4	94.44%
4J29 (Base Material)		20.91	20.91%
Plating (KV Ring)		0.05	0.29%