Lightweight Low Profile Component Chilisin BTLB001109KXVHBA10 Designed for Modern Electronic Devices
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The BTLB001109KXVHBA10 is a miniaturized SMD component designed for high-frequency and space-limited applications. It features a compact, low-profile, and lightweight design, making it ideal for modern electronic devices. This component offers low insertion loss and high attenuation, effectively eliminating noise across a wide frequency range. Its high soldering heat resistance ensures compatibility with both flow and re-flow soldering methods. The product is available in tape and reel packaging for efficient automatic mounting.
Product Attributes
- Brand: Chilisin
- Certifications: RoHS & Halogen Free & REACH Compliance
- Packaging: Tape and reel for automatic mounting
Technical Specifications
| Part No. | Pass Band | Insertion Loss (at 25) | Insertion Loss (at 105) | Return Loss | Attenuation (50~960 MHz) | Attenuation (1560~1606 MHz) | Attenuation (1710~1990 MHz) | Attenuation (3600 MHz) | Attenuation (4800~5000 MHz) | Attenuation (7200~7500 MHz) | Operating Temperature Range | Power Capacity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BTLB001109KXVHBA10 | 2400~2500 MHz | 1 dB max. | 1.2 dB max. | 15 dB min. | 20 dB min. | 30 dB min. | 15 dB min. | 10 dB min. | 35 dB min. | 25 dB min. | -40~105C | 3W max. |
Dimensions
| Designation | L | W | T | a | b | c | d | e | f |
|---|---|---|---|---|---|---|---|---|---|
| Dimensions (mm) | 1.100.10 | 0.900.10 | 0.60 max. | 0.250.05 | 0.180.05 | 0.250.05 | 0.750.05 | 0.950.05 | 0.3850.05 |
Mechanical & Environmental Tests
| Test Item | Test Condition | Specification |
|---|---|---|
| Vibration | 10 Hz/min~55 Hz/min~10 Hz/min vibration frequency with 1.5 mm amplitude for two hours in x, y, z directions | No apparent damage |
| Drop shock | Dropped onto printed circuit board from 100cm height three times in x, y, z directions. The terminals shall be protected. | No apparent damage |
| Soldering heat resistance | Preheating: 15010 (1-2 min). Solder bath: 2605 (101 sec). | Loss of metallization on the edges of each electrode shall not exceed 25%. |
| Bending test onto printed circuit board | Apply load until bending reaches 2 mm (60 sec holding time). | No apparent damage |
| Solderability | Solder bath: 2455. Immersion time: 31 seconds. Solder: Sn3Ag0.5Cu. | At least 95% of a surface of each terminal electrode must be covered by fresh solder. |
| Adhesive strength | Standard for 1109~2016 size | >0.5KgF |
| Thermal shock | -40~105 for 100 cycles (30 min each cycle). | No apparent damage. Fulfill electrical spec. after test. |
| Humidity resistance | 1052, 80~90% R.H. for 1000 hours. | No apparent damage. Fulfill electrical spec. after test. |
| High temperature resistance | 1052 for 1000 hours. | No apparent damage. Fulfill electrical spec. after test. |
| Low temperature resistance | -403 for 1000 hours. | No apparent damage. Fulfill electrical spec. after test. |
Taping Specifications
| SERIES | PCS/Reel | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) |
|---|---|---|---|---|---|---|---|
| 1109 | 10000 | 1780.3 | 600.2 | 19.30.1 | 13.50.1 | 13.60.1 | - |
Temperature Profile
| Parameter | Sn-Pb | Pb-Free |
|---|---|---|
| Preheat Tsmin | 100 | 150 |
| Preheat Tsmax | 150 | 200 |
| Average ramp-up rate (Tsmax to TP) | 3/second max. | 3/second max. |
| Time main above Temperature (TL) | 183 (60~150 seconds) | 217 (60~150 seconds) |
| Peak temperature (TP) | 230 | 250~260 |
| Time within 5 of actual peak temperature (tP) | 10 seconds | 10 seconds |
| Ramp-down rate | 6/sec max. | 6/sec max. |
| Time 25 to peak temperature | 6 minutes max. | 8 minutes max. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina