electronic components Cybermax CMLO252010T2R2MTT SMD power inductors with epoxy shield protection

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Product Description

Product Overview

The CMLO252010T Series is a range of SMD power inductors designed for various electronic applications. These lead-free components offer reliable performance and are available in multiple inductance values and tolerances.

Product Attributes

Brand: Cybermax
Series: CMLO252010T
Material: Body: Alloy material, Winding: Enamelled Wire, Shield: Epoxy, Electric Base: plating-Cu, plating-Ni, plating-Sn
Certifications: Lead Free

Technical Specifications

Part No.	Inductance Ls(uH)	Direct Current Resistance DCR(m) Max	Saturation Current Isat(A) Max	Temperature Rise Current Irms(A) Max
CMLO252010TR33MTT	0.3320%	19.0	7.20	6.20
CMLO252010TR47MTT	0.4720%	22.0	6.50	5.60
CMLO252010TR68MTT	0.6820%	27.0	5.50	5.00
CMLO252010T1R0MTT	1.020%	30.0	4.80	4.10
CMLO252010T1R5MTT	1.520%	55.0	3.90	3.00
CMLO252010T2R2MTT	2.220%	70.0	3.00	2.10
CMLO252010T3R3MTT	3.320%	100.0	2.50	2.10
CMLO252010T4R7MTT	4.720%	180.0	2.00	1.60

Dimensions

Series	L(mm)	W(mm)	H(mm)	F(mm)	Recommended Land Patterns A(mm)	B(mm)	E(mm)
CMLO252010T	2.50.2	2.00.2	1.0Max.	0.9Typ.	1.0Typ.	2.8Typ.	2.1Typ.

Test Conditions & Equipment

Item	Test condition	Test equipment
Ls	1MHz/1V	HP4263BIM3532-50 or equivalent
DCR	direct-current	HP4263BRM3545 or equivalent
Isat	1MH/1V	Microtest 6379 &6220 or equivalent
Irms	ambient temperature 20	Microtest 6379 &6220 or equivalent

Operating Conditions

Parameter	Condition
Operating Temperature Range	-40+125, Including self-heating
Storage Conditions	Temperature: Inductors (product with taping) -10 to +40; Inductors body -40 to +85. Humidity: 30~70%RH

Recommended Reflow Profile

Stage	Temperature ()	Time (s)
Preheating (T1)	150	t1 (60 to 120s)
Soldering (T2)	180	t2 (30 to 50s)
Peak (T3)	250 to 260	t3 (10s max)

Reliability

No.	Items	Requirements	Test Methods and Remarks
1	Insulation Resistance	100M	100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds.
2	Solderability	90% or more of electrode area shall be coated by new solder.	Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at (2455) for (51) seconds.
3	Resistance to Soldering Heat	No visible mechanical damage. Inductance change: Within 10%	Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at (2605) for (101) seconds.
4	Adhesion of terminal electrode	Strong bond between the pad and the core, without come off.	Inductors shall be subjected to (2605) for (205) s Soldering in the base with 0.3mm solder. Then apply 10 N perpendicular to the electrode surface for (101) seconds.
5	High temperature	No visible mechanical damage. Inductance change: Within 10%	Temperature (+85 2), time (962) h.
6	Low temperature	No visible mechanical damage. Inductance change: Within 10%	Temperature (-402), time (962)h.
7	Thermal shock	No visible mechanical damage. Inductance change: Within 10%	(-403), time (303) min (1252) /(303) min, conversion time (2~3) min, cycle 32 times. Tested after 2 hours at room temperature, within 48 hours.
8	Temperature characteristic	Inductance change Pc-b, Pc-d: Within 20%	a: +20 (30~45)min b: -40 (30~45)min c: +20 (30~45)min d: +125 (30~45)min e: +20 (30~45)min
9	Static Humidity	No visible mechanical damage. Inductance change: Within 10%	Store in environment of (933)%RH, temperature (402) for (10002)h. Tested after 2 hours at room temperature, within 48 hours.
10	Life (Durability)	No visible mechanical damage. Inductance change: Within 10%	Store at (852) for (100024) hours with Irms applied. Tested after 2 hours at room temperature, within 48 hours.