33.333 MHz frequency oscillator HELE SSW033333I3CHE-T optimized for electronic component integration

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Product Description

Harmony Electronics HSO321S Oscillator

The Harmony Electronics HSO321S is a high-quality oscillator designed for various electronic applications. It offers precise frequency output and reliable performance, making it suitable for integration into a wide range of products. This specification document outlines the key electrical, mechanical, and environmental characteristics of the HSO321S, ensuring its compatibility and optimal use in demanding environments.

Product Attributes

Brand: HARMONY ELECTRONICS CORP.
Model: HSO321S
Type: Oscillator
Country of Origin: TAIWAN
Manufacturing Date: 2016/01/05
Specification Number: SSW033333I3CHE-T
Revision: 0

Technical Specifications

Item	Symbol	Value	Unit	Condition	Min	Typ	Max	Notes
1. Type
Type Name		HSO321S
2. Output Frequency
Output Frequency		33.333000	MHz
3. Absolute Maximum Ratings
Vdd terminal voltage	Vdd	-0.5 to 4.0	V
Input terminal voltage	Vcont	-0.5 to Vdd+0.5	V
Output terminal voltage	Vout	-0.5 to Vdd+0.5	V
Output terminal current	Iout		mA			15
Storage temp. range	Tstr	-55 to 125	deg.C
4. Electric Specifications
Frequency Stability	f/F	-50 to +50	ppm	3.3+/- 0.3V, -40~85				Inclusive of 25 Tolerance, operating temperature range, input voltage change, Load change, first of aging, shock and vibration.
Operating temp. range	Topr	-40 to +85				25
Supply voltage	Vdd	3.0 to 3.6	V			3.3
Current consumption 1	Idd1		mA	Pin #1: open or "H", 3.3V 25+/-3			10	Fig1,2
Current consumption 2	Idd2		mA	Pin #1: "L" level, 3.3V 25+/-3		0.01		Fig1,2
Symmetry Duty		40 to 60	%	CL =15pF		50
Low level output voltage	Vol		V	CL =15pF			0.1xVdd
High level output voltage	Voh		V	CL =15pF	0.9xVdd
Rise & Fall time	Tr & Tf		ns	CL =15pF			7
Low level input current	Iil		uA	3.3V 25+/-3			10	Fig3
High Level input current	Iih		uA	3.3V 25+/-3			10	Fig3
Low level input voltage	Vil		V				Vddx0.3
High level input voltage	Vih		V		Vddx0.7
Output disable time	Tplz		nsec				150
Output enable time	Tpzl		msec				10
Aging		-3 to +3	ppm/year
Start-up time			ms			10
5. Dimensions
Length		24.0	mm	Max.
Width		3.2 +/- 0.2	mm
Height		2.5 +/- 0.2	mm
Pin Connections		1: Output, 2: GND, 3: OE (Output Enable), 4: Vdd		TOP VIEW
6. Inside Structure
Base Material		Alumina Ceramic (Al2O3)
Metalized Pad		W Ni Plating, Au Plating
IC		IC (Si. Al.)
Bonding Wire		Au
Crystal Blank		Rectangular At-Cut Quartz Crystal Blank
LID		Fe+Ni+Co
Adhesive		Silver Conductive Silicon Resin
Electrode								The use prohibition chemistry substance of Table 1 of DHE-0204-1 (HE-QA-24) is not included.
7. Mechanical Performance
Natural Drop		Drop 3 times from 50cm onto min. 30mm thickness hard wooden board.		JIS C 60068-2-6 A
Vibration		10-55Hz, Sine Wave, 0.8mm amplitude to X, Y, Z axes, 2 hours per axis.		MIL-HDBK-781A 6.5.2/ JIS C 60068-2-6 A
Sealing Tightness (Fine Leakage)		Leak Rate 1.0x10^-8 Pa-m³/sec. Max. (Helium leak detector)
Sealing Tightness (Coarse Leakage)		No gas bubble observed after dipping in FC-40 at +125 +/-5deg.C for 5 minutes.
Solder ability		Dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec after applying ROSIN Flux.		JIS C 60068-2-20 B
8. Environment Performance
Humidity		60+/-2, RH 90~95%, 240 hours.		JIS C 60068-2-3 A				Component checked after returning to room temperature.
Storage in Low Temperature		-40deg.C +/-2deg.C, 240 hours.		JIS C 60068-2-1 A				Component checked after returning to room temperature.
Storage in High Temperature		+85deg.C +/-2deg.C, 240 hours.		JIS C 60068-2-2 A				Component checked after returning to room temperature.
Temperature cycles		-30deg.C +/-2deg.C (30min) +80deg.C +/-2deg.C (30min), 25 cycles. Temp. increasing/reducing time within 3 minutes.		JIS C 0025 A				Component checked after returning to room temperature.
High Temperature Operation		+85deg.C +/-2deg.C, +3.3V Vdd, 240 hours.		JIS C 60068-2-2 A				Component checked after returning to room temperature. Specifications A: Frequency variation within +/-5ppm, equivalent resistance within spec. B: More than 90% of lead covered by new solder.
9. Supplement
Reflow Condition		Proposed reflow condition, max 2 soldering times.
Solder Iron		Bit temp.: 350deg.C Max., Time: 3sec Max., Each terminal solder 1 time Max.
Mounting		Designed for automatic insertion. Trial with insertion machine recommended. Avoid mounting by Ultrasonic welding.
Cleaning		Do not use cleaning liquid that corrodes Nickel. Ultrasonic cleaning possible, check on your board.
Handling		Pay attention to static-electricity. Crystal blank may break if excess force is applied.
By-pass Capacitor		No integrated by-pass capacitor. Recommend using 0.01F ceramic chip capacitor between Vdd and GND.
Storage		Keep away from high temperature, high humidity, direct sunlight, and dew.
10. Taping and Packing
Emboss Tape Specifications		Refer to detailed drawings.
Reel Specifications		Flange Diameter: 180+/-3mm, Inner Width: 9.3+/-0.3mm, Outer Width: 11.3+/-1.0mm, Hub Out Line diameter: 60.5+/-0.5mm.		Table-2 (UNIT: mm)
Storage (Taping)		Temperature +40deg.C Max., Humidity 80% Max.
Quantity on Reel		3,000 PCS/REEL
11. Flow Chart
Manufacturing Process		Incoming Inspection, Etching, Freq. Sorting, Washing, Plating, Assembly, Curing, Adjustment, Annealing, Sealing, Aging, Marking, Packing, Inspection.						Includes various checks like Middle Check, Final Check, DLD Check, Temp. Characteristics Check, Leak Checks.
12. Environmental Workload Chemical Substance Components List
Chemical Substance	Percentage	mg	ppm					For D(H)SO321S
WOLFRAM AND ITS COMPOUND(W)	0.21168	25.2	53.3434
COBALT AND ITS COMPOUND(Co)	0.96900		244.1880
CHROMIUM AND ITS COMPOUND(Cr)	0.07308		18.4162
SILVER(Ag)	0.15876		40.0075
COPPER(Cu)	0.07812		19.6862
NICKEL AND ITS COMPOUND(Ni)	2.26044		569.6309
MANGANESE AND ITS COMPOUND(Mn)	0.02016		5.0803
MOLYBDENUM AND ITS COMPOUND(Mo)	0.12348		31.1170
SILICON AND ITS COMPOUND(Si)	0.28476		71.7595
ALUMINIUM AND ITS COMPOUND(Al)	7.96320		2006.7264
GOLD(Au)	0.15372		38.7374
IRON(Fe)	3.37176		849.6835