Chip capacitor HenryTech HLCC10050G featuring TiW Pt Au plating for bonding process and conductive adhesive baking
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The HLCC10050G is a chip capacitor designed for bonding processes. It is suitable for applications requiring conductive adhesive H20E and a baking process at 120 for 30 minutes. The capacitor features a specific plating for its upper and lower layers, with a recommendation for welding wire placement to prevent electrode detachment.
Product Attributes
- Brand: HenryTech
- Origin: Chengdu City, China
Technical Specifications
| Product Name | Part Number | Capacitance (pF) @1kHz,1Vrms,25, No DC Bias | Max Voltage (VDC) | Operating Temperature () | Type | Upper Layer Coating | Lower Layer Coating |
|---|---|---|---|---|---|---|---|
| Chip Capacitor | HLCC10050G | 10020% | 50 | -55 to +125 | Single sided, bottom edge | TiW-Pt-Au 0.5m Min | TiW-Au 4.0m Min |
Notes:
- Storage conditions: Temperature 20-25, Humidity 40%-60%.
- Suitable for bonding process with conductive adhesive H20E, baked at 120 for 30 minutes.
- The welding position of the welding wire should be 25m or further away from the electrode edge to avoid electrode detachment.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina