Chip Ferrite Bead INPAQ MCB1005B601FBP for Noise Suppression in High Frequency Electronic Components
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The INPAQ Global RF/Component Solutions MCB B Series is a Chip Ferrite Bead designed for RF and component applications. These components are engineered to suppress common-mode noise and EMI in high-frequency circuits. The MCB 1005 B Series offers a compact EIAJ 1005 (0402) size, making it suitable for space-constrained designs. Key applications include signal line noise filtering and power line noise suppression in various electronic devices.
Product Attributes
- Brand: INPAQ Global RF/Component Solutions
- Series: MCB B Series
- Size Code: EIAJ 1005 (0402)
- Soldering Type: Lead-Free (A - Soldering Lead-Free, B - Lead-Free for whole chip)
- Packaging: Embossed paper tape, 7" reel (P)
- Operating Temperature Range: -55 to +125
- Storage Condition: Less than 40 and 70% RH
- Storage Time: 6 months Max.
- Soldering Method: Reflow or Wave Soldering
Technical Specifications
| Part Number | Impedance () 25% | Test Frequency (MHz) | DCR () Max. | Rated Current (mA) | Dimensions (mm) L x W x T | End Terminals (mm) E |
|---|---|---|---|---|---|---|
| MCB1005B601FB | 600 | 100 | 0.60 | 300 | 1.00 0.10 x 0.50 0.10 x 0.50 0.10 | 0.25 0.10 |
| MCB1005B102EB | 1000 | 100 | 1.00 | 200 | ||
| MCB1005B152DB | 1500 | 100 | 1.50 | 150 | ||
| Note: For special part numbers not listed, refer to appendix. | ||||||
Packaging & Reel Specifications
| Part Size (EIA Size) | Reel Type | Quantity (pcs) |
|---|---|---|
| 1005 (0402) | 7" Reel | 10,000 |
Taping Dimensions (Unit: mm)
| Size | W | P | E | F | D | Po | P2 | Ao | Bo | Ko(T) |
|---|---|---|---|---|---|---|---|---|---|---|
| 1005 | 8.000.10 | 2.000.05 | 1.750.05 | 3.500.05 | 1.550.05 | 4.000.10 | 2.000.05 | 0.620.03 | 1.120.03 | 0.600.03 |
Solder Land Information (Unit: mm)
| Size | A | B | C |
|---|---|---|---|
| 1005 | 0.4 0.6 | 1.6 2.6 | 0.4 0.7 |
Reliability and Test Conditions
| Test Item | Test Condition | Criteria |
|---|---|---|
| Temperature Cycle | a. Temp: -40 ~ +85 b. Cycle: 100 cycles c. Dwell time: 30 minutes | a. No mechanical damage b. Impedance value within 20 % of initial value |
| Operational Life | a. Temp: 125 5 b. Test time: 1000 hrs c. Apply current: full rated current | a. No mechanical damage b. Impedance value within 20 % of initial value |
| Biased Humidity | a. Temp: 40 2 b. Humidity: 90 ~ 95 % RH c. Test time: 1000 hrs d. Apply current: full rated current | a. No mechanical damage b. Impedance value within 20 % of initial value |
| Resistance to Solder Heat | a. Solder temp: 260 5 b. Flux: Rosin c. DIP time: 10 1 sec | a. >95% terminal electrode covered with new solder b. No mechanical damage c. Impedance value within 20 % of initial value |
| Adhesive Test | a. Reflow temp: 245 b. Apply force (F): 5 N c. Test time: 10 sec | a. No mechanical damage b. Soldering the products on PCB after pulling test force > 5 N |
| Steam Aging Test | a. Temp: 93 b. Test time: 4 hrs c. Solder temp: 235 5 d. Flux: Rosin e. DIP time: 5 1 sec | >95% terminal electrode covered with new solder |
| Rated Current Test | a. Apply current: full rated current / 5min | Temperature rise should be less than 25 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina