Unshielded SMD Power Inductors LanTu Micro SCD3521-101MT Silver Plated Surface Mount Components
Product Overview
The SCD3521 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are unshielded SMD power inductors designed for surface mounting. These low-cost, silver-plated inductors offer a small size with high rated current and low DC resistance. They are suitable for a wide range of applications including power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. The series complies with RoHS, Halogen Free, and REACH standards, operating in an environmental temperature range of -40 to +125.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Unshielded SMD Power Inductors
- Series: SCD3521
- Design: Silver plated type, Low cost design
- Shielding: Unshielded
- Mounting: Suitable for surface mounting equipment
- Compliance: RoHS, Halogen Free and REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Freq @ 0A | SRF Typ (MHz) | DCR Typ () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|
| SCD3521-1R0M | 1.0 | M (20%) | 100KHz | 120 | 0.045 | 3.30 | 2.20 | 3.52.1 |
| SCD3521-1R2M | 1.2 | M (20%) | 100KHz | 100 | 0.050 | 3.00 | 2.10 | 3.52.1 |
| SCD3521-1R5M | 1.5 | M (20%) | 100KHz | 85 | 0.055 | 2.70 | 1.70 | 3.52.1 |
| SCD3521-1R8M | 1.8 | M (20%) | 100KHz | 75 | 0.070 | 2.50 | 1.65 | 3.52.1 |
| SCD3521-2R2M | 2.2 | M (20%) | 100KHz | 62 | 0.085 | 2.30 | 1.60 | 3.52.1 |
| SCD3521-2R7M | 2.7 | M (20%) | 100KHz | 53 | 0.100 | 2.20 | 1.40 | 3.52.1 |
| SCD3521-3R3M | 3.3 | M (20%) | 100KHz | 47 | 0.120 | 1.95 | 1.04 | 3.52.1 |
| SCD3521-3R9M | 3.9 | M (20%) | 100KHz | 41 | 0.125 | 1.85 | 1.00 | 3.52.1 |
| SCD3521-4R7M | 4.7 | M (20%) | 100KHz | 38 | 0.135 | 1.60 | 1.00 | 3.52.1 |
| SCD3521-5R6M | 5.6 | M (20%) | 100KHz | 33 | 0.145 | 1.55 | 0.95 | 3.52.1 |
| SCD3521-6R8M | 6.8 | M (20%) | 100KHz | 31 | 0.200 | 1.40 | 0.95 | 3.52.1 |
| SCD3521-8R2M | 8.2 | M (20%) | 100KHz | 27 | 0.250 | 1.20 | 0.92 | 3.52.1 |
| SCD3521-100M | 10 | M (20%) | 100KHz | 23 | 0.320 | 1.05 | 0.90 | 3.52.1 |
| SCD3521-120M | 12 | M (20%) | 100KHz | 21 | 0.350 | 1.00 | 0.85 | 3.52.1 |
| SCD3521-150M | 15 | M (20%) | 100KHz | 19 | 0.460 | 0.90 | 0.75 | 3.52.1 |
| SCD3521-180M | 18 | M (20%) | 100KHz | 17 | 0.520 | 0.80 | 0.70 | 3.52.1 |
| SCD3521-220M | 22 | M (20%) | 100KHz | 15 | 0.650 | 0.75 | 0.60 | 3.52.1 |
| SCD3521-270M | 27 | M (20%) | 100KHz | 14 | 0.750 | 0.70 | 0.55 | 3.52.1 |
| SCD3521-330M | 33 | M (20%) | 100KHz | 12 | 0.920 | 0.60 | 0.50 | 3.52.1 |
| SCD3521-390M | 39 | M (20%) | 100KHz | 11 | 1.120 | 0.55 | 0.48 | 3.52.1 |
| SCD3521-470M | 47 | M (20%) | 100KHz | 10 | 1.270 | 0.50 | 0.45 | 3.52.1 |
| SCD3521-560M | 56 | M (20%) | 100KHz | 9.3 | 1.500 | 0.45 | 0.30 | 3.52.1 |
| SCD3521-680M | 68 | M (20%) | 100KHz | 8.4 | 2.000 | 0.40 | 0.26 | 3.52.1 |
| SCD3521-820M | 82 | M (20%) | 100KHz | 7.5 | 2.150 | 0.35 | 0.23 | 3.52.1 |
| SCD3521-101M | 100 | M (20%) | 100KHz | 6.8 | 2.800 | 0.34 | 0.20 | 3.52.1 |
| SCD3521-121M | 120 | M (20%) | 100KHz | 6.2 | 3.400 | 0.33 | 0.18 | 3.52.1 |
| SCD3521-151M | 150 | M (20%) | 100KHz | 5.5 | 4.200 | 0.28 | 0.16 | 3.52.1 |
| SCD3521-181M | 180 | M (20%) | 100KHz | 5.0 | 4.500 | 0.27 | 0.15 | 3.52.1 |
| SCD3521-221M | 220 | M (20%) | 100KHz | 4.5 | 5.700 | 0.25 | 0.14 | 3.52.1 |
| SCD3521-271M | 270 | M (20%) | 100KHz | 4.0 | 8.500 | 0.22 | 0.10 | 3.52.1 |
| SCD3521-331M | 330 | M (20%) | 100KHz | 3.6 | 9.500 | 0.19 | 0.09 | 3.52.1 |
| Dimensions (mm): A: 3.50.3, B: 3.00.3, C: 2.10.3, D: 1.0, H: 3.5, I: 1.6, J: 0.8 | ||||||||
| Inductance Tolerance Options: J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | ||||||||
| Operating Temperature: -40 to +125 (Including coils self-temperature rise) | ||||||||
| Test Equipment: L: HP4284A or HP4285A LCR meter or equivalent; Isat & Irms: HP4284+42841A or equivalent; SRF: Agilent E4991A or equivalent; DCR: Chroma 16502 or equivalent. | ||||||||
| Saturation Current: DC current at which inductance drops 10% from its value without current. | ||||||||
| Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25). | ||||||||
| Rated DC Current: The lesser value of Isat or Irms. | ||||||||
| Note on Thermal Design: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. | ||||||||
Packaging Information
Packing Options: Bulk Package (B), Tape & Reel (T)
Tape and Reel Specifications:
- Tape Dimension (mm): W=12, P=8, W1=5.5
- Reel Dimensions (mm): A=12.4, B=100, C=13, D=330
- Packing Quantity: Reel (PCS): 3000, Inside Box (PCS): 12000, Outside Carton (PCS): 48,000
- Cover tape peel off condition: Peel force 10 to 120g, Peeling angle 165 to 180.
Reliability Testing
Terminal Strength: Tested according to GB/T 2423.60-2008 (SMT and DIP variants) with specified force and duration based on terminal cross-sectional area or diameter. Requirements include no loose terminals.
Resistance to Flexure: Tested according to JIS C 5321:1997. Requirements include no visible mechanical damage, with specific flexure (2mm) and speed (0.5mm/sec).
Dropping Test: Tested according to GB/T 2423.7-2018. Packaged products dropped from 1m height, 1 angle, 3 ridges, 6 surfaces, twice in each direction. Requirements include no case deformation or change in appearance, and no short/open circuits.
Solderability: Tested according to GB/T 2423.28-2005. Solder temperature 2402, duration 3 sec. Requirements include wetting exceeding 75% coverage and 95% minimum solder coverage on terminals.
Vibration Test: Tested according to GB/T 2423.10-2019. Subjected to simple harmonic motion (1.5mm amplitude, 10-55 Hz) for 2 hours in 3 perpendicular directions. Requirements include no visible mechanical damage, inductance change within 10%, and Q factor change within 20%.
Thermal Shock: Tested according to GB/T 2423.22-2012 (Method Na). 100 cycles of temperature transitions between high (85~125) and low (-55~40) temperatures. Requirements include no visible mechanical damage, inductance change within 10%, and Q factor change within 20%.
Low Temperature Storage: Tested according to GB/T 2423.1-2008 (Method Ab). Storage at -55~-402 for 962 hours. Requirements include no visible mechanical damage, inductance change within 10%, and Q factor change within 20%.
High Temperature Storage: Tested according to GB/T 2423.2-2008 (Method Bb). Storage at 125~852 for 962 hours. Requirements include no visible mechanical damage, inductance change within 10%, and Q factor change within 20%.
Damp Heat (Steady States): Tested according to GB/T 2423.3-2016. Storage at 602 and 90% to 95% RH for 962 hours. Requirements include no visible mechanical damage, inductance change within 10%, and Q factor change within 20%.
Heat Endurance of Reflow Soldering: Tested according to GJB 360B-2009. Subjected to reflow soldering twice, peak temperature 260+0/-5. Requirements include no significant defects in appearance, L/L 10%, Q/Q 30%, and DCR/DCR 10%.
Resistance to Solvent Test: Tested according to IEC 68-2-45:1993. Dipped in IPA solvent for 50.5 min, dried for 5 min, and brushed 10 times. Requirements include no case deformation or change in appearance.
Overload Test: Tested according to JIS C5311-6.13. Applied twice the rated current for 5 minutes. Requirements include no smoke, peculiar smell, or fire during the test, and normal characteristics after the test.
Voltage Resistance Test: Tested according to MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. Requirements include no breakdown during the test and normal characteristics after the test.
Recommended Reflow Soldering Curve
The recommended reflow conditions are provided as a guideline. Users should adjust and confirm conditions based on their specific equipment and process.
Usage Precautions
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH. Solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to grease, which can reduce solderability. Handle products carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not clean coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating can lead to short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Account for self-heating (temperature increase) when power is applied during thermal design.
- Layout: For non-magnetic shield types, careful PCB layout is required to prevent malfunctions due to magnetic interference.
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