Molding SMD Power Inductors LanTu Micro SMS1040-100MT Featuring Composite Structure and Performance
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Product Description
Molding SMD Power Inductors - SMS1040 Series
Product Overview
The SMS1040 Series by SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. offers ultra-high current SMD power inductors featuring a thin design with low DC resistance and ultra-high current capability. These magnetically shielded inductors provide strong anti-electromagnetic interference, making them suitable for high-density installations. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. Designed for high efficiency, they reduce winding DC resistance and core eddy-current loss, supporting frequencies up to 3MHz with an absolute maximum voltage of 30VDC. These inductors are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS1040
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company location)
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Environmental Data
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Technical Specifications
| Part No. | Inductance (H) | Inductance Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (A) Typical | Heat Rating Current (A) Typical | Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|
| SMS1040-R22M | 0.22 | 20% | 1.2 | 1.5 | 60.00 | 35.00 | 11.510.04.0 |
| SMS1040-R36M | 0.36 | 20% | 1.7 | 1.9 | 50.00 | 30.00 | 11.510.04.0 |
| SMS1040-R47M | 0.47 | 20% | 1.9 | 2.2 | 40.00 | 30.00 | 11.510.04.0 |
| SMS1040-R56M | 0.56 | 20% | 2.1 | 2.4 | 33.00 | 25.00 | 11.510.04.0 |
| SMS1040-R68M | 0.68 | 20% | 2.3 | 3.0 | 30.00 | 23.00 | 11.510.04.0 |
| SMS1040-1R0M | 1.0 | 20% | 3.0 | 4.0 | 28.00 | 18.00 | 11.510.04.0 |
| SMS1040-1R5M | 1.5 | 20% | 4.8 | 5.4 | 23.00 | 16.00 | 11.510.04.0 |
| SMS1040-2R2M | 2.2 | 20% | 7.2 | 9.0 | 18.00 | 12.00 | 11.510.04.0 |
| SMS1040-3R3M | 3.3 | 20% | 10.8 | 11.8 | 16.00 | 10.00 | 11.510.04.0 |
| SMS1040-4R7M | 4.7 | 20% | 17.0 | 20.0 | 15.00 | 8.50 | 11.510.04.0 |
| SMS1040-5R6M | 5.6 | 20% | 20.5 | 23.0 | 13.00 | 8.00 | 11.510.04.0 |
| SMS1040-6R8M | 6.8 | 20% | 22.5 | 25.0 | 12.00 | 7.00 | 11.510.04.0 |
| SMS1040-100M | 10 | 20% | 34.0 | 37.0 | 8.50 | 5.50 | 11.510.04.0 |
| SMS1040-150M | 15 | 20% | 50.0 | 55.0 | 7.00 | 5.00 | 11.510.04.0 |
| SMS1040-220M | 22 | 20% | 60.0 | 66.0 | 6.00 | 4.00 | 11.510.04.0 |
| SMS1040-330M | 33 | 20% | 85.0 | 92.0 | 5.00 | 3.50 | 11.510.04.0 |
| SMS1040-470M | 47 | 20% | 141.0 | 155.0 | 4.50 | 3.00 | 11.510.04.0 |
| SMS1040-680M | 68 | 20% | 200.0 | 220.0 | 3.80 | 2.30 | 11.510.04.0 |
| SMS1040-101M | 100 | 20% | 237.0 | 290.0 | 3.00 | 2.00 | 11.510.04.0 |
| Inductance Tolerance Codes: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | Packing: T - Tape & Reel, B - Bulk Package | ||||||
| Electrical Specifications at 25 | |||||||
| Saturation Current: DC current at which inductance drops 30% from its value without current. | |||||||
| Heat Rating Current: The actual value of DC current when the temperature rise is T 40 (Ta=25). | |||||||
| Rated DC Current: The lesser value of Isat or Irms. | |||||||
| Note: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. | |||||||
Shape and Dimensions
| Part No. | A (Max) | B (0.30) | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS1040 | 11.50 | 10.00 | 4.00 | 3.00 | 2.00 | 4.10 | 13.60 | 5.40 |
| (Dimensions are in mm) | ||||||||
Product Packaging
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS1040 | 24.0 | 16.0 | 11.5 | 24.4 | 100 | 13 | 330 | 1000 | 2000 | 8000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal. | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without loose terminal. | Pull force applied gradually to terminal (force varies by terminal diameter). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Total amplitude of 1.5mm, frequency 10 to 55 Hz and return to 10 Hz in 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions (total of 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30% (SMD series only). DCR/DCR10%. | Reflow for twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, brushing 10 times. |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months. Conditions: 5~40C, 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions inhibiting soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Thermal Design: Self-heating occurs when power is ON; ensure sufficient thermal design margin.
- Layout (Non-magnetic Shield Type): Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina