High precision LanTu Micro SDRI127-221MT Shielded SMD Power Inductors designed for automatic mounting and power conversion
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Product Description
Shielded SMD Power Inductors - SDRI127 Series
Product Overview
The SDRI127 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit design to minimize leakage flux, these inductors offer high saturation current and low DC resistance. Their highly accurate dimensions ensure suitability for automatic mounting, and they are available in various package sizes and a wide inductance range. These inductors comply with RoHS, Halogen Free, and REACH standards, making them ideal for use in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO
- Origin: SHENZHEN, CHINA
- Certifications: RoHS, Halogen Free, REACH Compliance
- Type: Shielded SMD Power Inductors
- Magnetic Circuit Design: Closed magnetic circuit
Technical Specifications
Product Identification: SDRI 127 470 M T
External Dimensions (LWH): 12.5 12.5 8.0 mm
Operating Temperature: -40 to +125 (Including coil self-temperature rise)
Electrical Characteristics (Electrical specifications at 25)
| Part No | Inductance (H) @0A | Tole | Test Freq Min | Test Freq | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SDRI127-1R0N | 1.0 | 30% | 100KHz | 1MHz | 0.009 | 26.00 | 10.00 |
| SDRI127-2R2N | 2.2 | 30% | 100KHz | 1MHz | 0.012 | 21.00 | 8.00 |
| SDRI127-2R7N | 2.7 | 30% | 100KHz | 1MHz | 0.013 | 19.00 | 8.00 |
| SDRI127-3R3N | 3.3 | 30% | 100KHz | 1MHz | 0.013 | 16.00 | 8.00 |
| SDRI127-3R9N | 3.9 | 30% | 100KHz | 1MHz | 0.013 | 14.00 | 7.50 |
| SDRI1274R7N | 4.7 | 30% | 100KHz | 1MHz | 0.016 | 12.00 | 6.80 |
| SDRI127-6R1N | 6.1 | 30% | 100KHz | 1MHz | 0.018 | 11.50 | 6.60 |
| SDRI127-6R8N | 6.8 | 30% | 100KHz | 1MHz | 0.019 | 10.50 | 6.60 |
| SDRI127-7R6N | 7.6 | 30% | 100KHz | 1MHz | 0.020 | 10.00 | 5.90 |
| SDRI127-8R2N | 8.2 | 30% | 100KHz | 1MHz | 0.020 | 9.50 | 5.60 |
| SDRI127-100N | 10 | 30% | 100KHz | 1MHz | 0.021 | 9.00 | 5.40 |
| SDRI127-120M | 12 | 20% | 100KHz | 1MHz | 0.240 | 8.50 | 4.90 |
| SDRI127-150M | 15 | 20% | 100KHz | 1MHz | 0.027 | 8.00 | 4.50 |
| SDRI127-180M | 18 | 20% | 100KHz | 1MHz | 0.039 | 7.50 | 3.90 |
| SDRI127-220M | 22 | 20% | 100KHz | 1MHz | 0.043 | 7.00 | 3.60 |
| SDRI127-270M | 27 | 20% | 100KHz | 1MHz | 0.046 | 6.50 | 3.40 |
| SDRI127-330M | 33 | 20% | 100KHz | 1MHz | 0.065 | 5.50 | 3.00 |
| SDRI127-390M | 39 | 20% | 100KHz | 1MHz | 0.072 | 5.00 | 2.75 |
| SDRI127-470M | 47 | 20% | 100KHz | 1MHz | 0.100 | 4.60 | 2.50 |
| SDRI127-560M | 56 | 20% | 100KHz | 1MHz | 0.110 | 4.40 | 2.35 |
| SDRI127-680M | 68 | 20% | 100KHz | 1MHz | 0.140 | 4.00 | 2.10 |
| SDRI127-820M | 82 | 20% | 100KHz | 1MHz | 0.160 | 3.80 | 1.95 |
| SDRI127-101M | 100 | 20% | 100KHz | 0.796MHz | 0.220 | 3.50 | 1.70 |
| SDRI127-121M | 120 | 20% | 100KHz | 0.796MHz | 0.250 | 3.00 | 1.60 |
| SDRI127-151M | 150 | 20% | 100KHz | 0.796MHz | 0.280 | 2.70 | 1.42 |
| SDRI127-181M | 180 | 20% | 100KHz | 0.796MHz | 0.350 | 2.50 | 1.30 |
| SDRI127-221M | 220 | 20% | 100KHz | 0.796MHz | 0.390 | 2.00 | 1.16 |
| SDRI127-271M | 270 | 20% | 100KHz | 0.796MHz | 0.560 | 1.95 | 1.06 |
| SDRI127-331M | 330 | 20% | 100KHz | 0.796MHz | 0.640 | 1.90 | 0.95 |
| SDRI127-391M | 390 | 20% | 100KHz | 0.796MHz | 0.700 | 1.65 | 0.88 |
| SDRI127-471M | 470 | 20% | 100KHz | 0.796MHz | 0.980 | 1.50 | 0.79 |
| SDRI127-561M | 560 | 20% | 100KHz | 0.796MHz | 1.070 | 1.40 | 0.73 |
| SDRI127-681M | 680 | 20% | 100KHz | 0.796MHz | 1.460 | 1.30 | 0.67 |
| SDRI127-821M | 820 | 20% | 100KHz | 0.796MHz | 1.640 | 1.10 | 0.60 |
| SDRI127-102M | 1000 | 20% | 100KHz | 0.796MHz | 1.820 | 1.00 | 0.55 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser of Isat or Irms.
Shape and Dimensions (dimensions are in mm)
| Part No | A (Max) | B (Max) | C (Max) | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI127 | 12.5 | 12.5 | 8.0 | 5.0 | 7.6 | 2.9 | 7.0 | 5.4 |
Packaging Information
Tape and Reel Specifications:
| Part No. | Tape Dimension W | Tape Dimension P | Tape Dimension H | Reel Dimensions A | Reel Dimensions B | Reel Dimensions C | Reel Dimensions D | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI127 | 24 | 16 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Cover tape peel off condition:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test: Defined forces based on terminal sectional area (8mm, 8-20mm, >20mm). Solder paste thickness: 0.12mm. Force applied gradually and maintained for 101s at 1.0mm/s speed. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (0.35-0.50mm, 0.50-0.80mm, 0.80-1.25mm, >1.25mm). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply flexure (2mm) at 0.5mm/sec speed, keep for 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to testing jig. Subject to simple harmonic motion (1.5mm amplitude, 10-55 Hz) for 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | 100 cycles of temperature shock between (85~125) and (-55~40). Transforming interval: Max. 20 sec. Stabilize at normal condition for 1-2 hours after test. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1-2 hours before measuring. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, undergo reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, then brush 10 times. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to LANTU's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under conditions (temperature: 5~40C, humidity: 35~65% RH or less). Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that may inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils; contact LANTU if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for thermal design due to self-heating when power is ON.
- Non-Magnetic Shield Type: Carefully lay out the coil on the circuit board to prevent malfunctions due to magnetic interference.
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