LanTu Micro SMS1350 150MT power inductor with magnetic shielding and composite die casting structure
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Product Description
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1350 Series are ultra-high current, thin-design SMD power inductors. Featuring magnetic shielding for strong anti-electromagnetic interference and an integrated construction for high reliability and vibration resistance, these inductors offer ultra-low buzz noise and low loss due to their composite structure and die-casting with low-loss alloy powder. They are designed for high efficiency with low DC resistance and low eddy-current loss, supporting frequencies up to 3MHz. Ideal for applications requiring high current capabilities and high-density installation, such as PDAs, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS1350
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
| Item | Specification |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Max Absolute Voltage | 30VDC |
| Frequency Support | Up to 3MHz |
| External Dimensions (LWH) | 13.812.66.0 mm (for SMS1350 series) |
| Product Identification Example | SMS 1350 100 M T (SMS: Type, 1350: Dimensions, 100: Inductance 10uH, M: Tolerance 20%, T: Tape & Reel) |
| Inductance Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packing | Bulk Package (B), Tape & Reel (T) |
| Saturation Current Definition | DC current at which inductance drops 30% from its value without current. |
| Temperature Rise Current Definition | The actual value of DC current when the temperature rise is T 40 (Ta=25). |
| Rated DC Current Definition | The lesser value of Isat or Irms. |
| Recommended Land Pattern | Refer to page 2 of the datasheet. |
| Recommended Reflow Soldering Curve | Refer to page 11 of the datasheet. Preheating temperature difference should be within 150C. |
| Storage Period | Within 12 months. |
| Storage Conditions | Temperature: 5~40C, Humidity: 35~65% RH or less. |
Electrical Characteristics (Typical at 25)
| Part No. | Inductance (H) | L @ 0A Tol. | DCR (m) Typ. | Saturation Current (A) Typ. | Heat Rating Current (A) Typ. |
|---|---|---|---|---|---|
| SMS1350-R36M | 0.36 | 20% | 0.85 | 60.00 | 41.00 |
| SMS1350-R47M | 0.47 | 20% | 1.1 | 52.00 | 39.00 |
| SMS1350-R68M | 0.68 | 20% | 1.2 | 40.00 | 32.00 |
| SMS1350-R82M | 0.82 | 20% | 1.5 | 42.00 | 30.00 |
| SMS1350-1R0M | 1.0 | 20% | 1.9 | 35.00 | 26.00 |
| SMS1350-1R5M | 1.5 | 20% | 2.7 | 30.00 | 23.00 |
| SMS1350-2R2M | 2.2 | 20% | 4.0 | 26.00 | 20.00 |
| SMS1350-3R3M | 3.3 | 20% | 7.0 | 22.00 | 15.00 |
| SMS1350-4R7M | 4.7 | 20% | 9.0 | 17.00 | 12.00 |
| SMS1350-6R8M | 6.8 | 20% | 15.0 | 14.00 | 11.00 |
| SMS1350-100M | 10 | 20% | 20.0 | 12.00 | 8.00 |
| SMS1350-150M | 15 | 20% | 28.0 | 10.00 | 6.00 |
| SMS1350-220M | 22 | 20% | 45.0 | 7.00 | 4.50 |
| SMS1350-330M | 33 | 20% | 66.0 | 6.00 | 4.00 |
| SMS1350-470M | 47 | 20% | 100.0 | 5.00 | 3.00 |
| SMS1350-680M | 68 | 20% | 115.0 | 4.50 | 2.50 |
Shape and Dimensions
| Part No. | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | F (mm) | G (mm) | H (mm) |
|---|---|---|---|---|---|---|---|---|
| SMS1350 | 13.800.50 | 12.600.20 | 6.00Max | 3.70 Typ | 2.50 Typ | 8.00 | 14.60 | 5.00 |
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS1350 | 24.0 | 16.0 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Cover Tape Peel Off Condition
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing Summary
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT/DIP) | Meet defined force and duration requirements without terminal looseness. | GB/T 2423.60-2008, JIS C 5321:1997 (for flexure) |
| Resistance to Flexure | No visible mechanical damage. | JIS C 5321:1997. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping Test | No case deformation or change in appearance. No short and no open. | GB/T 2423.7-2018. Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | GB/T 2423.28-2005. Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. |
| Vibration Test | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | GB/T 2423.10-2019. Amplitude: 1.5mm. Frequency: 10 to 55 Hz and return. Duration: 2 hours in each 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.22-2012 Method Na. 100 cycles of temperature transitions between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.1-2008 Method Ab. Temperature: -55~-402. Duration: 962 hours. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.2-2008 Method Bb. Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | GB/T 2423.3-2016. Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat Endurance of Reflow Soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | GJB 360B-2009. Peak temperature: 260+0/-5. Performed twice. |
| Resistance to Solvent Test | No case deformation or change in appearance or obliteration of marking. | IEC 68-2-45:1993. Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload Test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | JIS C5311-6.13. Apply twice rated current for 5 minutes. |
| Voltage Resistance Test | During the test no breakdown. Characteristics are normal after test. | MIL-STD-202G Method 301. DC1000V, Current: 1mA, Time: 1Min. |
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