Composite structure SMD power inductor LanTu Micro SMS0530 150MT with reduced core eddy current loss
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The SMS0530 Series Ultra-high current SMD power inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-density installation with a thin profile, low DC resistance, and ultra-high current capabilities. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors offer high reliability and excellent vibration resistance due to their integral construction. The composite structure minimizes buzz noise, while the low-loss alloy powder die-casting ensures low impedance and small parasitic capacitance, contributing to high efficiency and reduced core eddy-current loss. Operating up to 3MHz with a maximum voltage of 30VDC, they are RoHS, Halogen Free, and REACH compliant.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS0530
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
| Item | Specification | Details | |||||
|---|---|---|---|---|---|---|---|
| Operating Temperature | -55 to +125 | (Including coils self-temperature rise) | |||||
| Frequency | Up to 3MHz | ||||||
| Absolute Maximum Voltage | 30VDC | ||||||
| External Dimensions (LWH) | 5.55.23.0 mm | (SMS0530 Series) | |||||
| Recommended Land Pattern (mm) | A: 5.500.30, B: 5.200.20, C: 3.00Max, D: 2.30 Typ, E: 1.20 Typ, F: 3.00, G: 7.00, H: 2.50 | ||||||
| Test Equipment (Inductance) | WK3260B LCR meter or equivalent | ||||||
| Test Equipment (Current) | WK3260B+WK3265B or equivalent | ||||||
| Test Equipment (DCR) | Chroma 16502 or equivalent | ||||||
| Electrical Characteristics (25) | Part No. | Inductance (H) | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current Typical (A) | Heat Rating Current Typical (A) |
| SMS0530-R22M | 0.22 | 20% | 3.5 | 3.9 | 15.00 | 14.00 | |
| SMS0530-R33M | 0.33 | 20% | 4.6 | 5.5 | 14.40 | 13.10 | |
| SMS0530-R47M | 0.47 | 20% | 7.4 | 8.5 | 14.00 | 11.00 | |
| SMS0530-R68M | 0.68 | 20% | 11.0 | 12.0 | 12.00 | 9.50 | |
| SMS0530-1R0M | 1.0 | 20% | 12.0 | 15.0 | 10.00 | 9.00 | |
| SMS0530-1R2M | 1.2 | 20% | 15.0 | 16.0 | 9.50 | 8.50 | |
| SMS0530-1R5M | 1.5 | 20% | 20.0 | 25.0 | 9.00 | 7.50 | |
| SMS0530-2R2M | 2.2 | 20% | 31.0 | 35.0 | 7.00 | 6.50 | |
| SMS0530-3R3M | 3.3 | 20% | 35.0 | 46.0 | 6.00 | 5.00 | |
| SMS0530-4R7M | 4.7 | 20% | 50.0 | 60.0 | 5.00 | 4.50 | |
| SMS0530-6R8M | 6.8 | 20% | 102.0 | 110.0 | 4.00 | 3.50 | |
| SMS0530-100M | 10 | 20% | 110.0 | 125.0 | 3.50 | 3.20 | |
| SMS0530-150M | 15 | 20% | 175.0 | 215.0 | 2.50 | 2.20 | |
| SMS0530-220M | 22 | 20% | 320.0 | 394.8 | 2.00 | 1.80 | |
| Inductance Tolerance Options | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% | ||||||
| Packing Options | B: Bulk Package, T: Tape & Reel | ||||||
| Saturation Current Definition | DC current at which inductance drops 30% from its value without current. | ||||||
| Heat Rating Current Definition | The actual value of DC current when the temperature rise is T 40 (Ta=25). | ||||||
| Rated DC Current | The lesser of Isat or Irms. | ||||||
| Tape & Reel Dimensions (mm) | W: 12.0, P: 8.0, W1: 5.5, Reel Dimensions A: 12.4 | ||||||
| Packing Quantity | Reel: 2000 PCS, Inside Box: 8000 PCS, Outside Carton: 32,000 PCS | (For tape & reel packing) |
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Reliability Testing
| Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet specified force and time requirements without loose terminals. | Pulling test based on sectional area of terminal (GB/T 2423.60-2008). Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet specified force and time requirements without loose terminals. | Pull force applied gradually to terminal, maintained for 10 seconds, based on terminal diameter (GB/T 2423.60-2008). |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force in specified direction, flexure 2mm, speed 0.5mm/sec, keep time 30 sec (JIS C 5321:1997). |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in specified angles, ridges, and surfaces, twice in each direction (GB/T 2423.7-2018). |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol (GB/T 2423.28-2005). |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to jig, subjected to simple harmonic motion (10-55 Hz), 2 hours in each 3 mutually perpendicular directions (GB/T 2423.10-2019). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | 100 cycles of temperature changes (-55~40 to 85~125). Transforming interval: Max. 20 sec (GB/T 2423.22-2012 Method Na). |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours (GB/T 2423.1-2008 Method Ab). |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours (GB/T 2423.2-2008 Method Bb). |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours (GB/T 2423.3-2016). |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5 (GJB 360B-2009). |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times (IEC 68-2-45:1993). |
| Overload test | During test: no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes (JIS C5311-6.13). |
| Voltage resistance test | During test: no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min (MIL-STD-202G Method 301). For parts with two coils. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, under 5~40C and 35~65% RH. Terminal solderability may deteriorate after expiration.
- Environment: Avoid use and storage in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils affecting solderability. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not bend terminals excessively to prevent wire fracture.
- Cleaning: Do not clean products; contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections must be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating (temperature increase) when power is on; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Careful coil layout is required on the PCB to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina