Shielded SMD Power Inductors LanTu Micro SDRH104R-4R7NT with Automatic Mounting Suitable Dimensions
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Product Description
Product Overview
The SDRH104R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DCR, featuring a closed magnetic circuit to minimize leakage. These inductors offer high-precision dimensions suitable for automatic mounting, available in various package sizes and a wide inductance range. They are compliant with RoHS, Halogen Free, and REACH standards, making them ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRH104R
- Type: Shielded SMD Power Inductors
- Magnetic Circuit Design: Closed magnetic circuit
- Certifications: RoHS, Halogen Free, REACH Compliance
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
Product Identification: SDRH 104R 100 N T
External Dimensions (LWH): 10.310.34.0 mm
Operating Temperature: -40 to +125 (Including coil self-temperature rise)
Recommended Land Pattern:
| Part No | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SDRH104R | 10.3 | 10.5 | 4.0 | 7.7 | 3.0 | 1.2 | 3.6 | 1.7 | 7.3 |
Electrical Characteristics:
| Part No | Inductance (H) | Tolerance | Test Freq | DCR () Max @0A | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SDRH104R-1R5N | 1.5 | 30% | 100KHz | 0.008 | 12.50 | 8.50 |
| SDRH104R-2R2N | 2.2 | 30% | 100KHz | 0.011 | 9.90 | 7.70 |
| SDRH104R-3R3N | 3.3 | 30% | 100KHz | 0.014 | 8.80 | 7.40 |
| SDRH104R-3R8N | 3.8 | 30% | 100KHz | 0.018 | 8.80 | 7.40 |
| SDRH104R-4R7N | 4.7 | 30% | 100KHz | 0.022 | 7.00 | 6.00 |
| SDRH104R-5R2N | 5.2 | 30% | 100KHz | 0.022 | 7.00 | 6.00 |
| SDRH104R-6R8N | 6.8 | 30% | 100KHz | 0.027 | 6.60 | 5.30 |
| SDRH104R-8R2N | 8.2 | 30% | 100KHz | 0.030 | 6.00 | 4.80 |
| SDRH104R-100N | 10 | 30% | 100KHz | 0.035 | 5.60 | 4.50 |
| SDRH104R-150N | 15 | 30% | 100KHz | 0.050 | 4.40 | 3.70 |
| SDRH104R-220M | 22 | 20% | 100KHz | 0.073 | 3.60 | 2.80 |
| SDRH104R-330M | 33 | 20% | 100KHz | 0.093 | 2.90 | 2.60 |
| SDRH104R-470M | 47 | 20% | 100KHz | 0.128 | 2.44 | 2.30 |
| SDRH104R-560M | 56 | 20% | 100KHz | 0.185 | 2.18 | 1.75 |
| SDRH104R-680M | 68 | 20% | 100KHz | 0.213 | 2.08 | 1.68 |
| SDRH104R-820M | 82 | 20% | 100KHz | 0.275 | 1.88 | 1.48 |
| SDRH104R-101M | 100 | 20% | 100KHz | 0.304 | 1.66 | 1.42 |
| SDRH104R-151M | 150 | 20% | 100KHz | 0.506 | 1.40 | 1.15 |
| SDRH104R-221M | 220 | 20% | 100KHz | 0.756 | 1.19 | 0.88 |
| SDRH104R-331M | 330 | 20% | 100KHz | 1.090 | 0.92 | 0.66 |
| SDRH104R-471M | 470 | 20% | 100KHz | 1.476 | 0.65 | 0.59 |
| SDRH104R-681M | 680 | 20% | 100KHz | 2.100 | 0.54 | 0.50 |
Definitions:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
Note: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions affect part temperature. Part temperature should be verified in the end application.
Packaging Information:
| Part No. | Tape Dimension W (mm) | P (mm) | W1 (mm) | Reel Dimensions A (mm) | B (mm) | C (mm) | D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRH104R | 24 | 16 | 11.5 | 24.4 | 60 | 13 | 330 | 1000 | 2000 | 8000 |
Cover tape peel off condition:
- a) Cover tape peel force shall be 10 to 120g
- b) Noodle strip peeling angle 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test (defined by terminal area), Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. Reference documents: GB/T 2423.60-2008. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (0.35d0.50: 5N; 0.50d0.80: 10N; 0.80d1.25: 20N; D1.25: 40N). Duration: 10sec. Reference documents: GB/T 2423.60-2008. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force in shown direction, Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec. JIS C 5321:1997. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. GB/T 2423.7-2018. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. GB/T 2423.28-2005. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Subject to simple harmonic motion (amplitude 1.5mm, frequency 10-55 Hz and return). Applied for 2 hours in each of 3 mutually perpendicular directions. GB/T 2423.10-2019. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of (85~125 for T time) to (-55~40 for T time). Transforming interval: Max. 20 sec. GB/T 2423.22-2012 Method Na. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. GB/T 2423.1-2008 Method Ab. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. GB/T 2423.2-2008 Method Bb. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. GB/T 2423.3-2016. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. GJB 360B-2009. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, dry for 5Min, brush 10 times. IEC 68-2-45:1993. |
| Overload test | During test no smoke, no peculiar smell, no fire. Characteristics normal after test. | Apply twice rated current for 5 minutes. JIS C5311-6.13. |
| Voltage resistance test | During test no breakdown. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. MIL-STD-202G Method 301. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the soldering equipment. Users should adjust and confirm according to their specific environment and equipment.
Usage Reminders
- Storage: Within 12 months, at 5~40C and 35~65% RH. Prolonged storage may affect terminal solderability.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals to prevent reduced solderability due to hand oils. Handle carefully to prevent damage from dropping.
- Terminal Bending: Do not excessively bend terminals to avoid wire fracture.
- Cleaning: Do not rinse coils yourself; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is applied; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: For non-magnetic shield types, carefully consider coil placement on the PCB to prevent malfunctions due to magnetic interference.
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