Molding SMD Power Inductors LanTu Micro SMS1050-470MT with Composite Structure Minimizing Buzz Noise
Molding SMD Power Inductors - SMS1050 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1050 Series are ultra-high current SMD power inductors designed for high-density installations. Featuring a thin profile with low DC resistance and ultra-high current capability, these magnetically shielded inductors offer strong anti-electromagnetic interference. Their integral construction ensures high reliability and excellent vibration resistance, while the composite structure minimizes buzz noise. These inductors are manufactured using low-loss alloy powder for die-casting, resulting in low impedance and small parasitic capacitance, leading to high efficiency and reduced core eddy-current loss. They are suitable for frequencies up to 3MHz and have an absolute maximum voltage of 30VDC. The series is RoHS, Halogen Free, and REACH compliant.
Applications
- PDA, notebook, desktop, server applications
- High current POL converters
- Battery powered devices
- DC/DC converters in distributed power systems
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SMS1050
- Type: Molding SMD Power Inductor
- Certifications: RoHS, Halogen Free, REACH Compliance
Technical Specifications
Electrical Characteristics (Electrical specifications at 25)
| Part No. | Inductance (H) @0A | Tol. | DCR (m) Typical | Saturation Current (A) Typical | Heat Rating Current (A) Typical |
|---|---|---|---|---|---|
| SMS1050-R82M | 0.82 | 20% | 2.5 | 39.00 | 22.00 |
| SMS1050-1R0M | 1.0 | 20% | 2.8 | 30.00 | 20.30 |
| SMS1050-1R2M | 1.2 | 20% | 2.8 | 28.00 | 18.00 |
| SMS1050-1R5M | 1.5 | 20% | 3.9 | 25.00 | 16.00 |
| SMS1050-2R2M | 2.2 | 20% | 6.5 | 20.00 | 13.00 |
| SMS1050-3R3M | 3.3 | 20% | 9.2 | 18.00 | 10.00 |
| SMS1050-4R7M | 4.7 | 20% | 12.4 | 14.00 | 9.50 |
| SMS1050-5R6M | 5.6 | 20% | 18.9 | 13.00 | 8.50 |
| SMS1050-6R8M | 6.8 | 20% | 20.6 | 12.00 | 8.00 |
| SMS1050-8R2M | 8.2 | 20% | 27.4 | 10.00 | 7.00 |
| SMS1050-100M | 10 | 20% | 30.2 | 8.50 | 5.50 |
| SMS1050-150M | 15 | 20% | 48.0 | 7.00 | 4.50 |
| SMS1050-220M | 22 | 20% | 60.0 | 5.50 | 4.00 |
| SMS1050-330M | 33 | 20% | 89.0 | 5.50 | 3.50 |
| SMS1050-470M | 47 | 20% | 110.0 | 4.50 | 3.00 |
| SMS1050-680M | 68 | 20% | 190.0 | 3.00 | 2.00 |
Inductance Tolerance Codes
J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packaging Codes
B: Bulk Package, T: Tape & Reel
Shape and Dimensions (dimensions are in mm)
| Part No. | A (Max) | B (0.30) | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS1050 | 11.50 | 10.00 | 5.00 | 3.00 | 2.00 | 5.40 | 13.60 | 4.10 |
Environmental Data
- Operating Temperature: -55 to +125 (Including coils self-temperature rise)
Key Features
- Thin design with low DC resistance and ultra-high current capability.
- Magnetic shielding type with strong anti-electromagnetic interference, suitable for high-density installation.
- High reliability and excellent vibration resistance due to newly developed integral construction.
- Ultra-low buzz noise due to composite construction.
- Low impedance and small parasitic capacitance from die-casting with low-loss alloy powder.
- High efficiency with low winding DC resistance and low core eddy-current loss.
- Frequency up to 3MHz.
- Absolute maximum voltage 30VDC.
Test Equipment
- Inductance: WK3260B LCR meter or equivalent
- Current (Isat & Irms): WK3260B+WK3265B or equivalent
- DC Resistance: Chroma 16502 or equivalent
Product Identification Example
SMS 1050 100 M T
- : Inductance (e.g., 100 for 10 uH)
- : Type (SMS)
- : Tolerance (M for 20%)
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Adjust and confirm based on user's environment/equipment.
Reminders for Using These Products
- Storage period within 12 months under specified conditions (5~40C, 35~65% RH).
- Avoid use and storage in corrosive gas environments.
- Do not touch terminals directly with bare hands.
- Handle products carefully to prevent damage.
- Do not bend terminals excessively.
- Do not rinse coils without contacting the manufacturer.
- Keep away from magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid damage.
- Allow for sufficient thermal design margin due to self-heating.
- Careful coil layout is required for non-magnetic shield types to prevent malfunctions due to magnetic interference.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.