Low DC Resistance Unshielded Power Inductor LanTu Micro SCD7850-2R2MT for Surface Mount Applications
Product Overview
The SCD7850 Series are unshielded SMD power inductors designed for surface mounting equipment. These low-cost, silver-plated inductors offer a small size with high rated current and low DC resistance. They are compliant with RoHS, Halogen Free, and REACH standards. Applications include power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Series: SCD7850
- Type: Unshielded SMD Power Inductors
- Design: Silver plated type, Low cost design
- Certifications: RoHS, Halogen Free and REACH Compliance
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
External Dimensions (LWH): 7.85.07.5 mm
Recommended Land Pattern Dimensions (mm):
| Part No | A | B | C | D | H | I | J |
|---|---|---|---|---|---|---|---|
| SCD7850 | 7.80.3 | 7.00.3 | 5.00.5 | 2.1 | 7.5 | 3.0 | 2.0 |
Electrical Characteristics:
| Part No | Inductance (H) | Tole | Test Freq | SRF (MHz) Min | DCR () Typ | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|---|
| SCD7850-1R0M | 1.0 | M | 100KHz | 20 | 0.013 | 7.00 | 5.20 |
| SCD7850-2R2M | 2.2 | M | 100KHz | 20 | 0.015 | 6.00 | 4.80 |
| SCD7850-4R7M | 4.7 | M | 100KHz | 20 | 0.026 | 5.00 | 3.80 |
| SCD7850-6R8M | 6.8 | M | 100KHz | 20 | 0.033 | 4.00 | 2.80 |
| SCD7850-8R2M | 8.2 | M | 100KHz | 20 | 0.039 | 3.50 | 2.55 |
| SCD7850-100M | 10 | M | 100KHz | 20 | 0.042 | 2.85 | 2.31 |
| SCD7850-120M | 12 | M | 100KHz | 20 | 0.049 | 2.50 | 2.00 |
| SCD7850-150M | 15 | M | 100KHz | 20 | 0.072 | 2.20 | 1.81 |
| SCD7850-180M | 18 | M | 100KHz | 20 | 0.085 | 2.00 | 1.60 |
| SCD7850-220M | 22 | M | 100KHz | 20 | 0.091 | 1.95 | 1.50 |
| SCD7850-270M | 27 | M | 100KHz | 20 | 0.107 | 1.75 | 1.30 |
| SCD7850-330M | 33 | M | 100KHz | 20 | 0.120 | 1.50 | 1.20 |
| SCD7850-390M | 39 | M | 100KHz | 20 | 0.150 | 1.40 | 1.10 |
| SCD7850-470M | 47 | M | 100KHz | 20 | 0.176 | 1.28 | 1.10 |
| SCD7850-560M | 56 | M | 100KHz | 30 | 0.208 | 1.20 | 0.94 |
| SCD7850-680M | 68 | M | 100KHz | 30 | 0.238 | 1.12 | 0.85 |
| SCD7850-820M | 82 | M | 100KHz | 30 | 0.273 | 1.04 | 0.78 |
| SCD7850-101M | 100 | M | 100KHz | 30 | 0.325 | 0.92 | 0.73 |
| SCD7850-121M | 120 | M | 100KHz | 35 | 0.390 | 0.80 | 0.66 |
| SCD7850-151M | 150 | M | 100KHz | 35 | 0.520 | 0.72 | 0.58 |
| SCD7850-181M | 180 | M | 100KHz | 35 | 0.598 | 0.68 | 0.51 |
| SCD7850-221M | 220 | M | 100KHz | 35 | 0.793 | 0.64 | 0.49 |
| SCD7850-271M | 270 | M | 100KHz | 35 | 0.884 | 0.56 | 0.42 |
| SCD7850-331M | 330 | M | 100KHz | 35 | 1.130 | 0.52 | 0.40 |
| SCD7850-391M | 390 | M | 100KHz | 35 | 1.300 | 0.44 | 0.36 |
| SCD7850-471M | 470 | M | 100KHz | 35 | 1.680 | 0.40 | 0.34 |
| SCD7850-561M | 560 | M | 100KHz | 35 | 1.900 | 0.38 | 0.32 |
| SCD7850-681M | 680 | M | 100KHz | 35 | 2.470 | 0.35 | 0.29 |
| SCD7850-821M | 820 | M | 100KHz | 35 | 2.860 | 0.30 | 0.25 |
| SCD7850-102M | 1000 | M | 100KHz | 35 | 3.640 | 0.25 | 0.19 |
| SCD7850-122M | 1200 | M | 100KHz | 35 | 4.430 | 0.23 | 0.17 |
Notes on Specifications:
- Saturation Current: DC current at which inductance drops 10% from its value without current.
- Temperature Rise Current: the actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value of Isat or Irms.
- Part temperature should be verified in the end application due to factors like circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions.
Packaging Information:
| Part No. | Tape Dimension W (mm) | P (mm) | W1 (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|
| SCD7850 | 16 | 12 | 7.5 | 100 | 1000 | 3000 |
Reel Dimensions (mm):
| A | B | C | D |
|---|---|---|---|
| 13 | 330 | 1000 | 3000 |
Tape Dimension (mm):
| W | P | W1 |
|---|---|---|
| 16 | 12 | 7.5 |
Cover tape peel off condition:
- Cover tape peel force shall be 10 to 120g.
- Noodle strip peeling angle 165 to 180.
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal area. Solder paste thickness: 0.12mm. Keep time: 101s, Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (d). Duration: 10sec. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage. Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency range 10 to 55 Hz and return to 10 Hz in approx. 1 minute. Applied for 2 hours in each 3 mutually perpendicular directions (total of 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature cycling (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then drying at room temp for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. Characteristics are normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. Characteristics are normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products:
- Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
- Do not use or store in locations with gas corrosion (salt, acid, alkali, etc.).
- Avoid direct contact with terminals with bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or inappropriate removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions; overheating may cause issues.
- Allow for sufficient thermal design margin as self-heating occurs when power is ON.
- For non-magnetic shield types, carefully lay out the coil on the circuit board to prevent malfunction due to magnetic interference.
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