Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Performance LanTu Micro SCD5845-101MT Unshielded SMD Power Inductors for Notebook and LCD Applications

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Product Description

Unshielded SMD Power Inductors - SCD5845 Series

Product Overview

The SCD5845 Series Unshielded SMD Power Inductors are low-cost, surface-mountable components designed for various electronic applications. These inductors feature a small size with high rated current capabilities and low DC resistance. They are suitable for use in power supplies for VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. The series complies with RoHS, Halogen Free, and REACH standards.

Product Attributes

  • Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
  • Series: SCD5845
  • Type: Unshielded SMD Power Inductors
  • Design: Silver plated type, Low cost design
  • Certifications: RoHS, Halogen Free and REACH Compliance
  • Packaging Options: Bulk Package (B), Tape & Reel (T)

Technical Specifications

General Specifications

Item Specification
Operating Temperature -40 to +125 (Including coils self-temperature rise)
Test Equipment (Inductance) HP4284A, HP4285A or equivalent
Test Equipment (Current) HP4284+42841A or equivalent
Test Equipment (SRF) Agilent E4991A or equivalent
Test Equipment (DCR) Chroma 16502 or equivalent

Dimensions

Part No External Dimensions (LWH) (mm) A (mm) B (mm) C (mm) D (mm) H (mm) I (mm) J (mm)
SCD5845 5.84.5 5.80.3 5.20.3 4.50.35 2.0 5.5 2.15 1.7

Electrical Characteristics

Part No Inductance L(H) @0A Tole Test Freq SRF Min (MHz) DCR Typ () Saturation Current Isat Max (A) Temperature Rise Current Irms Max (A)
SCD5845-1R0M 1.0 M 100KHz 20 7.96MHz 0.013 6.00 5.40
SCD5845-1R5M 1.5 M 100KHz 20 7.96MHz 0.017 5.00 4.70
SCD5845-3R3M 3.3 M 100KHz 20 7.96MHz 0.031 4.00 3.70
SCD5845-4R7M 4.7 M 100KHz 20 7.96MHz 0.052 3.50 3.10
SCD5845-6R8M 6.8 M 100KHz 20 7.96MHz 0.059 3.00 2.40
SCD5845-8R2M 8.2 M 100KHz 20 7.96MHz 0.062 2.50 2.00
SCD5845-100M 10 M 100KHz 35 2.52MHz 0.075 1.60 1.44
SCD5845-120M 12 M 100KHz 35 2.52MHz 0.088 1.45 1.40
SCD5845-150M 15 M 100KHz 35 2.52MHz 0.105 1.35 1.30
SCD5845-180M 18 M 100KHz 35 2.52MHz 0.117 1.26 1.23
SCD5845-220M 22 M 100KHz 35 2.52MHz 0.153 1.12 1.11
SCD5845-270M 27 M 100KHz 35 2.52MHz 0.169 1.04 0.97
SCD5845-330M 33 M 100KHz 35 2.52MHz 0.208 0.96 0.88
SCD5845-390M 39 M 100KHz 35 2.52MHz 0.215 0.85 0.80
SCD5845-470M 47 M 100KHz 35 2.52MHz 0.355 0.80 0.72
SCD5845-560M 56 M 100KHz 35 2.52MHz 0.377 0.72 0.68
SCD5845-680M 68 M 100KHz 35 2.52MHz 0.390 0.68 0.61
SCD5845-820M 82 M 100KHz 35 2.52MHz 0.416 0.64 0.58
SCD5845-101M 100 M 100KHz 40 1KHz 0.611 0.56 0.52
SCD5845-121M 120 M 100KHz 40 1KHz 0.754 0.52 0.48
SCD5845-151M 150 M 100KHz 40 1KHz 0.845 0.44 0.40
SCD5845-181M 180 M 100KHz 40 1KHz 1.040 0.40 0.38
SCD5845-221M 220 M 100KHz 40 1KHz 1.450 0.36 0.35
SCD5845-331M 330 M 100KHz 40 1KHz 1.760 0.34 0.28
SCD5845-471M 470 M 100KHz 40 1KHz 2.990 0.32 0.24
SCD5845-681M 680 M 100KHz 40 1KHz 3.900 0.29 0.20
SCD5845-102M 1000 M 100KHz 40 1KHz 5.800 0.26 0.19

Inductance Tolerance Options

Code Tolerance
J 5%
K 10%
L 15%
M 20%
P 25%
N 30%

Packaging Specifications

Part No. Tape Dimension W (mm) Tape Dimension P (mm) Tape Dimension W1 (mm) Reel Dimensions A (mm) Reel Dimensions B (mm) Reel Dimensions C (mm) Reel Dimensions D (mm) REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SCD5845 12 8 7.5 16.4 100 13 330 1500 4500 18,000

Reliability Testing

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on terminal area; Solder paste thickness: 0.12mm.
Terminal Strength (DIP) Meet requirements without any loose terminal. Pulling test based on terminal diameter.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm; Speed: 0.5mm/sec; Keep time: 30 sec.
Dropping No case deformation or change in appearance; No short and no open. Drop packaged products from 1m high, 3 angles, 6 surfaces, twice each.
Solderability Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. Solder temperature: 2402; Duration: 3 sec.
Vibration No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Harmonic motion, 10 to 55 Hz, 2 hours per direction (3 directions).
Thermal Shock No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. 100 cycles of temperature extremes (-55~40 to 85~125).
Low temperature Storage No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: -55~-402; Duration: 962 hours.
High temperature Storage No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: 125~852; Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10%. Twice reflow, peak temperature: 260+0/-5.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip in IPA solvent, dry, and brush 10 times.
Overload test No smoke, no peculiar smell, no fire; Characteristics normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test No breakdown during test; Characteristics normal after test. DC1000V, Current: 1mA, Time: 1Min.

Recommended Reflow Soldering Curve

The recommended reflow conditions are provided as a guideline. Users should adjust and confirm based on their specific equipment and process conditions.

Reminders for Using These Products

  • Storage: Within 12 months, under conditions (5~40C, 35~65% RH).
  • Avoid use/storage in corrosive environments (salt, acid, alkali).
  • Handle with care to avoid touching terminals directly with bare hands.
  • Handle carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals excessively.
  • Do not clean coils; contact manufacturer if cleaning is necessary.
  • Keep away from magnets or magnetic fields.
  • Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions to avoid damage.
  • Account for self-heating when designing for thermal management.
  • For non-magnetic shield types, careful PCB layout is needed to avoid malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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