Surface Mount Unshielded SMD Power Inductors LanTu Micro SCD7850-470MT for High Current Applications
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Product Description
Unshielded SMD Power Inductors - SCD7850 Series
Product Overview
The SCD7850 Series Unshielded SMD Power Inductors are low-cost, surface-mountable components designed for high-current applications. Featuring a small size with low DC resistance, these inductors are suitable for a wide range of electronic devices including VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters. They are compliant with RoHS, Halogen Free, and REACH standards, ensuring environmental responsibility.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Series: SCD7850
- Type: Unshielded SMD Power Inductors
- Design: Silver plated type, Low cost design
- Circuitry: Unshielded magnetic circuit
- Compliance: RoHS, Halogen Free, REACH
- Mounting Type: Suitable for surface mounting equipment
Technical Specifications
General Specifications
| Item | Specification |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A LCR meter or equivalent |
| Test Equipment (Isat & Irms) | HP4284+42841A or equivalent |
| Test Equipment (SRF) | Agilent E4991A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification
Format: SCD 7850 [Inductance Value] [Tolerance] [Packing]
- Type Code: SCD (Unshielded SMD Power Inductors)
- Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: T (Tape & Reel), B (Bulk Package)
Dimensions
| Part No | L (mm) | W (mm) | H (mm) | A (mm) | B (mm) | C (mm) | D (mm) | I (mm) | J (mm) |
|---|---|---|---|---|---|---|---|---|---|
| SCD7850 | 7.80.3 | 5.00.5 | 7.5 | 7.00.3 | 5.00.5 | 2.1 | 7.5 | 3.0 | 2.0 |
Electrical Characteristics (Sample Data)
| Part No | Inductance L (H) | Tole | Test Freq | SRF Min (MHz) | DCR Typ () | Isat Max (A) | Irms Max (A) |
|---|---|---|---|---|---|---|---|
| SCD7850-1R0M | 1.0 | M | 100KHz | 145 | 0.013 | 7.00 | 5.20 |
| SCD7850-2R2M | 2.2 | M | 100KHz | 140 | 0.015 | 6.00 | 4.80 |
| SCD7850-4R7M | 4.7 | M | 100KHz | 135 | 0.026 | 5.00 | 3.80 |
| SCD7850-6R8M | 6.8 | M | 100KHz | 130 | 0.033 | 4.00 | 2.80 |
| SCD7850-8R2M | 8.2 | M | 100KHz | 125 | 0.039 | 3.50 | 2.55 |
| SCD7850-100M | 10 | M | 100KHz | 120 | 0.042 | 2.85 | 2.31 |
| SCD7850-101M | 100 | M | 100KHz | 27 | 0.325 | 0.92 | 0.73 |
| SCD7850-102M | 1000 | M | 100KHz | 7 | 3.640 | 0.25 | 0.19 |
Note: Saturation Current (Isat): DC current at which inductance drops 10% from its value without current. Temperature Rise Current (Irms): the actual value of DC current when the temperature rise is T 40 (Ta=25). Rated DC Current: The lesser value of Isat or Irms.
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SCD7850 | 16 | 12 | 7.5 | 16.4 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal area; Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Applied force based on terminal diameter (5N to 40N). |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm; Speed: 0.5mm/sec; Keep time: 30 sec. |
| Dropping Test | No case deformation or change in appearance; No short and no open. | Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | Solder temp: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu. |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Simple harmonic motion, 10-55 Hz, 2 hours in each of 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | 100 cycles of temperature shock (-55~40 to 85~125). |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: -55~-402; Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: 85~1252; Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10%. | Twice reflow soldering; Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | No smoke, no peculiar smell, no fire during test; Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test; Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm based on their specific equipment and process conditions.
Reminders for Using These Products
- Storage: Within 12 months, under conditions of 5~40C and 35~65% RH.
- Environment: Avoid gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils. Handle carefully to prevent damage.
- Terminals: Do not bend terminals excessively.
- Cleaning: Do not rinse coils; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Keep away from magnets or magnetic objects.
- Preheating: Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Perform within specifications; overheating may cause issues.
- Thermal Design: Account for self-heating when power is on.
- Layout: For non-magnetic shield types, careful coil placement on the PCB is required to prevent malfunction due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina