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Shielded SMD Power Inductors LanTu Micro SDRI129-101MT with Low DC Resistance and Automatic Mounting

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Product Description

Product Overview

The SDRI129 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power supply applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DC resistance, these inductors offer high accuracy dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for use in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

  • Brand: LANTU MICRO
  • Series: SDRI129
  • Type: Shielded SMD Power Inductors
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Magnetic Circuit: Closed magnetic circuit design
  • Mounting: Suitable for automatic mounting
  • Origin: SHENZHEN, CHINA

Technical Specifications

Part No. Inductance (H) Tolerance Test Frequency DCR () Max @ 0A Saturation Current (A) Max Temperature Rise Current (A) Max Dimensions (LWH) (mm)
SDRI129-1R0N 1.0 30% 100KHz 0.0060 19.90 11.60 12.5 Max 12.5 Max 10.0 Max
SDRI129-1R8N 1.8 30% 100KHz 0.0075 13.40 11.00 12.5 Max 12.5 Max 10.0 Max
SDRI129-2R2N 2.2 30% 100KHz 0.0090 12.20 10.30 12.5 Max 12.5 Max 10.0 Max
SDRI129-3R3N 3.3 30% 100KHz 0.010 12.00 9.00 12.5 Max 12.5 Max 10.0 Max
SDRI129-4R7N 4.7 30% 100KHz 0.012 10.08 8.50 12.5 Max 12.5 Max 10.0 Max
SDRI129-5R6N 5.6 30% 100KHz 0.014 9.50 8.00 12.5 Max 12.5 Max 10.0 Max
SDRI129-6R8N 6.8 30% 100KHz 0.015 8.56 7.90 12.5 Max 12.5 Max 10.0 Max
SDRI129-8R2N 8.2 30% 100KHz 0.017 8.48 7.30 12.5 Max 12.5 Max 10.0 Max
SDRI129-100M 10 20% 1KHz 0.018 7.12 6.95 12.5 Max 12.5 Max 10.0 Max
SDRI129-120M 12 20% 1KHz 0.022 7.04 6.20 12.5 Max 12.5 Max 10.0 Max
SDRI129-150M 15 20% 1KHz 0.032 5.84 5.22 12.5 Max 12.5 Max 10.0 Max
SDRI129-180M 18 20% 1KHz 0.035 5.50 5.10 12.5 Max 12.5 Max 10.0 Max
SDRI129-220M 22 20% 1KHz 0.038 5.12 4.95 12.5 Max 12.5 Max 10.0 Max
SDRI129-270M 27 20% 1KHz 0.040 5.00 4.20 12.5 Max 12.5 Max 10.0 Max
SDRI129-330M 33 20% 1KHz 0.052 4.25 3.60 12.5 Max 12.5 Max 10.0 Max
SDRI129-390M 39 20% 1KHz 0.066 4.20 3.50 12.5 Max 12.5 Max 10.0 Max
SDRI129-470M 47 20% 1KHz 0.072 3.60 3.45 12.5 Max 12.5 Max 10.0 Max
SDRI129-560M 56 20% 1KHz 0.090 2.85 2.95 12.5 Max 12.5 Max 10.0 Max
SDRI129-680M 68 20% 1KHz 0.102 2.76 2.85 12.5 Max 12.5 Max 10.0 Max
SDRI129-820M 82 20% 1KHz 0.112 2.62 2.60 12.5 Max 12.5 Max 10.0 Max
SDRI129-101M 100 20% 1KHz 0.126 2.31 2.45 12.5 Max 12.5 Max 10.0 Max
SDRI129-121M 120 20% 1KHz 0.154 2.05 2.20 12.5 Max 12.5 Max 10.0 Max
SDRI129-151M 150 20% 1KHz 0.174 1.80 1.90 12.5 Max 12.5 Max 10.0 Max
SDRI129-181M 180 20% 1KHz 0.191 1.66 1.86 12.5 Max 12.5 Max 10.0 Max
SDRI129-221M 220 20% 1KHz 0.246 1.64 1.72 12.5 Max 12.5 Max 10.0 Max
SDRI129-271M 270 20% 1KHz 0.330 1.35 1.50 12.5 Max 12.5 Max 10.0 Max
SDRI129-331M 330 20% 1KHz 0.386 1.28 1.28 12.5 Max 12.5 Max 10.0 Max
SDRI129-391M 390 20% 1KHz 0.440 1.20 1.27 12.5 Max 12.5 Max 10.0 Max
SDRI129-471M 470 20% 1KHz 0.471 1.06 1.25 12.5 Max 12.5 Max 10.0 Max
SDRI129-561M 560 20% 1KHz 0.650 1.01 0.98 12.5 Max 12.5 Max 10.0 Max
SDRI129-681M 680 20% 1KHz 0.730 0.83 0.96 12.5 Max 12.5 Max 10.0 Max
SDRI129-821M 820 20% 1KHz 0.824 0.81 0.94 12.5 Max 12.5 Max 10.0 Max
SDRI129-102M 1000 20% 1KHz 1.220 0.70 0.78 12.5 Max 12.5 Max 10.0 Max
SDRI129-122M 1200 20% 1KHz 1.330 0.64 0.79 12.5 Max 12.5 Max 10.0 Max
SDRI129-152M 1500 20% 1KHz 1.990 0.56 0.58 12.5 Max 12.5 Max 10.0 Max
SDRI129-182M 1800 20% 1KHz 2.180 0.48 0.54 12.5 Max 12.5 Max 10.0 Max
SDRI129-222M 2200 20% 1KHz 2.580 0.43 0.52 12.5 Max 12.5 Max 10.0 Max

Environmental Data:

  • Operating Temperature: -40 to +125 (Including coils self-temperature rise)

Test Equipment:

  • Inductance: HP4284A, HP4285A LCR meter or equivalent
  • Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284A+42841A or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Product Identification: SDRI 129 [Inductance Value] [Tolerance] [Packing]

  • Packing: T = Tape & Reel, B = Bulk Package
  • Inductance Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
  • External Dimensions: 129 indicates 12.512.510.0 mm

Packaging Information:

Part No. Tape Dimension (mm) W Tape Dimension (mm) P Tape Dimension (mm) H Reel Dimensions (mm) A Reel Dimensions (mm) B Reel Dimensions (mm) C Reel Dimensions (mm) D REEL (PCS) Inside Box (PCS) Outside Carton (PCS)
SDRI129 24 16 11.5 24.4 330 400 800 3200

Cover tape peel off condition:

  • Cover tape peel force: 10 to 120g
  • Noodle strip peeling angle: 165 to 180

Reliability Testing:

Item Requirements Test Methods and Remarks
Terminal Strength (SMT) Meet requirements without any loose terminal. Pulling test based on terminal area; Solder paste thickness: 0.12mm.
Terminal Strength (DIP) Meet requirements without any loose terminal. Pulling test based on terminal diameter (0.35mm to >1.25mm) with specified forces (5N to 40N) for 10 sec.
Resistance to Flexure No visible mechanical damage. Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec.
Dropping No case deformation or change in appearance; No short and no open. Drop packaged products from 1m high, 1 angle, 3 ridges, 6 surfaces, twice each.
Solderability Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. Solder temperature: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu, Flux: 25% Resin and 75% ethanol.
Vibration No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. Frequency: 10 to 55 Hz (and return), Amplitude: 1.5mm, Duration: 2 hours in 3 mutually perpendicular directions.
Thermal Shock No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. 100 cycles of temperature shock between -55~40 and 85~125. Transforming interval: Max. 20 sec.
Low temperature Storage No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. Temperature: -55~-402, Duration: 962 hours.
High temperature Storage No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. Temperature: 125~852, Duration: 962 hours.
Damp Heat (Steady States) No visible mechanical damage; Inductance change: Within 10% (Mn-Zn: Within 30%); Q factor change: Within 20%. Temperature: 602, Humidity: 90% to 95% RH, Duration: 962 hours.
Heat endurance of Reflow soldering No significant defects in appearance; L/L10% (Mn-Zn: L/L30%); Q/Q30% (SMD series only); DCR/DCR10%. Peak temperature: 260+0/-5, twice reflow.
Resistance to solvent test No case deformation or change in appearance or obliteration of marking. Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times.
Overload test During the test no smoke, no peculiar smell, no fire; The characteristic is normal after test. Apply twice rated current for 5 minutes.
Voltage resistance test During the test no breakdown; The characteristic is normal after test. DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils)

Recommended reflow soldering curve:

The recommended reflow conditions are set according to soldering equipment. Users should adjust and confirm according to their environment/equipment.

Reminders for Using These Products:

  • Storage period: within 12 months. Storage conditions: temperature 5~40C, humidity 35~65% RH or less.
  • Do not use or store in environments with gas corrosion (salt, acid, alkali, etc.).
  • Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
  • Handle products carefully to prevent damage from dropping or inappropriate removal.
  • Do not bend terminals with excessive stress to avoid wire fracture.
  • Do not rinse coils; contact the company if cleaning is necessary.
  • Do not expose products to magnets or magnetic fields.
  • Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance deterioration, or lifespan shortening.
  • Allow sufficient margin for thermal design due to self-heating when power is on.
  • For non-magnetic shield types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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