High saturation current LanTu Micro SDRI74-100NT shielded SMD power inductors for electronic devices
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Product Description
Shielded SMD Power Inductors - SDRI74 Series
Product Overview
The SDRI74 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DC resistance, these inductors are ideal for automatic mounting due to their high-precision dimensions. They are available in various package sizes and a wide inductance range, meeting RoHS, Halogen Free, and REACH compliance. Applications include power supplies for VTRs, LCD televisions, Notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO
- Origin: SHENZHEN, CHINA
- Series: SDRI74
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit Design: Closed magnetic circuit
- Mounting Type: SMD (Surface Mount Device)
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
General Specifications:
| Feature | Description |
|---|---|
| Operating Temperature | -55 to +125 (Including coil self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A or equivalent LCR meter |
| Test Equipment (Current) | HP4284+42841A or equivalent |
| Test Equipment (Q Factor) | HP4285A or equivalent |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification Example: SDRI 74 470 M T
| Component | Description |
|---|---|
| SDRI | Type (Shielded SMD Power Inductors) |
| 74 | External Dimensions (LWH): 7.57.54.5 mm |
| 470 | Inductance: 47 H |
| M | Inductance Tolerance: 20% |
| T | Packing: Tape & Reel |
Available Inductance Tolerances: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
External Dimensions (LWH): 7.57.54.5 mm
Recommended Land Pattern Dimensions (mm):
| Part No | A (Max) | B (Max) | C (Max) | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI74 | 7.5 | 7.5 | 4.5 | 1.8 | 5.0 | 1.6 | 4.8 | 2.2 |
Electrical Characteristics (Electrical specifications at 25):
| Part No | Inductance L(H) @0A | Tole | Test Freq Min | Q Min @ Test Freq | DCR () Max | Saturation Current Isat (A) Max | Temperature Rise Current Irms (A) Max |
|---|---|---|---|---|---|---|---|
| SDRI74-2R2N | 2.2 | 30% | 100KHz | 30 @ 1MHz | 0.0147 | 5.20 | 5.00 |
| SDRI74-3R3N | 3.3 | 30% | 100KHz | 30 @ 1MHz | 0.0214 | 4.60 | 4.00 |
| SDRI74-4R7N | 4.7 | 30% | 100KHz | 30 @ 1MHz | 0.0310 | 3.80 | 3.40 |
| SDRI74-6R8N | 6.8 | 30% | 100KHz | 30 @ 1MHz | 0.035 | 3.20 | 2.30 |
| SDRI74-8R2N | 8.2 | 30% | 100KHz | 30 @ 1MHz | 0.042 | 3.00 | 2.10 |
| SDRI74-100N | 10 | 30% | 100KHz | 35 @ 1MHz | 0.049 | 2.95 | 1.84 |
| SDRI74-120M | 12 | 20% | 100KHz | 35 @ 1MHz | 0.058 | 2.85 | 1.71 |
| SDRI74-150M | 15 | 20% | 100KHz | 35 @ 1MHz | 0.081 | 2.80 | 1.47 |
| SDRI74-180M | 18 | 20% | 100KHz | 35 @ 1MHz | 0.091 | 2.50 | 1.31 |
| SDRI74-220M | 22 | 20% | 100KHz | 35 @ 1MHz | 0.110 | 2.10 | 1.23 |
| SDRI74-270M | 27 | 20% | 100KHz | 35 @ 1MHz | 0.150 | 1.90 | 1.12 |
| SDRI74-330M | 33 | 20% | 100KHz | 35 @ 1MHz | 0.170 | 1.80 | 0.96 |
| SDRI74-390M | 39 | 20% | 100KHz | 35 @ 1MHz | 0.230 | 1.70 | 0.91 |
| SDRI74-470M | 47 | 20% | 100KHz | 35 @ 1MHz | 0.260 | 1.50 | 0.88 |
| SDRI74-560M | 56 | 20% | 100KHz | 35 @ 1MHz | 0.350 | 1.32 | 0.75 |
| SDRI74-680M | 68 | 20% | 100KHz | 35 @ 1MHz | 0.380 | 1.08 | 0.69 |
| SDRI74-820M | 82 | 20% | 100KHz | 35 @ 1MHz | 0.430 | 1.05 | 0.61 |
| SDRI74-101M | 100 | 20% | 100KHz | 40 @ 0.796MHz | 0.610 | 1.02 | 0.60 |
| SDRI74-121M | 120 | 20% | 100KHz | 40 @ 0.796MHz | 0.660 | 0.98 | 0.52 |
| SDRI74-151M | 150 | 20% | 100KHz | 40 @ 0.796MHz | 0.880 | 0.95 | 0.46 |
| SDRI74-181M | 180 | 20% | 100KHz | 40 @ 0.796MHz | 0.980 | 0.74 | 0.42 |
| SDRI74-221M | 220 | 20% | 100KHz | 40 @ 0.796MHz | 1.170 | 0.70 | 0.36 |
| SDRI74-271M | 270 | 20% | 100KHz | 40 @ 0.796MHz | 1.640 | 0.57 | 0.34 |
| SDRI74-331M | 330 | 20% | 100KHz | 40 @ 0.796MHz | 1.860 | 0.56 | 0.32 |
| SDRI74-391M | 390 | 20% | 100KHz | 40 @ 0.796MHz | 2.850 | 0.45 | 0.29 |
| SDRI74-471M | 470 | 20% | 100KHz | 40 @ 0.796MHz | 3.010 | 0.45 | 0.26 |
| SDRI74-561M | 560 | 20% | 100KHz | 40 @ 0.796MHz | 3.620 | 0.43 | 0.23 |
| SDRI74-681M | 680 | 20% | 100KHz | 40 @ 0.796MHz | 4.630 | 0.37 | 0.22 |
| SDRI74-821M | 820 | 20% | 100KHz | 40 @ 0.796MHz | 5.200 | 0.35 | 0.20 |
| SDRI74-102M | 1000 | 20% | 100KHz | 40 @ 0.796MHz | 6.000 | 0.33 | 0.18 |
Definitions:
- Saturation Current (Isat): DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser value between Isat and Irms.
Special Remind: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Packaging Specifications:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension H (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRI74 | 16 | 12 | 11.5 | 16.5 | 100 | 13 | 330 | 1000 | 3000 | 12,000 |
Cover tape peel off condition:
- a) Cover tape peel force shall be 10 to 120g
- b) Noodle strip peeling angle 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test: Define: A: sectional area of terminal A8mm2 force5N time:30sec; 8mm2<A20mm2 force 10N time: 10sec; 20mm2<A force 20N time: 10sec. Solder paste thickness:0.12mm. Solder the inductor to the testing jig using leadfree solder. Then apply a force in the Keep time: 101s Speed: 1.0mm/s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Terminal diameter(d) mm: 0.35d 0.50 Applied force:5N Duration: 10sec; 0.50d 0.80 Applied force:10N Duration: 10sec; 0.80d 1.25 Applied force:20N Duration: 10sec; D 1.25 Applied force:40N Duration: 10sec. Pull Force: applied gradually and maintained for 10 seconds. |
| Resistance to Flexure | 1. No visible mechanical damage. 2. Meet requirements. | Solder the inductor to the test jig (glass epoxy board) using leadfree solder. Flexure: 2mm. Pressurizing Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | 1. No case deformation or change in appearance. 2. No short and no open. | Drop the packaged products from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | 1. No visible mechanical damage. 2. Wetting shall exceed 75% coverage. 3. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol in weight. |
| Vibration | 1. No visible mechanical damage. 2. Inductance change: Within 10%. 3. Q factor change: Within 20%. | Solder the inductor to the testing jig. Subject to simple harmonic motion, amplitude 1.5mm, frequency 10 to 55 Hz and return to 10 Hz in 1 minute. Applied for 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Thermal Shock | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%). 3. Q factor change: Within 20%. | Start at (85~125) for T time, rush to (-55~40) for T time as one cycle, go through 100 cycles. Transforming interval: Max. 20 sec. Stabilize at normal condition for 1~2 hours. |
| Low temperature Storage | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%). 3. Q factor change: Within 20%. | Temperature: M(-55~-402). Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| High temperature Storage | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%). 3. Q factor change: Within 20%. | Temperature: N(125~852). Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Damp Heat (Steady States) | 1. No visible mechanical damage. 2. Inductance change: Within 10%. (Mn-Zn: Within 30%). 3. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1~2 hours before measuring. |
| Heat endurance of Reflow soldering | 1. No significant defects in appearance. 2. L/L10% (Mn-Zn: L/L30%). 3. Q/Q30% (SMD series only). 4. DCR/DCR10%. | Refer to the recommended reflow curve and go through reflow twice. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip parts into IPA solvent for 50.5Min, then dry at room temp for 5Min, then brushing making 10 times. |
| Overload test | 1. During the test no smoke, no peculiar smell, no fire. 2. The characteristic is normal after test. | Apply twice the rated current for 5 minutes. |
| Voltage resistance test | 1. During the test no breakdown. 2. The characteristic is normal after test. | For parts with two coils: DC1000V, Current: 1mA, Time: 1Min. Refer to catalogue of specific products. |
Recommended Reflow Soldering Curve:
The recommended reflow conditions are set according to soldering equipment. Users should adjust and confirm according to their specific environment/equipment.
Reminders for Using These Products:
- Storage: Within 12 months, under conditions (temperature: 5~40C, humidity: 35-65% RH or less). Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals as hand oil can reduce solderability. Handle products carefully to prevent damage from dropping or inappropriate removal. Do not bend terminals excessively.
- Cleaning: Do not rinse coils. Contact SXN if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Allow sufficient margin for thermal design as self-heating occurs when power is ON.
- Non-magnetic Shield Type: Carefully lay out coils on the PCB design to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina