LanTu Micro SDRI125-4R7NT Shielded Power Inductor for Automatic Mounting and Electronic Applications
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Product Description
Product Overview
The SDRI125 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high performance in demanding applications. Featuring a closed magnetic circuit for reduced leakage, high saturation current, and low DCR, these inductors ensure efficiency and reliability. Their highly accurate dimensions are ideal for automatic mounting, and they are available in various package sizes and inductance ranges. The series complies with RoHS, Halogen Free, and REACH standards, making them suitable for a wide array of electronic devices including VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC
- Series: SDRI125
- Type: Shielded SMD Power Inductors
- Origin: SHENZHEN, China
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit Design: Closed magnetic circuit
- Mounting Type: SMD (Surface Mount Device)
- Packaging Options: Bulk Package (B), Tape & Reel (T)
Technical Specifications
| Part No. | Inductance (H) @ 0A | Tolerance | Test Frequency (L) | Q Factor Min @ Test Freq | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max | External Dimensions (LWH) (mm) |
|---|---|---|---|---|---|---|---|---|
| SDRI125-1R0N | 1.0 | 30% | 100KHz | 20 @ 1MHz | 0.010 | 15.80 | 8.00 | 12.312.36.0 |
| SDRI125-2R2N | 2.2 | 30% | 100KHz | 20 @ 1MHz | 0.014 | 13.50 | 7.80 | 12.312.36.0 |
| SDRI125-2R4N | 2.4 | 30% | 100KHz | 20 @ 1MHz | 0.014 | 12.00 | 7.50 | 12.312.36.0 |
| SDRI125-3R3N | 3.3 | 30% | 100KHz | 20 @ 1MHz | 0.017 | 10.50 | 6.80 | 12.312.36.0 |
| SDRI125-4R7N | 4.7 | 30% | 100KHz | 30 @ 1MHz | 0.020 | 9.50 | 5.60 | 12.312.36.0 |
| SDRI125-5R8N | 5.8 | 30% | 100KHz | 30 @ 1MHz | 0.021 | 8.60 | 5.20 | 12.312.36.0 |
| SDRI125-8R2N | 8.2 | 30% | 100KHz | 30 @ 1MHz | 0.023 | 7.00 | 4.40 | 12.312.36.0 |
| SDRI125-100N | 10 | 30% | 100KHz | 35 @ 1MHz | 0.025 | 6.50 | 4.00 | 12.312.36.0 |
| SDRI125-120M | 12 | 20% | 100KHz | 35 @ 1MHz | 0.027 | 6.00 | 3.50 | 12.312.36.0 |
| SDRI125-150M | 15 | 20% | 100KHz | 35 @ 1MHz | 0.030 | 5.40 | 3.30 | 12.312.36.0 |
| SDRI125-180M | 18 | 20% | 100KHz | 35 @ 1MHz | 0.034 | 4.90 | 3.00 | 12.312.36.0 |
| SDRI125-220M | 22 | 20% | 100KHz | 35 @ 1MHz | 0.036 | 4.70 | 2.80 | 12.312.36.0 |
| SDRI125-270M | 27 | 20% | 100KHz | 35 @ 1MHz | 0.051 | 4.00 | 2.30 | 12.312.36.0 |
| SDRI125-330M | 33 | 20% | 100KHz | 35 @ 1MHz | 0.057 | 3.58 | 2.10 | 12.312.36.0 |
| SDRI125-390M | 39 | 20% | 100KHz | 35 @ 1MHz | 0.068 | 3.30 | 2.00 | 12.312.36.0 |
| SDRI125-470M | 47 | 20% | 100KHz | 35 @ 1MHz | 0.075 | 3.20 | 1.80 | 12.312.36.0 |
| SDRI125-560M | 56 | 20% | 100KHz | 35 @ 1MHz | 0.110 | 2.80 | 1.70 | 12.312.36.0 |
| SDRI125-680M | 68 | 20% | 100KHz | 35 @ 1MHz | 0.120 | 2.50 | 1.50 | 12.312.36.0 |
| SDRI125-820M | 82 | 20% | 100KHz | 35 @ 1MHz | 0.140 | 2.30 | 1.40 | 12.312.36.0 |
| SDRI125-101M | 100 | 20% | 100KHz | 40 @ 0.796MHz | 0.160 | 1.90 | 1.30 | 12.312.36.0 |
| SDRI125-121M | 120 | 20% | 100KHz | 40 @ 0.796MHz | 0.170 | 1.80 | 1.10 | 12.312.36.0 |
| SDRI125-151M | 150 | 20% | 100KHz | 40 @ 0.796MHz | 0.230 | 1.70 | 1.00 | 12.312.36.0 |
| SDRI125-181M | 180 | 20% | 100KHz | 40 @ 0.796MHz | 0.290 | 1.60 | 0.90 | 12.312.36.0 |
| SDRI125-221M | 220 | 20% | 100KHz | 40 @ 0.796MHz | 0.400 | 1.45 | 0.80 | 12.312.36.0 |
| SDRI125-271M | 270 | 20% | 100KHz | 40 @ 0.796MHz | 0.460 | 1.20 | 0.75 | 12.312.36.0 |
| SDRI125-331M | 330 | 20% | 100KHz | 40 @ 0.796MHz | 0.510 | 1.15 | 0.68 | 12.312.36.0 |
| SDRI125-391M | 390 | 20% | 100KHz | 40 @ 0.796MHz | 0.690 | 1.10 | 0.65 | 12.312.36.0 |
| SDRI125-471M | 470 | 20% | 100KHz | 40 @ 0.796MHz | 0.770 | 0.94 | 0.58 | 12.312.36.0 |
| SDRI125-561M | 560 | 20% | 100KHz | 40 @ 0.796MHz | 0.860 | 0.90 | 0.54 | 12.312.36.0 |
| SDRI125-681M | 680 | 20% | 100KHz | 40 @ 0.796MHz | 1.200 | 0.70 | 0.48 | 12.312.36.0 |
| SDRI125-821M | 820 | 20% | 100KHz | 40 @ 0.796MHz | 1.340 | 0.55 | 0.40 | 12.312.36.0 |
| SDRI125-102M | 1000 | 20% | 100KHz | 40 @ 0.796MHz | 1.530 | 0.44 | 0.35 | 12.312.36.0 |
Environmental Data
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment Used
- Inductance (L): HP4284A, HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- Quality Factor (Q): HP4285A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification Example
SDRI 125 470 M T
- Type: SDRI (Shielded SMD Power Inductors)
- Series: 125
- Inductance: 470 (47 H)
- Tolerance: M (20%)
- Packing: T (Tape & Reel)
External Dimensions (mm)
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SDRI125 | 12.5 | 12.5 | 6.0 | 5.0 | 7.6 | 2.9 | 7.0 | 5.4 |
Packaging Specifications
- Tape and Reel Dimensions: W=24mm, P=16mm, H=11.5mm
- Reel Dimensions: A=24.4mm, B=100mm, C=13mm, D=330mm
- Packing Quantity: Reel: 500 PCS, Inside Box: 1000 PCS, Outside Carton: 4000 PCS
- Cover tape peel off condition: Peel force 10 to 120g, Peel angle 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on GB/T 2423.60-2008. Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull force applied gradually for 10 sec, based on terminal diameter and GB/T 2423.60-2008. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. Based on JIS C 5321:1997. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop from 1m height in 1 angle, 3 ridges and 6 surfaces, twice in each direction. Based on GB/T 2423.7-2018. |
| Solderability | Terminals must have 95% minimum solder coverage. Wetting shall exceed 75% coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. Based on GB/T 2423.28-2005. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Simple harmonic motion, amplitude 1.5mm, frequency 10 to 55 Hz and return. Applied for 2 hours in each of 3 mutually perpendicular directions. Based on GB/T 2423.10-2019. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | 100 cycles of temperature cycling between high (85~125) and low (-55~40). Transforming interval: Max. 20 sec. Based on GB/T 2423.22-2012 Method Na. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Based on GB/T 2423.1-2008 Method Ab. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. Based on GB/T 2423.2-2008 Method Bb. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Based on GB/T 2423.3-2016. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10%. Q/Q30%. DCR/DCR10%. | Refer to reflow curve, go through reflow twice. Peak temperature: 260+0/-5. Based on GJB 360B-2009. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. Based on IEC 68-2-45:1993. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | Apply twice rated current for 5 minutes. Based on JIS C5311-6.13. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. Based on MIL-STD-202G Method 301. |
Recommended Reflow Soldering Curve
The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, conditions: 5~40C, 35~65% RH. Soldering of terminal electrodes may deteriorate if storage period elapses.
- Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that inhibit soldering. Handle products carefully to prevent damage from dropping or inappropriate removal.
- Terminal Bending: Do not bend terminals with excessive stress to avoid wire fracture.
- Cleaning: Do not rinse coils by yourself; contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or lifespan reduction.
- Self-Heating: Allow sufficient margin for thermal design as self-heating occurs when power is ON.
- Layout (Non-magnetic Shield Type): Carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina