Composite Structure Molding SMD Power Inductors LanTu Micro SMS1050-100MT Low Parasitic Capacitance
Molding SMD Power Inductors - SMS1050 Series
Product Overview
The SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. SMS1050 Series offers ultra-high current SMD power inductors designed with a thin profile for low DC resistance and high current handling. Featuring magnetic shielding for strong anti-electromagnetic interference, these inductors are suitable for high-density installations and offer high reliability due to their integral construction, providing excellent vibration resistance and ultra-low buzz noise. The composite structure contributes to low loss alloy powder die-casting, resulting in low impedance and small parasitic capacitance, leading to high efficiency and reduced winding losses. These inductors operate at frequencies up to 3MHz and have an absolute maximum voltage of 30VDC, complying with RoHS, Halogen Free, and REACH standards. They are ideal for applications such as PDA, notebooks, desktop and server applications, high current POL converters, battery-powered devices, and DC/DC converters in distributed power systems.
Product Attributes
- Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
- Product Type: Molding SMD Power Inductor
- Series: SMS1050
- Compliance: RoHS, Halogen Free, REACH
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Operating Temperature | -55 to +125 (Including coils self-temperature rise) |
| Absolute Maximum Voltage | 30VDC |
| Frequency | Up to 3MHz |
Electrical Characteristics (Electrical specifications at 25)
| Part No. | Inductance (L) (H) @ 0A | Tolerance | DCR (m) Typical | DCR (m) Max | Saturation Current (Isat) (A) Typical | Heat Rating Current (Irms) (A) Typical |
|---|---|---|---|---|---|---|
| SMS1050-R82M | 0.82 | 20% | 2.5 | 3.2 | 39.00 | 22.00 |
| SMS1050-1R0M | 1.0 | 20% | 2.8 | 3.5 | 30.00 | 20.30 |
| SMS1050-1R2M | 1.2 | 20% | 2.8 | 3.5 | 28.00 | 18.00 |
| SMS1050-1R5M | 1.5 | 20% | 3.9 | 4.8 | 25.00 | 16.00 |
| SMS1050-2R2M | 2.2 | 20% | 6.5 | 8.2 | 20.00 | 13.00 |
| SMS1050-3R3M | 3.3 | 20% | 9.2 | 12.0 | 18.00 | 10.00 |
| SMS1050-4R7M | 4.7 | 20% | 12.4 | 18.0 | 14.00 | 9.50 |
| SMS1050-5R6M | 5.6 | 20% | 18.9 | 25.0 | 13.00 | 8.50 |
| SMS1050-6R8M | 6.8 | 20% | 20.6 | 28.0 | 12.00 | 8.00 |
| SMS1050-8R2M | 8.2 | 20% | 27.4 | 35.0 | 10.00 | 7.00 |
| SMS1050-100M | 10 | 20% | 30.2 | 40.0 | 8.50 | 5.50 |
| SMS1050-150M | 15 | 20% | 48.0 | 55.0 | 7.00 | 4.50 |
| SMS1050-220M | 22 | 20% | 60.0 | 72.0 | 5.50 | 4.00 |
| SMS1050-330M | 33 | 20% | 89.0 | 105.0 | 5.50 | 3.50 |
| SMS1050-470M | 47 | 20% | 110.0 | 130.0 | 4.50 | 3.00 |
| SMS1050-680M | 68 | 20% | 190.0 | 210.0 | 3.00 | 2.00 |
Definitions:
Saturation Current (Isat): DC current at which inductance drops 30% from its value without current.
Heat Rating Current (Irms): The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current: The lesser value of Isat or Irms.
Special Remind: Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
Shape and Dimensions (dimensions are in mm)
| Part No. | A (Max) | B (0.30) | C (Max) | D (Typ) | E (Typ) | F | G | H |
|---|---|---|---|---|---|---|---|---|
| SMS1050 | 11.50 | 10.00 | 5.00 | 3.00 | 2.00 | 5.40 | 13.60 | 4.10 |
Inductance Tolerance Options
J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Packaging Options
B: Bulk Package, T: Tape & Reel
Recommended Land Pattern
(Image or diagram would typically be here)
Product Identification Example
SMS 1050 100 M T
Type: SMS (Molding SMD Power Inductor)
Series: 1050
Inductance: 100 (10 H)
Tolerance: M (20%)
Packaging: T (Tape & Reel)
Packaging Specifications
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SMS1050 | 24.0 | 16.0 | 11.5 | 24.4 | 100 | 13 | 330 | 500 | 1000 | 4000 |
Tape and Reel Specifications
Cover tape peel off condition:
a) Cover tape peel force shall be 10 to 120g.
b) Noodle strip peeling angle 165 to 180.
Reliability Testing
Terminal Strength: Based on GB/T 2423.60-2008. SMT and DIP variations with specific force and duration requirements based on terminal size/diameter. Inductors must meet requirements without loose terminals.
Resistance to Flexure: Based on JIS C 5321:1997. Requires no visible mechanical damage after applying a flexure of 2mm at a speed of 0.5mm/sec for 30 sec.
Dropping Test: Based on GB/T 2423.7-2018. Packaged products dropped from 1m height in 1 angle, 3 ridges, and 6 surfaces, twice in each direction. Requirements: No case deformation or change in appearance, no short, no open.
Solderability: Based on GB/T 2423.28-2005. Requires no visible mechanical damage, wetting exceeding 75% coverage, and terminals with 95% minimum solder coverage after dipping in solder at 2402 for 3 sec.
Vibration Test: Based on GB/T 2423.10-2019. Inductors subjected to simple harmonic motion (1.5mm amplitude, 10-55 Hz) for 2 hours in 3 mutually perpendicular directions. Requirements: No visible mechanical damage, inductance change within 10%, Q factor change within 20%.
Thermal Shock: Based on GB/T 2423.22-2012 Method Na. 100 cycles of temperature transition between (85~125) and (-55~40) with a max transforming interval of 20 sec. Requirements: No visible mechanical damage, inductance change within 10% (Mn-Zn: within 30%), Q factor change within 20%.
Low Temperature Storage: Based on GB/T 2423.1-2008 Method Ab. Stored at -55~-402 for 962 hours. Requirements: No visible mechanical damage, inductance change within 10% (Mn-Zn: within 30%), Q factor change within 20%.
High Temperature Storage: Based on GB/T 2423.2-2008 Method Bb. Stored at 125~852 for 962 hours. Requirements: No visible mechanical damage, inductance change within 10% (Mn-Zn: within 30%), Q factor change within 20%.
Damp Heat (Steady States): Based on GB/T 2423.3-2016. Stored at 602 and 90% to 95% RH for 962 hours. Requirements: No visible mechanical damage, inductance change within 10% (Mn-Zn: within 30%), Q factor change within 20%.
Heat Endurance of Reflow Soldering: Based on GJB 360B-2009. Subjected to reflow soldering twice with a peak temperature of 260+0/-5. Requirements: No significant defects in appearance, L/L 10% (Mn-Zn: L/L 30%), Q/Q 30% (SMD series only), DCR/DCR 10%.
Resistance to Solvent Test: Based on IEC 68-2-45:1993. Parts dipped in IPA solvent for 50.5 min, dried for 5 min, and brushed 10 times. Requirements: No case deformation, change in appearance, or obliteration of marking.
Overload Test: Based on JIS C5311-6.13. Applied twice the rated current for 5 minutes. Requirements: No smoke, no peculiar smell, no fire during test; characteristics normal after test.
Voltage Resistance Test: Based on MIL-STD-202G Method 301. Applied DC 1000V, 1mA for 1 min. Requirements: No breakdown during test; characteristics normal after test.
Recommended Reflow Soldering Curve
(Image or diagram of the reflow curve would typically be here)
Note: The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Store within 12 months under conditions of 5~40C and 35~65% RH. Exceeding this period may degrade solderability.
- Environment: Do not use or store in corrosive environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals by bare hands due to oil secretions that inhibit soldering. Handle products carefully to prevent damage from dropping or improper removal.
- Bending: Do not bend terminals with excessive stress to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetism: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
- Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on; ensure sufficient thermal design margin.
- Layout (Non-Magnetic Shield Type): Carefully lay out coils on the PCB to prevent malfunctions due to magnetic interference.
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