High Precision Shielded SMD Power Inductors LanTu Micro SDRH105R-100MT Suitable for Automatic Mounting
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Product Description
Product Overview
The SDRH105R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DC resistance. Featuring a closed magnetic circuit to minimize leakage, these inductors offer high-precision dimensions suitable for automatic mounting. They are available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards. Ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRH105R
- Type: Shielded SMD Power Inductors
- Origin: SHENZHEN
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit: Closed magnetic circuit design
- Mounting: Suitable for automatic mounting
Technical Specifications
General Specifications:
| Item | Specification |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A LCR meter or equivalent |
| Test Equipment (Current) | HP4284+42841A |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification:
| Component | Description |
|---|---|
| Type | SDRH |
| Inductance | e.g., 100 (for 10 uH) |
| Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packing | T: Tape & Reel, B: Bulk Package |
| External Dimensions (LWH) | 105R (10.310.55.0 mm) |
Shape and Dimensions:
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 10.3 | 10.5 | 5.0 | 7.7 | 3.0 | 1.2 | 3.6 | 1.7 | 7.3 |
(Dimensions are in mm)
Electrical Characteristics (SDRH105R Series):
| Part No. | Inductance (H) | Tol. | Test Freq. | DCR () Max @0A | Isat (A) Max | Irms (A) Max | Temp. Rise Current (A) Max (T 40) |
|---|---|---|---|---|---|---|---|
| SDRH105R-3R3N | 3.3 | 30% | 100KHz | 0.013 | 9.50 | 6.50 | - |
| SDRH105R-4R7N | 4.7 | 30% | 100KHz | 0.016 | 9.20 | 6.30 | - |
| SDRH105R-6R8N | 6.8 | 30% | 100KHz | 0.020 | 7.00 | 6.00 | - |
| SDRH105R-8R2N | 8.2 | 30% | 100KHz | 0.023 | 5.50 | 5.00 | - |
| SDRH105R-100N | 10 | 30% | 100KHz | 0.250 | 5.10 | 4.40 | - |
| SDRH105R-120N | 12 | 30% | 100KHz | 0.032 | 4.90 | 4.00 | - |
| SDRH105R-150N | 15 | 30% | 100KHz | 0.040 | 4.20 | 3.60 | - |
| SDRH105R-180M | 18 | 20% | 100KHz | 0.046 | 3.70 | 3.40 | - |
| SDRH105R-220M | 22 | 20% | 100KHz | 0.058 | 3.30 | 3.20 | - |
| SDRH105R-270M | 27 | 20% | 100KHz | 0.650 | 3.20 | 3.00 | - |
| SDRH105R-330M | 33 | 20% | 100KHz | 0.810 | 2.70 | 2.60 | - |
| SDRH105R-390M | 39 | 20% | 100KHz | 0.103 | 2.48 | 2.50 | - |
| SDRH105R-470M | 47 | 20% | 100KHz | 0.122 | 2.35 | 2.30 | - |
| SDRH105R-560M | 56 | 20% | 100KHz | 0.144 | 2.30 | 2.10 | - |
| SDRH105R-680M | 68 | 20% | 100KHz | 0.193 | 2.00 | 1.90 | - |
| SDRH105R-820M | 82 | 20% | 100KHz | 0.219 | 1.80 | 1.60 | - |
| SDRH105R-101M | 100 | 20% | 100KHz | 0.247 | 1.50 | 1.35 | - |
| SDRH105R-121M | 120 | 20% | 100KHz | 0.298 | 1.40 | 1.18 | - |
| SDRH105R-151M | 150 | 20% | 100KHz | 0.355 | 1.30 | 1.10 | - |
| SDRH105R-181M | 180 | 20% | 100KHz | 0.393 | 1.20 | 1.00 | - |
| SDRH105R-221M | 220 | 20% | 100KHz | 0.483 | 1.08 | 0.94 | - |
| SDRH105R-271M | 270 | 20% | 100KHz | 0.632 | 0.88 | 0.80 | - |
| SDRH105R-331M | 330 | 20% | 100KHz | 0.780 | 0.85 | 0.73 | - |
| SDRH105R-391M | 390 | 20% | 100KHz | 0.957 | 0.78 | 0.70 | - |
| SDRH105R-471M | 470 | 20% | 100KHz | 1.220 | 0.71 | 0.54 | - |
| SDRH105R-561M | 560 | 20% | 100KHz | 1.352 | 0.65 | 0.52 | - |
| SDRH105R-681M | 680 | 20% | 100KHz | 1.519 | 0.59 | 0.51 | - |
| SDRH105R-821M | 820 | 20% | 100KHz | 1.694 | 0.51 | 0.48 | - |
| SDRH105R-102M | 1000 | 20% | 100KHz | 1.946 | 0.49 | 0.42 | - |
Note: Saturation Current: DC current at which inductance drops 30% from its value without current. Temperature Rise Current: the actual value of DC current when the temperature rise is T 40 (Ta=25). Rated DC Current: The lesser value of Isat or Irms. Component temperature is affected by circuit design, PCB trace size/thickness, airflow, and other cooling provisions; verify in end application.
Packaging Specifications:
| Part No. | Tape Width (W) (mm) | Pitch (P) (mm) | Tape Width (W1) (mm) | Reel Dia. (A) (mm) | Reel Width (B) (mm) | Reel Hole Dia. (C) (mm) | Reel Hub Dia. (D) (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 24 | 16 | 11.5 | 24.4 | 60 | 13 | 330 | 800 | 1600 | 6400 |
Cover Tape Peel Off Condition:
- Peel Force: 10 to 120g
- Peeling Angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal sectional area (A). Solder paste thickness: 0.12mm. Speed: 1.0mm/s. Keep time: 101s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull force applied gradually and maintained for 10 seconds, based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin/75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to jig, subjected to simple harmonic motion (10-55 Hz, 1.5mm amplitude) for 2 hours in 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | 100 cycles of temperature transition between 85~125 and -55~40. Transforming interval: Max. 20 sec. Stabilize at normal condition for 1-2 hours. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 85~1252. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: 30%). Q/Q30% (SMD series only). DCR/DCR10%. | Reflow twice according to recommended curve. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | No smoke, no peculiar smell, no fire during test. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min (for parts with two coils). Refer to catalogue for specific products. |
Recommended Reflow Soldering Curve:
(Refer to the provided graph in the original document for detailed temperature profiles.)
Reminders for Using These Products:
- Storage: Within 12 months, under 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals with bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not excessively bend terminals to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Always preheat components before soldering. Ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering Corrections: Perform corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Carefully consider coil placement in PCB design to avoid malfunctions due to magnetic interference.
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Contact Person
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