Durable Shielded SMD Power Inductors LanTu Micro SDRS6028-220NT Suitable for Various Electronic Uses
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Product Description
Shielded SMD Power Inductors - SDRS6028 Series
Product Overview
The SDRS6028 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance applications requiring efficient power management. Featuring a closed magnetic circuit design to minimize leakage flux, these inductors offer high saturation current and low DC resistance. Their high-precision dimensions ensure suitability for automatic mounting processes. The series is available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for thin-screen TVs, LCDs, AV equipment, gaming devices, and DC/DC converters, these inductors provide reliable performance in demanding electronic environments.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRS6028
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Origin: Shenzhen, China (implied by company name and location)
Technical Specifications
General Specifications
| Feature | Description |
|---|---|
| High Saturation Current | Yes |
| Low DCR | Yes |
| Closed Magnetic Circuit Design | Reduces leakage flux |
| Dimensions for Automatic Mounting | High accuracy |
| Package Size Options | Various |
| Inductance Range | Wide |
| Operating Temperature | -40 to +125 (including coil self-temperature rise) |
Applications
- Thin-screen TVs
- LCDs
- AV equipment
- Gaming equipment
- Other electrical devices
- DC/DC converters
Test Equipment Used
- Inductance (L): HP4284A, HP4285A or equivalent LCR meter
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification Example
SDRS 6028 4R7 N T
- Type: SDRS (Shielded SMD Power Inductors)
- Series: 6028 (corresponds to dimensions 6.0x6.0x2.8 mm)
- Inductance: 4R7 (4.7 H)
- Inductance Tolerance: N (30%)
- Packing: T (Tape & Reel)
External Dimensions
| Part No. | L (mm) | W (mm) | H (mm) | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | I (mm) | J (mm) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRS6028 | 6.00.2 | 6.00.2 | 2.80.2 | 3.0 | 2.0 | 2.2 | 2.0 | 3.0 | 2.0 | 3.0 |
Electrical Characteristics (at 25)
| Part No. | Inductance (H) | Tolerance | Test Freq (KHz) | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SDRS6028-4R7N | 4.7 | 30% | 100 | 0.036 | 1.60 | 2.50 |
| SDRS6028-6R8N | 6.8 | 30% | 100 | 0.052 | 1.50 | 2.20 |
| SDRS6028-100N | 10 | 30% | 100 | 0.068 | 1.30 | 1.80 |
| SDRS6028-150N | 15 | 30% | 100 | 0.100 | 1.00 | 1.40 |
| SDRS6028-220N | 22 | 30% | 100 | 0.120 | 0.77 | 1.30 |
| SDRS6028-330N | 33 | 30% | 100 | 0.180 | 0.69 | 1.10 |
| SDRS6028-470N | 47 | 30% | 100 | 0.270 | 0.59 | 0.92 |
| SDRS6028-680N | 68 | 30% | 100 | 0.390 | 0.50 | 0.78 |
Note on Currents:
- Saturation Current: DC current at which inductance drops 30% from its value without current.
- Temperature Rise Current: The actual DC current when the temperature rise is T 40 (Ta=25).
- Rated DC Current: The lesser of Isat or Irms.
- Special Reminder: Part temperature is influenced by circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions. Part temperature should be verified in the end application.
Packaging Specifications
| Part No. | Tape Width (mm) | Pitch (mm) | Tape Width 1 (mm) | Reel Diameter (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) | Total Quantity per Carton |
|---|---|---|---|---|---|---|---|---|
| SDRS6028 | 16 | 12 | 7.5 | 16.4 | 60 | 330 | 2000 | 24,000 |
Cover Tape Peel Off Condition:
- Peel Force: 10 to 120g
- Peel Angle: 165 to 180
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without loose terminal. | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm. Reference: GB/T 2423.60-2008. |
| Terminal Strength (DIP) | Meet requirements without loose terminal. | Pull force applied gradually for 10 sec (force varies by terminal diameter). Reference: GB/T 2423.60-2008. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm, Speed: 0.5mm/sec, Keep time: 30 sec. Reference: JIS C 5321:1997. |
| Dropping Test | No case deformation or appearance change, no short/open. | Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice per direction. Reference: GB/T 2423.7-2018. |
| Solderability | Wetting > 75% coverage, Terminals 95% min solder coverage. | Solder temp: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin/75% ethanol. Reference: GB/T 2423.28-2005. |
| Vibration Test | No visible mechanical damage, Inductance change: 10%, Q factor change: 20%. | Frequency 10-55 Hz, amplitude 1.5mm, 2 hours per direction (total 6 hours). Reference: GB/T 2423.10-2019. |
| Thermal Shock | No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20%. | 100 cycles of -55~40 to 85~125. Transforming interval: Max. 20 sec. Reference: GB/T 2423.22-2012 Method Na. |
| Low Temperature Storage | No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20%. | Temperature: -55~-402, Duration: 962 hours. Reference: GB/T 2423.1-2008 Method Ab. |
| High Temperature Storage | No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20%. | Temperature: 85~1252, Duration: 962 hours. Reference: GB/T 2423.2-2008 Method Bb. |
| Damp Heat (Steady States) | No visible mechanical damage, Inductance change: 10% (Mn-Zn: 30%), Q factor change: 20%. | Temperature: 602, Humidity: 90-95% RH, Duration: 962 hours. Reference: GB/T 2423.3-2016. |
| Heat Endurance of Reflow Soldering | No significant defects, L/L10% (Mn-Zn: 30%), Q/Q30%, DCR/DCR10%. | Reflow twice per recommended curve, Peak temp: 260+0/-5. Reference: GJB 360B-2009. |
| Resistance to Solvent Test | No case deformation or appearance change. | Dip in IPA for 50.5 min, dry 5 min, brush 10 times. Reference: IEC 68-2-45:1993. |
| Overload Test | No smoke, smell, or fire during test. Characteristics normal after test. | Apply twice rated current for 5 minutes. Reference: JIS C5311-6.13. |
| Voltage Withstanding Test | No breakdown during test. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min. For parts with two coils. Reference: MIL-STD-202G Method 301. |
Recommended Reflow Soldering Curve
Refer to the provided graph for recommended reflow conditions. Users should adjust and confirm conditions based on their specific environment and equipment.
Reminders for Using These Products
- Storage: Within 12 months, at 5~40C and 35-65% RH. Solderability may deteriorate after storage period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals due to hand oils. Handle products carefully to prevent damage.
- Terminal Bending: Do not bend terminals excessively to avoid wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Preheat components before soldering. Temperature difference between solder and chip should not exceed 150C.
- Soldering Corrections: Corrections after mounting should be within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Self-Heating: Allow sufficient thermal design margin as devices self-heat when powered on.
- Non-Shielded Type Layout: Carefully lay out coils for non-magnetic shield types to prevent malfunctions due to magnetic interference.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina