Compact Mini Molded Chip Power Inductor Linepri LMSC2016102R2MTA Featuring Low Resistance and High Current
Price:
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MOQ:
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Delivery Time:
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Product Description
Product Description
The LMSC2016102R2MTA is a Mini Molded Chip Power Inductor. It is constructed using soft magnetic powder, a coil, and electrode pins, which are pressed, formed, and solidified. This molded inductance features a closed magnetic circuit, offering advantages such as anti-electromagnetic interference, high installation density, and suitability for SMT processes. It is primarily used for energy storage or filtering in electronic circuits.
Key Features
- Metal material for large current and low loss
- Closed magnetic circuit design reduces leakage flux
- Super low resistance, ultra-high current rating
- Halogen-free, RoHS compliant
Typical Applications
- PDA, notebook, Smart phone, and server applications
- Battery-powered devices
- DC/DC converters in distributed power systems
Outline Dimensions
| Type | A (mm) | B (mm) | C (mm) | D (mm) | L (mm) | G (mm) | H (mm) |
| 201610 | 2.00.2 | 1.60.2 | 1.0Max | 0.7Typ | 2.1 | 0.5 | 1.7 |
Technical Specifications
| Part Number | Inductance (L) (H) | Test Frequency (MHz) | DC Resistance (Typ/Max) (m) | Saturation Current (Isat) (A) | Temperature Rise Current (Irms) (A) | Rated Voltage Max. (V) |
| LMSC2016102R2MTA | 2.2 | 1 | 86 / 92 | 3.0 | 2.8 | 20 |
Notes:
- Inductance Tolerance: 20%
- All test data is referenced to 25 ambient.
- Test Condition: 1MHz, 1.0Vrms.
- Idc: DC current (A) that will cause an approximate T of 40.
- Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Operating Temperature Range: -40 to +125.
- The part temperature (ambient + temp rise) should not exceed 125 under the worst-case operating conditions.
- The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Reliability Test Items
| Test Item | Requirements | Test Methods and Remarks |
| Solderability | Appearance: no obvious damage. Coverage area of new solder on electrode surface: > 95%. | Solder: Sn-free Ag(3.0-4.0)Cu(0.5-1.0); Solder temperature: 2455; Immersion time: 31 seconds. |
| Terminal Strength | Sample shall not fall off test board. No disconnection of leads or cracks on product matrix. Inductance value change: 10%. | Solder samples onto test board using reflow soldering. Push perpendicular to side of sample at 30mm/min until 12.5N is reached. Duration: 101 seconds. Push-head radius: 0.5mm. |
| Bending | Sample must not drop off test board. No disconnection of lead-out terminals or cracks on product matrix. | Solder samples onto test board using reflow soldering. Apply force until bending degree of test board reaches 2mm. PCB size: 100401.0 (or 0.8mm) mm. Bending duration: 30s. Test rate: 0.5mm/s. |
| Reflow | Appearance: no obvious mechanical damage. Inductance value change: 10%. | Max. 260, for 3 times. |
| Long-term humid heat | Appearance: no hidden cracks, rust, or excessive glue. Inductance value change: 10%. | Temperature: 60. Humidity: 95%RH. Time: 1000H +24/-0 hours. Test after standing for 1H. |
| Dropping | Appearance: no obvious damage. Inductance value change: 10%. | Solder samples onto test boards using reflow soldering, then place into drop-test boxes. Drop boxes from 1 meter height onto a marble floor. Drop boxes onto each of 6 faces three times (18 drops total). Counterweight: 250g 20g. |
| Long-term high temperature and high humidity | Appearance: no hidden cracks, rust, glue overflow or obvious damage. Inductance value change: 10%. | Temperature: 852. Humidity: 855%. Duration: 1000H +24/0 hours. Test after standing for 1H. |
| Low-temperature storage | Surface: free of hidden cracks, rust, glue overflow and obvious damage. Inductance value change: 10%. | Temperature: -402. Time: 1000 +24/-0 hours. Test after standing for 1 hour. |
| High-temperature storage | Surface: free of hidden cracks, rust, glue overflow and obvious damage. Inductance value change: 10%. | Temperature: 125+2/-0. Time: 1000+24/-0 hours. Test after standing for 1 hour. |
| Long-term durability | Surface: free of hidden cracks, rust, glue overflow and obvious damage. Inductance value change: 10%. | Temperature: 85 2. Duration: 1000 + 24 / -0 hours. Applied current: Rated current. Conduct test after standing for 1 hour. |
| Thermal Shock | Surface: free of hidden cracks, rust, glue overflow and obvious damage. Inductance value change: 10%. | -55+0/-5 for 303 min room temp within 5 min 125+5/-0 for 303 min room temp. Conversion time: 5 minutes Max. Cycles: 100. Conduct test after standing for 1 hour. |
| Vibration | No parts falling off or cracks. Inductance value change: 10%. | Solder samples onto test board by reflow soldering. Acceleration: 5g. Sweep speed: 20 min/cycle. Cycles: 12 cycles per axis (X, Y, Z), 36 total. Frequency: 10 - 2000Hz. |
| Humid heat load (60/95%RH + loading) | Surface: free of hidden cracks, rust, glue overflow and obvious damage. Inductance value change: 10%. | Temperature: 60. Humidity: 95%RH. Applied Current: Rated current. Duration: 1000H +24/-0 hours. Conduct test after standing for 1 hour. |
Packaging and Storage
Tape Packaging Dimensions
| Dimensions Code (mm) | A0 (mm) | B0 (mm) | K0 (mm) | T (mm) | Units/Reel |
| 1.950.05 | 2.350.05 | 1.150.05 | 0.250.05 | 3K |
Tape Direction
Reel Dimensions
Peel Force of Top Cover Tape
Peel speed: approx. 300 mm/minute. Peel force: 0.1 to 0.7N.
Storage Recommendations
Recommended conditions: -10~40, 70% RH (Max.). Use within one year from delivery. Check solderability before usage if stored over 6 months.
Reflow Profile
Reflow Soldering Method
Pre-Heat: 150 ~ 200 (60~120 seconds). Peak Temperature (Tp): 255~260 (Max. 30 seconds). Time above 217: 60~150 seconds. Time from 25 to peak temperature: 8 minutes max.
Soldering Iron Method
3505 (max. 3 seconds).
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina