SMD Power Inductor Microgate MAPM0420F-R47M-LF Featuring Stable Inductance and High Current Capacity
Product Overview
The MAPM series of SMD Power Inductors are designed for various electronic applications. They offer reliable performance and are manufactured by Shenzhen Microgate Technology Co., Ltd.
Product Attributes
- Brand: Microgate
- Origin: Shenzhen, P.R.C.
- Material: Core: Carbonyl Iron Powder, Wire: Polyester-Imide, Terminal: Tin Covered Copper
- Certifications: Lead-Free
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR (m) Typ. | Max Irms (A) | Isat (A) Typ. | Operating Temperature |
| MAPM0420F-R22M-LF | 0.2220% | 8 | 9.0 | 12.0 | -55 to +125 |
| MAPM0420F-R36M-LF | 0.3620% | 15 | 7.0 | 10.0 | -55 to +125 |
| MAPM0420F-R47M-LF | 0.4720% | 14 | 6.0 | 9.0 | -55 to +125 |
| MAPM0420F-R56M-LF | 0.5620% | 18 | 5.0 | 8.0 | -55 to +125 |
| MAPM0420F-1R0M-LF | 1.020% | 27 | 4.5 | 7.0 | -55 to +125 |
| MAPM0420F-1R5M-LF | 1.520% | 45 | 4.0 | 6.0 | -55 to +125 |
| MAPM0420F-2R2M-LF | 2.220% | 58 | 3.0 | 4.0 | -55 to +125 |
| MAPM0420F-3R3M-LF | 3.320% | 87 | 2.0 | 3.0 | -55 to +125 |
| MAPM0420F-4R7M-LF | 4.720% | 150 | 2.0 | 3.0 | -55 to +125 |
| MAPM0420F-100M-LF | 1020% | 200 | 1.5 | 1.8 | -55 to +125 |
Dimensions
| Model | A (Max.) | B (Max.) | C (Max.) | D (0.3) | E (0.5) | F | G | H |
| MAPM0420F | 4.9 | 4.4 | 2.0 | 1.0 | 1.5 | 2.30 | 4.95 | 2.16 |
Recommended Soldering Conditions
Flow Soldering Conditions: Pre-heating: temperature difference between solder and product surface 150. Cooling into solvent: temperature difference 100.
Reflow Soldering Conditions:
| Profile Feature | Lead-Free Assembly |
| Average Ramp-Up Rate (Ts max. to Tp) | 3 C/second max. |
| Preheat Temperature Min (Ts min.) | 150 |
| Preheat Temperature Max (Ts max.) | 200 |
| Preheat Time ( ts min to ts max.) | 60-180 seconds |
| Time maintained above Temperature (TL) | 217 |
| Time maintained above Time (tL) | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 260 |
| Peak/Classification Time (Tp) | 3-4 seconds |
| Time within 5 C of actual Peak Temperature (tp) | 20-40 seconds |
| Ramp-Down Rate | 6C/second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
Rework with Soldering Iron: Pre-heating: 150, 1 minute min. Tip temperature: 280 max. Soldering iron output: 20w max. End of soldering iron: 1mm max. Soldering time: 3 seconds max.
Packaging
Packaging Quantities: 3000PCS/Reel.
Peeling Strength of Cover Tape: 0.1N to 1.3 N.
Products Storage
Storage Period: Products inspected over 6 months ago should be examined. Solderability should be checked if this period is exceeded.
Storage Conditions: Temperature: -10 ~+ 40. Humidity: Less than 80% relative. No rapid change in temperature and humidity. Avoid corrosive gases, heat shock, vibration, and direct sunlight. Store in airtight packaged condition on a palette.
Get in Touch
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