Lead Free Electronic Component Microgate MPIT5040-2R2M-LF SMD Power Inductor for Circuit Integration
SMD Power Inductor - MPIT5040 Series
The MPIT5040 series SMD power inductors are designed for various electronic applications. This specification document outlines the product details, technical characteristics, testing conditions, and recommended usage for these components manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Product Name: (SMD power inductor)
- Series: MPIT5040 Series
- Environmental Compliance: Lead free products (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR 30% () | Saturation Current Isat (A) Max. | Temperature Rise Current Irms (A) Max. | Self-Resonant Frequency SRF (MHz) |
|---|---|---|---|---|---|
| MPIT5040-1R0N-LF | 1.0 30% | 0.012 | 7.35 | 4.90 | 117 |
| MPIT5040-1R5N-LF | 1.530% | 0.015 | 6.30 | 4.30 | 86 |
| MPIT5040-2R2N-LF | 2.230% | 0.019 | 4.90 | 3.80 | 50 |
| MPIT5040-2R7N-LF | 2.730% | 0.022 | 4.30 | 3.60 | 37 |
| MPIT5040-3R3N-LF | 3.3 30% | 0.024 | 3.95 | 3.40 | 32 |
| MPIT5040-3R9N-LF | 3.9 30% | 0.027 | 3.55 | 3.20 | 29 |
| MPIT5040-4R7N-LF | 4.730% | 0.030 | 3.50 | 3.00 | 28 |
| MPIT5040-6R8M-LF | 6.820% | 0.043 | 2.90 | 2.50 | 21 |
| MPIT5040-100M-LF | 1020% | 0.064 | 2.35 | 2.10 | 18 |
| MPIT5040-150M-LF | 1520% | 0.086 | 2.00 | 2.00 | 13 |
| MPIT5040-220M-LF | 2220% | 0.129 | 1.60 | 1.50 | 11 |
| MPIT5040-330M-LF | 3320% | 0.188 | 1.30 | 1.20 | 9 |
| MPIT5040-470M-LF | 4720% | 0.272 | 1.10 | 1.00 | 7 |
| MPIT5040-680M-LF | 6820% | 0.400 | 0.90 | 0.80 | 6 |
| MPIT5040-101M-LF | 10020% | 0.560 | 0.75 | 0.70 | 5 |
Dimensions
| Dimensions | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| Value (mm) | 5.00.2 | 5.00.2 | 4.1Max. | 2.00.3 | 1.50.3 | 4.0Typ. | 1.5 Typ. | 3.6 Typ. |
Materials
| Item | Material |
|---|---|
| Core | Ni-Zn Ferrite |
| Wire | Enameled Copper Wire |
| Terminal Electrode | Ag/Ni/Sn/Cu |
| Magnetic Glue | Epoxy resin and magnetic powder |
Testing Conditions
Unless otherwise specified:
- Temperature: Ordinary Temperature (5 to 35)
- Humidity: Ordinary Humidity (25 to 85% RH)
In case of doubt:
- Temperature: 202
- Humidity: 60 to 75% RH
- Atmospheric Pressure: 86 to 106 kPa
Operating Conditions
The part normal work be allowed ambient temperature: -40 ~ +125.
Recommended Soldering Conditions
Product can be applied to flow and reflow soldering.
Flux, Solder
- Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt%.
- Use Sn solder.
Flow Soldering Conditions
Pre-heating temperature difference between solder and product surface: max 150. Cooling temperature difference after soldering: max 100.
Reflow Soldering Conditions
Refer to the reflow curve provided in the datasheet. Peak temperature: 260+5/-0 for 3-4 seconds.
Storage
Storage conditions are detailed in section 11 of the original document.
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