SMD Power Inductor Microgate MPIT4018-100M-LF Series for Electronic Assembly Applications
SMD Power Inductor - MPIT4018 Series
The MPIT4018 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by Shenzhen Microgate Technology Co., Ltd.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Product Series: MPIT4018 Series
- Environmental Compliance: Lead-free products (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
| MPIT4018-R24M-LF | 0.2420% | 0.016 | 0.012 | 6.50 | 7.00 | 4.60 | 5.00 |
| MPIT4018-R68M-LF | 0.6820% | 0.025 | 0.021 | 6.00 | 7.00 | 3.80 | 4.15 |
| MPIT4018-1R0M-LF | 1.020% | 0.030 | 0.025 | 4.55 | 4.85 | 3.40 | 3.80 |
| MPIT4018-1R2M-LF | 1.220% | 0.030 | 0.025 | 4.20 | 4.80 | 3.40 | 3.80 |
| MPIT4018-1R5M-LF | 1.520% | 0.036 | 0.030 | 3.90 | 4.25 | 2.95 | 3.20 |
| MPIT4018-2R2M-LF | 2.220% | 0.048 | 0.040 | 3.15 | 3.40 | 2.60 | 2.90 |
| MPIT4018-2R7M-LF | 2.720% | 0.060 | 0.050 | 2.70 | 3.00 | 2.20 | 2.50 |
| MPIT4018-3R3M-LF | 3.320% | 0.060 | 0.050 | 2.70 | 3.00 | 2.20 | 2.50 |
| MPIT4018-3R9M-LF | 3.920% | 0.078 | 0.065 | 2.60 | 2.80 | 2.00 | 2.20 |
| MPIT4018-4R7M-LF | 4.720% | 0.078 | 0.065 | 2.10 | 2.30 | 2.00 | 2.20 |
| MPIT4018-6R8M-LF | 6.820% | 0.108 | 0.090 | 1.70 | 1.85 | 1.70 | 1.90 |
| MPIT4018-100M-LF | 1020% | 0.168 | 0.140 | 1.40 | 1.55 | 1.20 | 1.30 |
| MPIT4018-150M-LF | 1520% | 0.228 | 0.190 | 1.15 | 1.25 | 1.00 | 1.20 |
| MPIT4018-220M-LF | 2220% | 0.336 | 0.280 | 1.00 | 1.10 | 0.95 | 1.10 |
| MPIT4018-330M-LF | 3320% | 0.480 | 0.400 | 0.80 | 0.90 | 0.75 | 0.85 |
| MPIT4018-470M-LF | 4720% | 0.720 | 0.600 | 0.70 | 0.80 | 0.60 | 0.70 |
| MPIT4018-560M-LF | 5620% | 0.912 | 0.760 | 0.65 | 0.80 | 0.53 | 0.58 |
| MPIT4018-101M-LF | 10020% | 1.740 | 1.450 | 0.45 | 0.55 | 0.30 | 0.35 |
| MPIT4018-221M-LF | 22020% | 3.600 | 3.000 | 0.30 | 0.34 | 0.21 | 0.23 |
Dimensions
| Dimensions in mm | A | B | C | D | E | f | g | h |
| Value | 4.00.2 | 4.00.2 | 1.8 Max. | 2.10.2 | 0.950.2 | 1.9Typ. | 4.1Typ. | 3.7 Typ. |
Operating Conditions
- Ambient Temperature: -40 ~ +125
Reliability and Test Conditions
High temperature storage test: 1252 for 1000 hours. Requirements: No case deformation, |L|/L10% after 244 hours at room temperature.
Low temperature storage test: -552 for 1000 hours. Requirements: No case deformation, |L|/L10% after 244 hours at room temperature.
Humidity test: 85, 85% RH for 1000 hours. Requirements: No case deformation, |L|/L10% after 244 hours at room temperature.
Thermal shock test: 1000 cycles of -40 (30 min) to 125 (30 min).
Solderability test: Terminal area must have 90% min. solder coverage. Dip pads in flux then dip in solder pot at 2455 for 50.1 seconds.
Heat endurance of reflow soldering: No case deformation, |L|/L10% after 3 reflow cycles. Peak temperature: 260+5/-0.
Vibration test: 10~55Hz, 1.5mm amplitude in each of 3 mutually perpendicular directions for 2 hours each (total 6 hours).
Drop test: Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push test: 17.64N force for 10 seconds. Pulling test: Apply force in X, Y direction. Bending test: Deflection of 2mm at the middle point of PCB, speed 0.5mm/sec, hold for 601s.
Loading at High Temperature: 852 for 1000 hours with rated current applied. Requirements: No case deformation, |L|/L10% after 244 hours at room temperature.
Recommended Soldering Conditions
Flux: Use rosin-based flux. Do not use highly acidic flux with halide content exceeding 0.2wt%.
Solder: Use Sn solder.
Flow soldering conditions: Temperature difference between product surface and solder during pre-heating should not exceed 150. Temperature difference during cooling should not exceed 100.
Reflow soldering conditions: Pre-heating: 150, 1 minute max. Peak temperature: 350, 3 seconds max.
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