SMD power inductor microgate MPIT6028-4R7M-LF featuring ferrite core and enameled copper wire

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Product Description

SMD Power Inductor MPIT6028-series

The MPIT6028-series is a range of SMD power inductors designed for various electronic applications. These inductors are constructed with a ferrite core and enameled copper wire, ensuring reliable performance. They are lead-free and suitable for flow and reflow soldering processes.

Product Attributes

Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
Origin: Shenzhen, P.R.C.
Material: Ferrite Core, Enameled Copper Wire, Sn99.7-Cu0.3 Solder, Epoxy Adhesive
Certifications: Lead-free products

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR (m)max	Isat (A) max	Irms (A) max	Tolerance
MPIT6028-0R9N-LF	0.9	16.9	6.6	4.6	30%
MPIT6028-1R5N-LF	1.5	20.8	5.0	4.2	30%
MPIT6028-2R2N-LF	2.2	26	4.2	3.7	30%
MPIT6028-3R0N-LF	3.0	29.9	3.6	3.4	30%
MPIT6028-4R7M-LF	4.7	40.3	2.7	3.0	20%
MPIT6028-6R8M-LF	6.8	54.7	2.2	2.5	20%
MPIT6028-100M-LF	10	84.5	1.9	1.9	20%
MPIT6028-150M-LF	15	123.5	1.6	1.8	20%
MPIT6028-220M-LF	22	175.5	1.3	1.4	20%
MPIT6028-330M-LF	33	286	1.1	1.1	20%
MPIT6028-470M-LF	47	390	0.95	0.92	20%
MPIT6028-680M-LF	68	546	0.76	0.77	20%
MPIT6028-101M-LF	100	780	0.62	0.66	20%

Dimensions

Model	A (mm)	B (mm)	C (Max. mm)	D (ref. mm)	E (ref. mm)	F (ref. mm)
MPIT6028	6.00.3	6.00.3	3.0	1.6	4.7	5.7

Testing Conditions

Ordinary Conditions: Temperature: 5 to 35, Humidity: 25 to 85% RH, Atmospheric Pressure: 86 to 106 kPa

Doubt Conditions: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa

Operating and Storage Conditions

Operating Temperature: -40~85
Storage Temperature and Humidity Range: -40~125 & 30% to 70% RH

Reliability and Test Conditions

Item	Specifications	Test Method/Condition
Operating temperature range	25~ +85 (Including temperature rise due to self-generated heat)
Terminal strength-pull test	Terminal shall not be loosened or ruptured	A 5N. load shall be applied to both terminals in the axis direction for 60 sec.
Solderability test	The terminal shall be at least 90% covered with solder.	After fluxing, Inductor shall be dipped in a melted solder bath at 2305for 5 seconds.
Resistance to solvent test	There shall be no case deformation, change in appearance, obliteration of marking.	MIL-STD-105E
Vibration test (low frequency)	1. Inductors shall be no evidence of electrical and mechanical damage. 2. Inductance shall not change more than=5%. 3. Q shall not change more than=20%	1. Amplitude:1.5mm. 2. Frequency:10~55~10Hz/min. 3. Direction:X.Y.Z. 4. Duration:2 hrs/X.Y.Z.
Shock test		Inductors shall be dropped 10 from a height of 1m onto 3cm wooden board.
Resistance to soldering heat		Temp:2605, Time:101sec
High temperature load life test	There shall be no evidence of Short or open circuiting.	1. temp:852. 2. time: 100012 hours. 3. load: allowed DC current.
Humidity load life		1. temp: 402. 2. R.H: 90-95%. 3. time: 100012 hours. 4. load: allowed DC current.
Temperature characteristic	1. Inductors shall be no evidence of electrical and mechanical damage. 2. Inductance shall not change more than5%. 3. Q shall not change more than 30%.	25~ +85
Humidity test		1. Temp:402. 2. R.H:90-95%. 3. Time:962 hours.
Cold test		1. Temp:-402. 2. Time:962 hours.
Thermal shock test
Dry heat test		1. temp:852 2. time: 962 hours

Recommended Soldering Conditions

Flow soldering conditions

Pre-heating: Temperature difference between solder and product surface 150. Cooling into solvent after soldering 100.
Standard soldering profile.

Reflow soldering conditions

Average Ramp-Up Rate (Ts max. to Tp): 3/second max.
Preheat Ts min.: 150 , Ts max.: 200 , ts min to ts max.: 60-180 seconds
Time maintained above TL (217 ): 60-150 seconds
Peak/Classification Temperature (Tp): 260
Peak/Classification Time (Tp): 3-4 seconds
Time within 5 C of actual Peak Temperature (tp): 20-40 seconds
Ramp-Down Rate: 6C/second max.
Time 25 C to Peak Temperature: 8 minutes max.

Re-work with soldering iron

Pre-heating: 150, 1 minute min
Tip temperature: 280max
Soldering iron output: 20w max
End of soldering iron tip: 1mm max
Soldering time: 3 seconds max

Cleaning Conditions

Cleaning temperature: 60max (40max for fluoride and alcohol type cleaner).
Ultrasonic cleaning: Power: 20W/t max, Frequency: below 40 kHz, Time: 5 minutes max.
Cleaners: Isopropyl alcohol (IPA), HCFC-225, Aqueous agents (Surface Active Agent Type, Hydrocarbon Type, Higher Alcohol Type, Alkali Saponification Type).
No residual flux and cleaner after cleaning. Dry completely after rinse with de-ionized water if using aqueous agent.

Package Information

Packing quantity: 2000pcs/rell
Peeling strength of cover tape: 30 to 60 grams

Products Storage

Storage period: Products over 6 months old should be examined and solderability checked.
Storage conditions: Temperature: -10 ~+ 40, Humidity: Less than 80% RH. No rapid change in temperature and humidity.
Avoid storage in corrosive gases (sulfur, chlorine gas, acid).
Store on palette to prevent influence from humidity, dust.
Avoid heat shock, vibration, direct sunlight.
Store under airtight packaged condition.