Electronic component Microgate MPIT3015-6R8M-LF SMD power inductor with ferrite core and epoxy resin

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Product Description

Product Overview

The MPIT3015 Series is a line of SMD power inductors designed for various electronic applications. These inductors are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD. and are built with high-quality materials to ensure reliable performance.

Product Attributes

Brand: Microgate
Origin: Shenzhen, P.R.C.
Material: Ferrite Core (Ni-Zn Ferrite), Enameled Copper Wire, Ag/Ni/Sn/Cu Terminal Electrode, Epoxy resin and magnetic powder magnetic glue
Certifications: Lead-free product

Technical Specifications

Microgate Part No.	Inductance (uH)	DCR ()	Isat 1 (A)	Irms 2 (A)	SRF (MHz)
MPIT3015-1R0N-LF	1.030%	0.030	2.32	2.35	152
MPIT3015-1R2N-LF	1.230%	0.040	2.50	1.95	111
MPIT3015-1R5N-LF	1.530%	0.050	2.30	1.70	100
MPIT3015-1R8M-LF	1.820%	0.050	1.75	1.70	93
MPIT3015-2R2M-LF	2.220%	0.060	1.65	1.60	86
MPIT3015-2R7M-LF	2.720%	0.075	1.52	1.43	64
MPIT3015-3R3M-LF	3.320%	0.080	1.35	1.40	68
MPIT3015-3R6M-LF	3.620%	0.105	1.30	1.20	60
MPIT3015-4R3M-LF	4.320%	0.115	1.20	1.14	52
MPIT3015-4R7M-LF	4.720%	0.120	1.20	1.20	46
MPIT3015-5R1M-LF	5.120%	0.125	1.08	1.09	48
MPIT3015-6R8M-LF	6.820%	0.160	0.90	0.90	39
MPIT3015-100M-LF	1020%	0.230	0.75	0.77	41
MPIT3015-120M-LF	1220%	0.315	0.70	0.69	31
MPIT3015-150M-LF	1520%	0.350	0.70	0.65	30
MPIT3015-180M-LF	1820%	0.430	0.56	0.59	24
MPIT3015-220M-LF	2220%	0.460	0.55	0.57	23
MPIT3015-270M-LF	2720%	0.670	0.48	0.47	22
MPIT3015-330M-LF	3320%	0.795	0.44	0.44	20
MPIT3015-390M-LF	3920%	0.995	0.41	0.39	15
MPIT3015-430M-LF	4320%	1.060	0.37	0.37	15
MPIT3015-470M-LF	4720%	1.095	0.35	0.36	14
MPIT3015-560M-LF	5620%	1.280	0.33	0.34	13
MPIT3015-620M-LF	6220%	1.430	0.33	0.32	13
MPIT3015-680M-LF	6820%	2.460	0.29	0.24	11

Item	Required Characteristics	Test Method/Condition
High temperature resistance	1. No case deformation or change in appearance. 2. \|L\|/L10%	Temperature: 1252 Time : 1000 hours Tested not less than 1 hours, nor more than 2 hours at room temperature.
Low temperature resistance		Temperature : -402 Time : 1000 hours Tested not less than 1 hour, nor more than 2 hours at room temperature.
Humidity test		1. Exposure : Temperature:602, Humidity : 933% RH Time : 1000 hours. 2. Tested while the specimens are still in the chamber. 3. Tested not less than 1 hour, nor more than 2 hours at room temperature.
Thermal shock test	1. No case deformation or change in appearance. 2. \|L\|/L10%	First -40 for T time, last 125 T time as 1 cycle. Go through 100 cycles.
Solderability test	Terminal area must have 90% min. solder coverage.	Dip pads in flux then dip in solder pot at 2455 for <5 second. Solder: lead free Flux: rosin flux.
Heat endurance of reflow soldering	1. No case deformation or change in appearance. 2. \|L\|/L10%	Refer to the next page reflow curve Go through 3 times. The peak temperature: 260+5/-0
Vibration test		Apply frequency 10~55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours in each 3 mutually perpendicular directions.(total 6 hours)
Drop test		Packaged & drop down from 1m with 981m/s2(100G) attitude in 1 angle 1 ridges & 2surfaces orientations.
Terminal strength push test		Pulling test: Define: Solder the products on testing PCB using eutectic solder. Then apply a force in the direction of the arrow. 10N force. Keep time 5s Bending test: Soldering the products on PCB, after the pulling test and bending test, terminal should not pull off. Bend the testing PCB at middle point, the deflection shall be 2mm. Pressurizing Speed: 0.5mm/sec, Keep time: 30 1s, 90 Ambient Temperature -40 125 30 min. 30 min. 30 min. 20sec. (max.)
Resistance to solvent test	No case deformation or change in appearance, or obliteration of marking	To dip parts into IPA solvent for 50.5Min, then drying them at room temp for 5Min., at last, to brushing marking 10 times.
Loading Under Humidity Heat	1. No case deformation or change in appearance. 2. \|L\|/L10%	1. Exposure : Temperature:602, Humidity : 93 3% RH Time : 1000 hours. Apply rated current 2. Tested while the specimens are still in the chamber. 3. Tested not