SMD Power Inductor Microgate MPIT4018-470M-LF Suitable for Electronic Power Management Applications
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MOQ:
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Delivery Time:
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Product Description
MPIT4018 Series SMD Power Inductor
This specification applies to the MPIT4018 series of SMD power inductors. These inductors are designed for various electronic applications requiring reliable power management.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
- Origin: P.R.C
- Product Series: MPIT4018
- Environmental Compliance: Lead-free products
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
| MPIT4018-R24M-LF | 0.2420% | 0.016 | 0.012 | 6.50 | 7.00 | 4.60 | 5.00 |
| MPIT4018-R68M-LF | 0.6820% | 0.025 | 0.021 | 6.00 | 7.00 | 3.80 | 4.15 |
| MPIT4018-1R0M-LF | 1.020% | 0.030 | 0.025 | 4.55 | 4.85 | 3.40 | 3.80 |
| MPIT4018-1R2M-LF | 1.220% | 0.030 | 0.025 | 4.20 | 4.80 | 3.40 | 3.80 |
| MPIT4018-1R5M-LF | 1.520% | 0.036 | 0.030 | 3.90 | 4.25 | 2.95 | 3.20 |
| MPIT4018-2R2M-LF | 2.220% | 0.048 | 0.040 | 3.15 | 3.40 | 2.60 | 2.90 |
| MPIT4018-2R7M-LF | 2.720% | 0.060 | 0.050 | 2.70 | 3.00 | 2.20 | 2.50 |
| MPIT4018-3R3M-LF | 3.320% | 0.060 | 0.050 | 2.70 | 3.00 | 2.20 | 2.50 |
| MPIT4018-3R9M-LF | 3.920% | 0.078 | 0.065 | 2.60 | 2.80 | 2.00 | 2.20 |
| MPIT4018-4R7M-LF | 4.720% | 0.078 | 0.065 | 2.10 | 2.30 | 2.00 | 2.20 |
| MPIT4018-6R8M-LF | 6.820% | 0.108 | 0.090 | 1.70 | 1.85 | 1.70 | 1.90 |
| MPIT4018-100M-LF | 1020% | 0.168 | 0.140 | 1.40 | 1.55 | 1.20 | 1.30 |
| MPIT4018-150M-LF | 1520% | 0.228 | 0.190 | 1.15 | 1.25 | 1.00 | 1.20 |
| MPIT4018-220M-LF | 2220% | 0.336 | 0.280 | 1.00 | 1.10 | 0.95 | 1.10 |
| MPIT4018-330M-LF | 3320% | 0.480 | 0.400 | 0.80 | 0.90 | 0.75 | 0.85 |
| MPIT4018-470M-LF | 4720% | 0.720 | 0.600 | 0.70 | 0.80 | 0.60 | 0.70 |
| MPIT4018-560M-LF | 5620% | 0.912 | 0.760 | 0.65 | 0.80 | 0.53 | 0.58 |
| MPIT4018-101M-LF | 10020% | 1.740 | 1.450 | 0.45 | 0.55 | 0.30 | 0.35 |
| MPIT4018-221M-LF | 22020% | 3.600 | 3.000 | 0.30 | 0.34 | 0.21 | 0.23 |
Dimensions and Material
| Item | Dimensions (mm) | Material |
| A | 4.00.2 | Core: Ni-Zn Ferrite |
| B | 4.00.2 | Wire: Enameled Copper Wire |
| C | 1.8 Max. | Terminal Electrode: Ag/Ni/Sn/Cu |
| D | 2.10.2 | Magnetic Glue: Epoxy resin and magnetic powder |
| E | 0.950.2 | |
| f | 1.9 Typ. | |
| g | 4.1 Typ. | |
| h | 3.7 Typ. |
Operating Conditions
The part normal work is allowed ambient temperature: -40 ~ +125.
Reliability Testing
| Item | Required Characteristics | Test Method/Condition |
| High temperature storage test | 1. No case deformation or change in appearance. 2. |L|/L10% | Temperature: 1252, Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature storage test | 1. No case deformation or change in appearance. 2. |L|/L10% | Temperature: -552, Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Humidity test | 1. No case deformation or change in appearance. 2. |L|/L10% | Temperature: 85, Humidity: 85% RH, Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock test | 1. No case deformation or change in appearance. 2. |L|/L10% | -40 for 30min. to 125 for 30min. as 1 cycle. Go through 1000 cycles. |
| Solderability test | Terminal area must have 90% min. solder coverage. | Dip pads in flux then dip in solder pot at 2455 for 50.1 second. Solder: Sn96.5%Ag3%Cu0.5%. Flux: rosin flux. |
| Heat endurance of reflow soldering | 1. No case deformation or change in appearance. 2. |L|/L10% | Refer to reflow curve, Go through 3 times. The peak temperature: 260+5/-0. |
| Vibration test | 1. No case deformation or change in appearance. 2. |L|/L10% | Apply frequency 10~55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours in each 3 mutually perpendicular directions (total 6 hours). |
| Drop test | 1. No case deformation or change in appearance. 2. |L|/L10% | Drop 10 times on a concrete floor from a height of 1m. |
| Terminal strength push test | 1. No case deformation or change in appearance. 2. |L|/L10% | Pulling test: 17.64N force. Keep time 10s. Bending test: deflection 2mm, Speed: 0.5mm/sec. |
| Loading at High Temperature | 1. No case deformation or change in appearance. 2. |L|/L10% | Temperature: 852, Time: 1000 hours, Apply rated current. Measurement at 244 hours after test conclusion. |
Recommended Soldering Conditions
Product can be applied to flow and reflow soldering.
Flux: Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt% (chlorine conversion value). Use Sn solder.
Flow soldering conditions: Pre-heating temperature difference between solder and product surface is limited to 150 max. Cooling temperature difference is limited to 100 max.
Reflow soldering conditions: Pre-heating 150, 1 minute max. Peak temperature 350, 3 seconds max.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina