Low ESL Multilayer Ceramic Capacitor muRata NFM21PC224R1C3D Designed for General Electronic Equipment

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The NFM21PC224R1C3 is a Large Current 3 Terminals Low ESL Chip Multilayer Ceramic Capacitor (EMIFIL) designed for general electronic equipment. It offers advantages such as low ESL and is suitable for applications requiring high reliability.

Product Attributes

Brand: MURATA
Packaging: 8mm-wide paper tape, 4000 pcs./Reel
Material: Multilayer Ceramic

Technical Specifications

Item	Specification	Test Method
Nominal Capacitance	0.22 uF
Capacitance Tolerance	±20 %
DC Rated Voltage	DC 16 V
Rated Current (DC)	2A
DC Resistance	30mΩmax.	Measured with 100mA max.
Insulation Resistance	1000MΩmin.
Operating Temperature Range	-55 to 125 °C
Storage Temperature Range	-55 to 125 °C
Dimensions (L x W x T)	2.0±0.2 x 1.25±0.1 x 0.85±0.1 mm
Dimensions (e.g., j, d, g)	j: 0.25±0.2, d: 0.3±0.2, g: 0.4±0.2 mm
Capacitance Measurement	Frequency: 1.0±0.1kHz, Voltage: 1±0.2V(rms)
Withstanding Voltage	Rated Voltage x 300% for 1 to 5 s	Charge Current: 50 mA max.
Appearance	No defects or abnormalities.	Visual inspection.
Dimensions Check	Within specified dimensions.	Using calipers.
Solderability	Electrodes shall be at least 90% covered with new solder coating.	Flux: Ethanol solution of rosin, 25(wt)%, Pre-heat: 150±10°C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 240 ± 3°C, Immersion Time: 3±1 s
Resistance to Soldering Heat	No failure after tested. Appearance No damaged, Cap. Change Within ±7.5%, DC Resistance 0.05Ωmax.	Flux: Ethanol solution of rosin, 25(wt)%, Pre-heat: 150±10°C, 60 to 90s, Solder: Sn-3.0Ag-0.5Cu, Solder Temperature: 270 ± 5°C, Immersion Time: 10 ± 1 s
Bending Strength	No damaged, Cap. Change Within ±7.5%, DC Resistance 0.05Ωmax.	Soldered on glass-epoxy substrate (100x40x1.0mm), Deflection: 2 mm, Keeping Time: 30 s
Drop	No damaged, Cap. Change Within ±7.5%, DC Resistance 0.05Ωmax.	Dropped on concrete or steel board, Height: 75 cm, Method: Free fall
Bonding Strength	No damaged, Capacitance Meet the initial rated value.	Soldered on glass-epoxy substrate, Applying Force (F): 9.8 N, Applying Time: 30 s
Vibration	No damaged, Capacitance Meet the initial rated value.	Soldered on glass-epoxy substrate, Oscillation Frequency: 10 to 55 to 10Hz for 1 minute, Double Amplitude: 1.5 mm
Temperature Cycling	Appearance No damaged, Cap. Change Within ±12.5%, I.R. 50Ω·F min., DC Resistance 0.05Ωmax.	1 Cycle: Min Op Temp +0/-3°C (30+3/-0 min), Room Temp (within 3 min), Max Op Temp +3/-0°C (30+3/-0 min), Room Temp (within 3 min). Total 10 cycles.
Humidity	Appearance No damaged, Cap. Change Within ±12.5%, I.R. 50Ω·F min., DC Resistance 0.05Ωmax.	Temperature: 40±2°C, Humidity: 90 to 95%(RH), Time: 500+24/-0 hours
Heat Life	Appearance No damaged, Cap. Change Within ±12.5%, I.R. 50Ω·F min., DC Resistance 0.05Ωmax.	Temperature: Maximum Operating Temperature ± 2 °C, Test Voltage: Rated Voltage x 200%, Time: 1000+48/-0 hours
Packaging Unit	4000 pcs./Reel
Taping Specification	Sprocket holes to the right as tape is pulled toward user. Base tape and top tape have no spliced point. Cavity shall not have burr. Missing components number within 0.1% of reel count or 1 pc., whichever is greater, and not continuous.
Pull Strength of Top Tape and Bottom Tape	5N min.
Peeling off force of top tape	0.1N to 0.6N (minimum value is typical)	Speed of Peeling off: 300 mm / min