RoHS compliant thick film array chip resistors RALEC RTA03-4D753JTP suitable for various electronics
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Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are suitable for a wide range of general electronic uses.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant, Lead-free, Halogen-free
- Origin: Not specified
- Material: Not specified
- Color: Not specified
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | JUMPER (0) Rated Current | JUMPER (0) Resistance |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 | 1R10R10M (D:0.5%) 1R10R10M (F:1%) 1R10R10M (J:5%) | 4 | 2 | 1A | 25m MAX. (D:0.5%) 50m MAX. (F:1%, J:5%) |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 | 1R10R10M (D:0.5%) 1R10R10M (F:1%) 1R10R10M (J:5%) | 8 | 4 | 1A | 25m MAX. (D:0.5%) 50m MAX. (F:1%, J:5%) |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 | 10R10M (D:0.5%) 1R10M (D:0.5%) 10R10M (F:1%) 1R10M (F:1%) 10R10M (J:5%) | 16 | 8 | 1A | 50m MAX. (F:1%, J:5%) |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 | 10R10M (D:0.5%) 1R10M (D:0.5%) 10R10M (F:1%) 1R10M (F:1%) 10R10M (J:5%) | 4 | 2 | 1A | 50m MAX. (F:1%, J:5%) |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 | 22R470K (D:0.5%) 1R10M (D:0.5%) 1R10M (F:1%) 1R10M (F:1%) 1R10M (J:5%) | 8 | 4 | 1A | 25m MAX. (D:0.5%) 50m MAX. (F:1%, J:5%) |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 | 3R10 (D:0.5%) 10R3R10R1M (F:1%) 3R10R1M (J:5%) | 4 | 2 | 1A | 50m MAX. (F:1%, J:5%) |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 | 1R10R1M (D:0.5%) 1R10R1M (F:1%) 1R10R1M (J:5%) | 8 | 4 | 1A | 50m MAX. (F:1%, J:5%) |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Reliability Test Items
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance (TCR) | (R2-R1)/R1(T2-T1) 10^6 | Refer to Specification Table |
| R1: Resistance at room temp. R2: Resistance at -55 or +125. T1: Room temp. T2: -55 or +125. (JIS-C5201-1 4.8) | NA | |
| Short Time Overload | Apply 2.5 times rated voltage for 5 sec. Rest for 30 min. Measure resistance change. (Rated voltage refer to Specification Table) (JIS-C5201-1 4.13) | 0.5%, 1%: R=1.0% 5%: R=2.0% |
| Refer to Specification Table | ||
| Insulation Resistance | Apply 100 VDC for 1 min. between electrodes and protective layer/substrate. (JIS-C5201-1 4.6) | 10^9 |
| Refer to Specification Table | ||
| Dielectric Withstand Voltage | Apply 300 VAC for 1 min. between electrodes. (JIS-C5201-1 4.7) | No short circuit or burning. |
| Refer to Specification Table | ||
| Intermittent Overload | In oven, apply 2.5x rated voltage, 1 sec ON, 25 sec OFF, 10,000 cycles. Rest for 60 min. Measure resistance change. (JIS-C5201-1 4.13) | R=5.0% |
| Refer to Specification Table | ||
| Resistance to Solvent | Immerse in Isopropanol (20~25) for 50.5 min. Rest for 48 hrs. Measure resistance change. (JIS-C5201-1 4.29) | R=0.5% |
| Refer to Specification Table | ||
| Solderability | Pre-conditioning: 105, 100% RH, 1.22x10^5 Pa for 4 hrs. Rest for 2 hrs. Test Method: Solder bath at 2355 for 20.5 sec. Observe solder coverage. (JIS-C5201-1 4.17) | Conductor coverage >95%. |
| Refer to Specification Table | ||
| Resistance to Soldering Heat | Test 1: Solder bath at 260+5/-0 for 10 sec. Rest for 60 min. Measure resistance change. Test 2: Solder bath at 260+5/-0 for 30 sec. Wash. Observe solder coverage. (JIS-C5201-1 4.18) | Test 1: R%=1.0% Test 2: Conductor coverage >95%. No underlying material visible at electrode edge. |
| Refer to Specification Table | ||
| Joint Strength of Solder | Flexing Test: Solder to flex test board. Apply load at center of board. Measure resistance change. Deflection (D): 5mm. (JIS-C5201-1 4.33) | R%=1.0% |
| Refer to Specification Table | ||
| Resistance to Dry Heat | In oven at 1555 for 10004 hrs. Rest for 1 hr. Measure resistance change. (JIS-C5201-1 4.25) | 0.5%, 1%: R=1.0% 5%: R=2.0% |
| Refer to Specification Table | ||
| Thermal Shock | In thermal shock chamber: -55 for 15 min, +125 for 15 min. 300 cycles. Rest for 60 min. Measure resistance change. (MIL-STD 202 Method 107) | R=1.0% |
| Refer to Specification Table | ||
| Moisture Load Life | In chamber at 402, 90~95% RH. Rated voltage applied, 90 min ON, 30 min OFF. 1,000 hrs. Rest for 60 min. Measure resistance change. (JIS-C5201-1 4.24) | 0.5%, 1%: R=2.0% 5%: R=3.0% |
| Refer to Specification Table | ||
| Load Life | In oven at 702. Rated voltage applied, 90 min ON, 30 min OFF. 1,000 hrs. Rest for 60 min. Measure resistance change. (JIS-C5201-1 4.25) | 0.5%, 1%: R=2.0% 5%: R=3.0% |
| Refer to Specification Table |
Plating Thickness
- Nickel layer (Ni): 2m
- Pure Tin layer (Sn): 3m (Matte tin)
Technical Application Notes
- Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020), Iron Soldering: 35010 within 3 seconds.
- Recommended Land Pattern Design for Reflow Soldering is provided for different types.
- Environmental Precautions: Not recommended for high temperature/humidity, corrosive gas environments (Cl2, H2S, NH3, SO2, NO2), unverified liquids, or sealing with unverified resins. Cleaning after soldering is recommended.
- Transient Overload: Avoid transient overloads exceeding product specifications.
- Handling Precautions: Protect edges and protective layers from mechanical stress. Avoid bending of PCBs. Operate within rated power limits. Evaluate and confirm in actual application for fail-safe design.
Storage and Handling Conditions
- Storage: 255, 6015% RH for two years. Avoid corrosive environments, direct sunlight, and condensation.
- Handling: Ensure correct box orientation. Do not drop or squeeze boxes.
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina