China Ultra Low Jitter I2C Programmable Crystal Oscillator SKYWORKS 548BAAB000111CCG with Custom Frequency Samples for sale

Ultra Low Jitter I2C Programmable Crystal Oscillator SKYWORKS 548BAAB000111CCG with Custom Frequency Samples

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The Skyworks Solutions Si548 Ultra Series Crystal Oscillator is an I2C programmable XO utilizing advanced 4th generation DSPLL technology to deliver ultra-low jitter and low phase noise clock signals. It offers user-programmable frequencies from 0.2 to 1500 MHz with

Product Attributes

Brand: Skyworks Solutions
Series: Ultra Series
Technology: DSPLL
Package Size: 2.5x3.2 mm

Technical Specifications

Parameter	Symbol	Test Condition/Comment	Min	Typ	Max	Unit
Temperature Range	TA		40		85	C
Frequency Range	FCLK	LVPECL, LVDS, CML	0.2		1500	MHz
Frequency Range	FCLK	HCSL	0.2		400	MHz
Frequency Range	FCLK	CMOS, Dual CMOS	0.2		250	MHz
Supply Voltage	VDD	3.3 V	3.135	3.3	3.465	V
Supply Voltage	VDD	2.5 V	2.375	2.5	2.625	V
Supply Voltage	VDD	1.8 V	1.71	1.8	1.89	V
Supply Current	IDD	LVPECL (output enabled)		107	153	mA
Supply Current	IDD	LVDS/CML (output enabled)		83	121	mA
Supply Current	IDD	HCSL (output enabled)		86	126	mA
Supply Current	IDD	HCSL-Fast (output enabled)		94	138	mA
Supply Current	IDD	CMOS (output enabled)		87	127	mA
Supply Current	IDD	Dual CMOS (output enabled)		92	141	mA
Supply Current	IDD	Tristate (output disabled)		73	112	mA
Temperature Stability		Grade A	20		20	ppm
Temperature Stability		Grade B	10		10	ppm
Temperature Stability		Grade C	7		7	ppm
Total Stability	FSTAB	Grade A (Includes temp, initial, load, VDD, 20yr aging)	50		50	ppm
Total Stability	FSTAB	Grade B (Includes temp, initial, load, VDD, 20yr aging)	25		25	ppm
Total Stability	FSTAB	Grade C (Includes temp, initial, load, VDD, 20yr aging)	20		20	ppm
Rise/Fall Time	TR/TF	LVPECL/LVDS/CML			350	ps
Rise/Fall Time	TR/TF	CMOS / Dual CMOS (CL = 5 pF)		0.5	1.5	ns
Rise/Fall Time	TR/TF	HCSL, FCLK >50 MHz			550	ps
Rise/Fall Time	TR/TF	HCSL-Fast, FCLK >50 MHz			275	ps
Duty Cycle	DC	All formats	45		55	%
Powerup Time	tOSC	Time from 0.9 VDD until output frequency within spec			10	ms
Powerup VDD Ramp Rate	VRAMP	Fastest VDD rate allowed on startup			100	V/ms
LVPECL Output Option	VOC	Mid-level	VDD 1.42		VDD 1.25	V
LVPECL Output Option	VO Swing (diff)		1.1		1.9	VPP
LVDS Output Option	VOC	Mid-level (2.5 V, 3.3 V VDD)	1.125	1.20	1.275	V
LVDS Output Option	VOC	Mid-level (1.8 V VDD)	0.8	0.9	1.0	V
LVDS Output Option	VO Swing (FCLK 1.4 GHz)		0.6	0.7	0.9	VPP
LVDS Output Option	VO Swing (FCLK > 1.4 GHz)		0.5	0.7	0.9	VPP
HCSL Output Option	VOH		660	750	850	mV
HCSL Output Option	VOL		150	0	150	mV
HCSL Output Option	VC Crossing voltage		250	350	550	mV
CML Output Option (AC-Coupled)	VO Swing (diff)		0.6	0.8	1.0	VPP
CMOS Output Option	VOH	IOH = 8/6/4 mA for 3.3/2.5/1.8V VDD	0.85 VDD			V
CMOS Output Option	VOL	IOL = 8/6/4 mA for 3.3/2.5/1.8V VDD			0.15 VDD	V
Frequency Reprogramming Resolution	MRES			0.026		ppb
Frequency Range for Small Frequency Change		From center frequency	-950		+950	ppm
Settling Time for Small Frequency Change		< 950 ppm from center frequency			100	s
Settling Time for Large Frequency Change		> 950 ppm from center frequency			40	ms
Phase Jitter (RMS, 12 kHz - 20MHz)	J	All Differential Formats, FCLK 200 MHz		95	150	fs
Phase Jitter (RMS, 12 kHz - 20MHz)	J	All Differential Formats, 100 MHz FCLK < 200 MHz		115	150	fs
Phase Jitter (RMS, 12kHz - 20MHz)	J	CMOS / Dual CMOS Formats, 10 MHz FCLK 250 MHz		200		fs
Additive Phase Jitter with I2C Lines Active	J	(12 kHz - 20 MHz), FCLK 200 MHz		15		fs
Spurs Induced by External Power Supply Noise	PSNR	50 mVpp Ripple, LVDS 156.25 MHz Output, 100 kHz sine wave		-83		dBc
Mechanical Shock		MIL-STD-883, Method 2002
Mechanical Vibration		MIL-STD-883, Method 20007
Solderability		MIL-STD-883, Method 2003
Gross and Fine Leak		MIL-STD-883, Method 1014
Resistance to Solder Heat		MIL-STD-883, Method 2036
Moisture Sensitivity Level (MSL)		2.5 x 3.2 package		2
Contact Pads		2.5x3.2 packages Au/Pd/Ni	0.03 - 0.12 m / 0.1 - 0.2 m / 3.0 - 8.0 m
Thermal Resistance	JA	2.5 x 3.2 mm 6-pin DFN, Still Air, 85 C		80		C/W
Thermal Parameter	JB	Still Air, 85 C		39		C/W
Thermal Parameter	JT	Still Air, 85 C		17		C/W
Maximum Junction Temperature					125	C
Maximum Operating Temp.	TAMAX				95	C
Storage Temperature	TS		55		125	C
Supply Voltage	VDD	Absolute Maximum	0.5		3.8	V
Input Voltage	VIN	Absolute Maximum	0.5		VDD + 0.3	V
ESD HBM		(JESD22-A114)		2.0		kV
Solder Temperature	TPEAK				260	C
Solder Time at TPEAK	TP		2040			sec