surface mount device module PULSE HXB4009HLT designed for high speed networking applications and industrial
Product Overview
The Pulse Electronics HB/HXB4009HLT, HB4010HLT, HB4011HLT, and HB4012HLT are single and dual 2.5Gigabit Surface Mount Device (SMD) modules designed for high-speed networking applications. These modules offer compact, low-profile (4.0mm) options with high isolation and surge capabilities, meeting or exceeding IEEE802.3bz standards. They are compatible with all major PHYs and are suitable for both commercial and industrial temperature ranges. The reliable SMD packages support 245C peak reflow and are supplied in Tape and Reel for efficient manufacturing processes. All components are fully RoHS and Halogen Free.
Product Attributes
- Brand: Pulse Electronics
- Certifications: Fully RoHS and Halogen Free
- Package Type: Surface Mount Device (SMD)
- Soldering: Supports 245C peak reflow
- Supply Format: Tape and Reel (13 / 330mm Diameter)
- Header Material: Black Thermoset Plastic (UL 94V-0 flammability rating)
- Lead Frame Material: Cooper Alloy
- Underplate/Overplate: Tin electro-deposited over Nickel
- Finish: Matte finish Tin solder
Technical Specifications
| Part Number* | Media side Inductance (@100KHz/0.1Ve) uH min | Insertion Loss (dB max) 1-100 MHz | Return Loss (dB min) 125 MHz | Return Loss (dB min) 1-40MHz | Return Loss (dB min) 40 < f 125 MHz | PoE (Current Per Pair mA) | Operating Temperature (C) | Isolation (Pri:Sec) | Notes |
|---|---|---|---|---|---|---|---|---|---|
| HB4010HLT | 180 | -1.0 | -1.5 | -16 | -(16-10 log10(f /40)) | - | 0 to +70 | 1500Vrms | - |
| HB4011HLT | 180 | -1.0 | -1.5 | -16 | -(16-10 log10(f /40)) | - | 0 to +70 | 3000Vrms | Surge CM 4KV |
| HB4012HLT | 180 | -1.0 | -1.5 | -16 | -(16-10 log10(f /40)) | - | 0 to +70 | 1500Vrms | Dual Port |
| HB4009HLT | 180 | -1.0 | -1.5 | -16 | -(16-10 log10(f /40)) | - | 0 to +70 | 1500Vrms | - |
| HXB4009HLT | 180 | -1.0 | -1.5 | -16 | -(16-10 log10(f /40)) | - | -40 to +85 | 1500Vrms | - |
Note: Specifications listed above refer to the base component part number that is printed on the product.
Process and Materials Notes:
- Storage Temperature: HBxxxxHL = -20 to +125C; HXBxxxxHL = -50 to +125C
- Compliance to JEDEC-J-STD 020: Moisture Sensitive Level 1; Maximum peak Reflow Solder temperature 245C
- Dimensions: xx.xx = 0.25 mm; x.xx = 0.25 mm; 0.xx = 0.13 mm
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