3M CP2 SA110 G1 FJ press fit socket featuring gold contact plating and high temperature insulation
Price:
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The 3M CP2 Press-Fit Socket, 2 mm Type B, is a right-angle socket designed for high signal density and cost-effectiveness. It features a 2 mm grid spacing and an "Eye of the Needle" compliant pin press-fit design to reduce manufacturing time and cost. With an optional grounding row for improved performance and compatibility with various 3M headers and sockets, this module offers end-to-end stackability and is designed according to IEC 61076-4-101 and IEC 60352-5 Standards. It is suitable for applications requiring high signal density and reliable interconnect solutions.
Product Attributes
- Brand: 3M
- Series: CP2 Series
- Type: Press-Fit Socket
- Contact Type: Signal Contacts
- Grid Spacing: 2 mm
- Design Standard: IEC 61076-4-101, IEC 60352-5
- Insulation Material: High Temperature Thermoplastic (LCP)
- Contact Material: Copper Alloy
- Flammability: UL94V-0
- Plating Options: FJ (Gold Contact Area, Matte Tin, Nickel Underplate), KR (Gold Contact Area, Matte Tin, Nickel Underplate)
- Shield Options: G (Upper Shield), Blank (No Shield)
- Origin: USA (Printed in USA)
Technical Specifications
| Specification | Details |
|---|---|
| Basic System Unit | 25 mm |
| Module Size | 50 mm |
| Signal Contact Quantities | 95, 110, 125 |
| Dimension A (95 contacts) | 38.00 mm |
| Dimension B (95 contacts) | 36.00 mm |
| Dimension A (110 contacts) | 44.00 mm |
| Dimension B (110 contacts) | 42.00 mm |
| Dimension A (125 contacts) | 50.00 mm |
| Dimension B (125 contacts) | 48.00 mm |
| Mating Force | ≤ 0.75N/PIN |
| Withdrawal Force | ≥ 0.15N/PIN |
| Mating and Un-mating Operations | 200 (for KR plating) |
| Current Rating | 1.0 Amperes at 70C (with all contacts powered) |
| Contact Resistance | ≤ 20 mΩ |
| Insulation Resistance | ≥ 10,000 MΩ |
| Test Voltage | 750 VACRMS |
| Temperature Rating | -55°C to +125°C |
| Recommended PCB Plated Through Hole Diameter | Ø 0.6±0.05 mm |
| Drill Hole Diameter | Ø 0.7±0.02 mm |
| PCB Thickness | 1.4 - 4.2 mm |
| Press-In Force | ≤ 204 N/pin (on nominal hole diameter) |
| Retention Force | ≥ 13.5 N/pin (on nominal hole diameter) |
| Plating Option FJ Details | 10~20 µ“ Gold Contact Area, 100~200 µ“ Matte Tin, 50~80 µ“ Nickel Underplate (RIA E1 &C1 apply) |
| Plating Option KR Details | 30~40 µ“ Gold Contact Area, 100~200 µ“ Matte Tin, 50~80 µ“ Nickel Underplate (RIA E1 &C1 apply) |
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