Compact SMT card edge connector 3M SPD08-160-L-RB with high speed signal transmission up to 20 Gbps
Product Overview
The 3M High-Speed Card-Edge Connector SPD08 is a high-density, 0.80mm pitch SMT BM Socket designed for board-to-board (B-T-B) and wire-to-board (W-T-B) applications. It offers high-speed signal transmission performance up to 15 Gbps for B-T-B and 20 Gbps for W-T-B connections. The connector features flexible stack heights ranging from 16 mm to 40 mm and robust tolerance for misalignment. It supports current carrying capacity up to 3.0A per pin and utilizes a high-temperature LCP resin housing for lead-free SMT compatibility. This connector is ideal for applications such as Base Stations, Servers, Hubs, Switches, and Routers, and can be integrated with 3M Twin Axial Cable for enhanced system density and routability.
Product Attributes
- Brand: 3M
- Product Line: High-Speed Card-Edge Connector SPD08
- Housing Material: High temp LCP resin
- Termination: SMT
- Pitch: 0.80mm
- Plating Option: 0.76um GOLD (Standard), 0.25um GOLD
- Latching Option: With Latch, Without Latch
- Packaging Option: Tray, Tape & Reel
Technical Specifications
| Specification | Details |
|---|---|
| Board-to-Board Speed Performance | Up to 15 Gbps |
| Wire-to-Board Speed Performance | Up to 20 Gbps |
| Flexible Stack Height | 16 mm to 40 mm |
| Misalignment Tolerance (X, Y) | +/- 0.8 mm |
| Misalignment Tolerance (Z at 30 mm stack height) | +/- 1.0 mm |
| Current Carrying Capacity (Single Pin) | Up to 3.0A |
| Current Rating (Fully Loaded) | 0.5 A |
| SMT Lead-Free Compatibility | Withstand 260 C |
| Mating Card Thickness (for Spring Contact) | 1.57 +/- 0.16 mm |
| Insertion Force (mated with 1.57 mm card) | Average 0.40 N/Pin |
| Number of Positions | 020, 040, 060, 064, 080, 100, 120, 140, 160, 180, 200 (All positions not tooled, refer to sales drawing) |
| Insert Loss (SDD21) | 7.5 GHz @ -3dB |
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