Low Profile 3M 150206-6001-RB Boardmount Socket Suitable for High Temperature Electronic Applications
3M Boardmount Socket 1502 Series
Product Overview
The 3M Boardmount Socket 1502 Series offers versatile interconnect solutions with straight and right-angle plated through-hole options, as well as straight surface mount configurations. Designed for high-temperature environments, these sockets are reflow solder compatible and feature a low profile to minimize PCB stack height. They are end stackable, with through-hole versions also offering side stackability. Surface mount parts are available in tape and reel packaging with vacuum caps for automated placement. These sockets are suitable for various electronic applications requiring reliable board-to-board connections.
Product Attributes
- Brand: 3M
- Series: 1502 Series
- Connection Type: Boardmount Socket
- Pitch: 2 mm x 2 mm
- Configurations: Straight Surface Mount, Straight Plated Through-Hole, Right Angle Plated Through-Hole
- Insulator Material: Glass Filled LCP (Surface Mount), Glass filled PCT (Vertical & Right Angle Thru-Hole)
- Contact Material: Copper alloy
- Plating (Wiping Area): 0.76 m [30 ] Gold
- Plating (Underplating): 1.27-3.81 m [50-150 ] Nickel overall
- Solder Tails Plating: 5.1 m [200 ] Matte tin or Tin-lead (refer to ordering information)
- Marking: Orientation delta and 3M Logo (except surface mount)
- Certifications: UL File No.: E68080
Technical Specifications
| Specification | Value |
|---|---|
| Current Rating | 1 A |
| Insulation Resistance | > 1 109 at 250 VDC |
| Withstanding Voltage | 500 VDC at Sea Level |
| Temperature Rating | -55C to +105C |
| Process Rating (Max) | 260C (per J-STD-020C) |
| Moisture Sensitivity Level | 1 (per J-STD-020C) |
| Contact Quantity & Dimension A (Example) | 04 = 3.96 [0.156] in, 08 = 7.87 [0.310] in, 60 = 59.87 [2.357] in |
| Tape Width (Example for 8+ positions) | 24 mm WB, 44 mm WD, 56 mm WE, 72 mm WF, 88 mm WG |
| Board Location Post Option | 0 = None (Standard), 2 = With board location post (Special order) |
| Plating Suffix (Gold with Matte Tin) | RB = 0.76 m [30 ] Gold with matte tin solder tails (RIA E1 & C1 apply) |
| Plating Suffix (Gold with Tin-Lead) | TB = 0.76 m [30 ] Gold with tin-lead solder tails (RIA E3 & C2 apply) |
| Packaging Style | Blank = tray packaging, WX = tape & reel pkg |
| Solder Tail Length Dimension B (Example) | 1 = 1.4 mm (Special order), 2 = 2.54 mm (Standard) |
| Standoff Height Code (Dim B) | 0 = 0.38 mm (Standard), 1 = 1.35 mm (Special order), 2 = 0.71 mm (Special order - for 40, 44, 50 positions only) |
Note: Refer to the Regulatory Information Appendix (RIA) in the RoHS compliance section of www.3mconnector.com for compliance information.
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