Low Profile Four Row Through Hole Chip Carrier Sockets 3M 8452-11B1-RK-TP Compatible with JEDEC MO-047 and MO-052

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Product Description

3M Chip Carrier Sockets - Low Profile, Four-Row, Through Hole 8400 Series

Product Overview
The 3M Chip Carrier Sockets, 8400 Series, are designed for through-hole mounting and offer a low-profile solution for accepting chip carriers conforming to JEDEC outlines MO-047 (square) and MO-052 (rectangular). These sockets are compatible with automated loading equipment and feature an open-top design for unrestricted airflow. Molded slots facilitate easy device extraction. They are suitable for wave soldering processes but not for reflow soldering. These sockets are RoHS Compliant.

Product Attributes

  • Brand: 3M
  • Series: 8400 Series
  • Type: Chip Carrier Sockets
  • Mounting: Through Hole
  • Profile: Low Profile
  • Rows: Four-Row
  • Flammability: UL 94V-0
  • Color: Black
  • RoHS Compliant: Yes (RIA E1 and C1 apply)
  • Packaging: Tubes

Technical Specifications

Specification Details
Insulation Material Glass Filled Polyester (PBT)
Contact Material Copper Alloy
Plating - Underplating 50 " [ 1.27 m ] Nickel
Plating - Overall Wiping Area 160 ", [ 4.06 m ] Matte Tin
Contact Resistance 15 m
Insulation Resistance >103 M minimum
Capacitance <1 pF at 1 MHz
Temperature Rating -40C to +105C
Process Rating Wave Solder Only

Ordering Information

Contact Quantity Part Number A [inch] B [inch] C [inch] D [inch]
20 8420-11B1-RK-TP 15.50 [0.611] 15.50 [0.611] 5.08 [0.200] 5.08 [0.200]
28 8428-11B1-RK-TP 18.05 [0.711] 18.05 [0.711] 7.62 [0.300] 7.62 [0.300]
32 8432-11B1-RK-TP 18.05 [0.711] 20.60 [0.812] 7.62 [0.300] 10.16 [0.400]
44 8444-11B1-RK-TP 23.50 [0.926] 23.50 [0.926] 12.70 [0.500] 12.70 [0.500]
52 8452-11B1-RK-TP 25.88 [1.020] 25.88 [1.020] 15.24 [0.600] 15.24 [0.600]
68 8468-11B1-RK-TP 31.05 [1.223] 31.05 [1.223] 20.32 [0.801] 20.32 [0.801]
84 8484-11B1-RK-TP 36.05 [1.420] 36.05 [1.420] 25.40 [1.001] 25.40 [1.001]

Important Notice Regarding Tin Whiskers:
3M PLCC products have tin-plated contact wiping surfaces, which is necessary for mated reliability with standard tin-plated PLCC contacts. Tin whiskers are an inherent characteristic of tin. Mechanically stressing the tin can be a known driver of whisker growth. It is possible that PLCC and PLCC sockets may exhibit tin whisker growth after mating. 3M follows iNEMI plating recommendations, including whisker-mitigating tin plating chemistry, to reduce the likelihood of tin whisker growth. Users should consider the suitability of a PLCC socket for their specific application, taking into account the product application's lifespan, environment, mechanical stresses, humidity, and thermal cycling, as these factors can stimulate tin whisker growth.


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Company Hefei Purple Horn E-Commerce Co., Ltd.
Location Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person Sellina

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