Four Row Through Hole Low Profile Chip Carrier Socket 3M 8428-11B1-RK-TP Matte Tin Wiping Area Plating
3M Chip Carrier Sockets Low Profile, Four-Row, Through Hole 8400 Series
The 3M Chip Carrier Sockets, 8400 Series, are designed for through-hole mounting and offer a low-profile, four-row configuration. These sockets accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. They are compatible with automated loading equipment and feature an open-top design for unrestricted airflow and molded slots for easy device extraction. These sockets are suitable for wave soldering only and are RoHS Compliant.
Product Attributes
- Brand: 3M
- Series: 8400 Series
- Configuration: Low Profile, Four-Row, Through Hole
- Insulation Material: Glass Filled Polyester (PBT)
- Insulation Flammability: UL 94V-0
- Insulation Color: Black
- Contact Material: Copper Alloy
- Underplating: 50 " [ 1.27 m ] Nickel
- Wiping Area Plating: 160 ", [ 4.06 m ] Matte Tin
- Certifications: RoHS Compliant (RIA E1 and C1 apply)
- Packaging: Tubes
Technical Specifications
| Specification | Value |
|---|---|
| Contact Resistance | 15 m |
| Insulation Resistance | >103 M minimum |
| Capacitance | <1 pF at 1 MHz |
| Temperature Rating | -40C to +105C |
| Process Rating | Wave Solder Only |
Ordering Information & Dimensions
| Contact Quantity | Part No. | A (mm [inch]) | B (mm [inch]) | C (mm [inch]) | D (mm [inch]) |
|---|---|---|---|---|---|
| 20 | 8420-11B1-RK-TP | 15.50 [0.611] | 15.50 [0.611] | 5.08 [0.200] | 5.08 [0.200] |
| 28 | 8428-11B1-RK-TP | 18.05 [0.711] | 18.05 [0.711] | 7.62 [0.300] | 7.62 [0.300] |
| 32 | 8432-11B1-RK-TP | 18.05 [0.711] | 20.60 [0.812] | 7.62 [0.300] | 10.16 [0.400] |
| 44 | 8444-11B1-RK-TP | 23.50 [0.926] | 23.50 [0.926] | 12.70 [0.500] | 12.70 [0.500] |
| 52 | 8452-11B1-RK-TP | 25.88 [1.020] | 25.88 [1.020] | 15.24 [0.600] | 15.24 [0.600] |
| 68 | 8468-11B1-RK-TP | 31.05 [1.223] | 31.05 [1.223] | 20.32 [0.801] | 20.32 [0.801] |
| 84 | 8484-11B1-RK-TP | 36.05 [1.420] | 36.05 [1.420] | 25.40 [1.001] | 25.40 [1.001] |
Note: Dimensions in [ ] are for reference only.
Important Notice Regarding Tin Whiskers: 3M PLCC products have tin-plated contact wiping surfaces, which is necessary for reliable mating with standard tin-plated PLCC contacts. Tin whiskers can be an inherent characteristic of tin. Mechanical stressing of the tin surface can drive whisker growth. It is possible for PLCC and PLCC sockets to exhibit tin whisker growth after mating. 3M adheres to iNEMI plating recommendations, utilizing whisker-mitigating tin plating chemistry to reduce the likelihood of tin whisker growth. Users should evaluate the suitability of PLCC sockets for their specific applications, considering product lifespan, environment, mechanical stresses, humidity, and thermal cycling, as these factors can stimulate tin whisker growth.
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