Product Overview

Millipacs is a 2mm modular, Board-to-Board Interconnection system in Hard Metric (HM) configuration, offering a cost-effective, flexible, and versatile solution. Its broad range of options and user flexibility make it suitable for various applications. Key features include Hard Metric compliance, 2mm pitch for optimized PCB design, modularity, and multiple contact lengths for diverse PCB thicknesses and hot-swapping capabilities. The system incorporates multipurpose centers, coding, and guiding features for easy and accurate mating. With SI performance up to 3Gb/s and the option for hybrid connectors (signal, power, coaxial), Millipacs enables versatile circuit designs. It conforms to IEC 917, IEC 61076-4-101, and Telcordia GR-1217-CORE standards, making it ideal for chassis-based packaging in communications, data, medical, industrial, and instrumentation segments.

Product Attributes

• Brand: Millipacs
• Configuration: 2mm modular, Board-to-Board Interconnection system, Hard Metric (HM)
• Insulator Material: Thermoplastic UL94 V-0 (standard press-fit), High temperature polymer (Pin-in-Paste terminations)
• Contact Material: Copper Alloy
• Contact Plating Material: Gold / Palladium Nickel (mating area), Tin over Nickel (press-fit/pinin-paste terminal area)
• Standards Conformance: IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE, DIN 43356, IEEE 1301
• Certifications: UL and CSA recognized
• Packaging: Tray packaging (standard versions), Tape and Reel packaging (Pin-in-Paste versions)

Technical Specifications