SFP Cage Spring Finger with EMI Shielding Copper Alloy Material Amphenol U77-A261M-2071 Multiple Ports

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Product Description

Product Overview

The Amphenol SFP+ Cage Spring Finger is designed for EMI shielding with extra bottom ground fingers. It is constructed from a copper alloy with various plating options and is available in multiple port configurations. This product is suitable for applications requiring robust signal integrity and electromagnetic interference suppression.

Product Attributes

Brand: Amphenol Canada Corp.
Material: Copper Alloy
Plating Options: Nickel, Matte Tin
Packaging Options: Tray Packaging
Temperature Range: -40C to +85C

Technical Specifications

Model Number	Number of Ports	Plating Type	Packaging Type	Dimensions (mm) - Dim "C"	Dimensions (mm) - Dim "D"	Panel Cutout Height (mm)	Panel Cutout Depth (mm)
U77-A261M-X071	2	Nickel (2) or Matte Tin (3)	Tray (1) or X=3	29.70	31.00	10.40 0.10	3.50)
U77-A461M-X071	4	Nickel (2) or Matte Tin (3)	Tray (1) or X=3	58.20	59.50	10.40 0.10	3.50)
U77-A661M-X071	6	Nickel (2) or Matte Tin (3)	Tray (1) or X=3	86.70	88.00	10.40 0.10	3.50)
General Tolerances: Decimals: 0.25, Angles: 1						Dimensions: Millimeters
Notes: PADS AND VIAS ARE CHASSIS GROUND. THRU-HOLES, PLATING OPTIONAL. PANEL CUTOUT SIZES PER SFF 8433 SPEC. FOR BELLY TO BELLY MOUNTING, DIM "E" (PCB THICKNESS) IS 3.0 mm MIN. DIM "F" RELATED TO DIM "E". FOR DIM "F" = DIM "E" - 0.44 mm.