Durable 288 Contact DDR5 DIMM Socket Amphenol DDR504112805K with High System Level Shock Resistance
Product Overview
Amphenol's Vertical DDR5 DIMM sockets are designed to meet the JEDEC SO-023 interface standard and accept DDR5 memory modules conforming to JEDEC MO-329. These SMT sockets offer 288 contacts on a 0.85mm pitch, facilitating memory expansion in servers, workstations, desktop PCs, and embedded applications. They are engineered to withstand high system-level shock and vibration, support thicker motherboards, optimize airflow, and meet environmental requirements. Key benefits include smaller pitch, lower operating voltage for reduced energy consumption, support for faster data rates, a reduced product width for board space savings, and lower insertion force for easier module handling. Different color options for housing and latches, along with a narrow latch option, aid in quick visual identification and improved airflow.
Product Attributes
- Brand: Amphenol
- Interface Standard: JEDEC SO-023
- Memory Module Standard: JEDEC MO-329
- Termination Type: Surface Mount (SMT)
- Certifications: UL E232356
- Packaging: Tray
Technical Specifications
| Specification | Details |
|---|---|
| Contacts | 288 |
| Pitch | 0.85mm |
| Material - Contacts | Copper alloy, Gold flash or 15in min. of gold or 30in min. of gold (Contact area), Tin or matte tin plating (Solder Area), Nickel plating over all (Underplate) |
| Material - Insulator | High temperature, Thermal plastic (UL94V-0), Color option |
| Material - Boardlock | Copper alloy, Tin plating (Solder Area), Nickel plating overall (Underplate) |
| Voltage Rating | 30V AC (RMS)/DC |
| Current Rating | 1.0Amps/pin max. |
| Insertion Force (Total) | 35N max. |
| Insertion Force (Module) | 106.8N max. |
| Withdrawal Force (Module) | 19.77N min. |
| Retention Force - Contact | 300gf min. per pin |
| Retention Force - Boardlock | 13.3N min. |
| Durability | 25 cycles |
| Latch Overstress Force | 3.5kg min. force held for 10s with no damage |
| Latch Actuation Force | 4.0kgf max. per latch |
| Module Rip Out Force | 9.1kgf min. retention force of the module in connector with no damage |
| Retention of Connector to PCB | No lifting of connector from applicable PCB |
| Solderability | 95% min. |
| Resistance to Soldering Heat | Visual-no damage or discoloration of connector materials |
| Temperature Rise | 30C max. |
| Amphenol Product Specification | S-DDR-005 |
| Amphenol Packaging Specification | PKSDDR5002 |
| Amphenol Application Specification | S-DDR-006 |
| JEDEC Module Outlines | MO-329 |
| JEDEC Socket Outlines | SO-023 |
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