Surface Mount Vertical DDR5 DIMM Socket Amphenol DDR504112001K Supporting JEDEC SO023 and MO329 Standards
Amphenol ICC Vertical DDR5 DIMM Sockets
Product Overview
Amphenol ICC's Vertical DDR5 DIMM sockets are designed to meet the JEDEC SO-023 standard and accept DDR5 memory modules conforming to JEDEC MO-329. These sockets offer 288 contacts on a 0.85mm pitch, facilitating convenient memory expansion in servers, workstations, desktop PCs, and embedded applications within communications and industrial equipment. They are engineered to withstand high system-level shock and vibration, optimize airflow, and support thicker multilevel motherboards, while their smaller pitch and lower operating voltage contribute to reduced energy consumption and faster data rates. The design also features a reduced product width for board space savings and a lower insertion force for easier module card insertion and extraction.
Product Attributes
- Brand: Amphenol ICC
- Standard Compliance: JEDEC SO-023, JEDEC MO-329
- Termination Type: Surface Mount (SMT)
- Certifications: UL E66906
- Housing & Latches: Different color options available for quick visual identification.
- Packaging: Tray
Technical Specifications
| Specification | Details |
|---|---|
| Contacts | 288 |
| Pitch | 0.85mm |
| Material - Contacts | Copper alloy, Gold flash or 15 in min. of gold or 30 in min. of gold (Contact area), Tin or matte tin plating (Solder Area), Nickel plating over all (Underplate) |
| Material - Insulator | High temperature, thermal plastic (UL94V-0), color option |
| Material - Boardlock | Copper alloy, Tin plating (Solder Area), Nickel plating overall (Underplate) |
| Voltage Rating | 30V AC (RMS)/DC |
| Current Rating | 1.0 Amps/pin max. |
| Insertion Force (Total) | 35N max. |
| Insertion Force (Module) | 106.8N max. |
| Withdrawal Force | 19.77N min. |
| Retention Force - Contact | 300gf min. per pin |
| Retention Force - Boardlock | 13.3N min. |
| Durability | 25 cycles |
| Latch Overstress Force | 3.5kg min. force held for 10s with no damage |
| Latch Actuation Force | 4.0kgf max. per latch |
| Module Rip Out Force | 9.1kgf min. retention force of the module in connector with no damage |
| Solderability | 95% min. |
| Resistance to Soldering Heat | Visual-no damage or discoloration of connector materials |
| Temperature Rise | 30C max. |
| Amphenol Product Specification | S-DDR-005 |
| Amphenol Packaging Specification | PKSDDR5002 |
| Amphenol Application Specification | S-DDR-006 |
Target Markets/Applications
- Routers
- Switches
- Wireless Infrastructure
- Desktop PCs
- Server and Storage Systems
- Super Computers
- Workstations
- Embedded Systems
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