Self alignment 050mm pitch board to board connector Amphenol 10156001-051100LF for electronic assembly
Product Overview
The BergStak 0.50mm Self-Alignment Board-to-Board Connector is engineered for high-density applications requiring blind mating capabilities. Its unique self-alignment feature accommodates 0.85mm in pitch and 1.29mm in width, facilitating automatic assembly and reducing manufacturing costs. The scoop-proof housings protect terminals from damage during mating, ensuring reliable contact and improved manufacturing quality. With a fine 0.50mm pitch and a vertical mating configuration, this connector is ideal for parallel board stacker applications where space is a constraint. It supports PCIe Gen 1 speeds of 2.5Gb/s and is constructed from UL94V-0 rated high-temperature LCP material, meeting stringent health, safety, and environmental requirements.
Product Attributes
- Brand: BergStak
- Connector Type: Board-to-Board Connector
- Pitch: 0.50mm
- Housing Material: High temperature thermoplastic LCP, Black (UL94V-0)
- Certifications: RoHS compliant, halogen and lead free
- Packaging: Tape & Reel
Technical Specifications
| Specification | Details |
|---|---|
| Self-Alignment Capability | 0.85mm (Pitch), 1.29mm (Width) |
| Stack Height | 3mm (for 50 positions) |
| Available Positions | 50 positions; extendable from 20 to 60 positions upon request (in increments of 10) |
| Contact Type | Double row contacts |
| Mating Configuration | Vertical |
| Flammability Rating | UL94V-0 |
| Current Rating | 0.5A per contact |
| Voltage Rating | 100VAC |
| LLCR (Initial) | 30m max. |
| LLCR (After Test) | 50m max. |
| Insulation Resistance | 1000M min. |
| Data Rate Support | PCIe Gen 1 (2.5Gb/s) |
| Mating Force | 0.8N per pin max. |
| Unmating Force | 0.15N per pin min. |
| Retention Force | 0.98N per pin min. |
| Durability | 50 mating cycles |
| Operating Temperature Range | -40C to +125C |
| High Temperature Exposure | Withstands 260C for 40 seconds |
| Material - Receptacles | Copper Alloy |
| Material - Headers | Copper Alloy |
| Plating (Contact Area) | 2in Au over 15in min. Pd-Ni |
| Plating (Solder Area) | 2in min. Au |
| Product Specification | GS-12-1298 |
| Part Numbers | Description |
| 10156000-051100LF | BergStak 0.50mm Self-Alignment BTB Conn, Vertical Receptacle, 50 Positions |
| 10156001-051100LF | BergStak 0.50mm Self-Alignment BTB Conn, Vertical Header, 50 Positions |
Target Markets/Applications
- Automotive Camera
- 5G AAU
- Home Automation
- IoT Devices
- Factory Automation Camera
- Embedded Computer
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