Wire to board and board to board connectivity Amphenol 71600-616LF shrouded headers with gold plating
Product Overview
The QUICKIE Shrouded Headers offer robust wire-to-board and board-to-board connectivity solutions. Designed for reliability and ease of use, these headers feature recessed pins to prevent damage during mating and end windows for latching with IDC receptacles. Available in various configurations including Through Mount Vertical, Right Angle, and SMT (Surface Mount) with Pin-in-Paste options, they cater to diverse application needs in communications and other industrial sectors. The SMT variants are optimized for automated assembly processes with tape-and-reel packaging.
Product Attributes
- Brand: QUICKIE
- Type: Shrouded Headers
- Connectivity: Board-to-Board, Wire-to-Board
- Certifications: RoHS compatible (Directive 2002/95/IEC), UL94V-0 Flammability rating
- Housing Material: Glass filled thermoplastic polyester (Blue for Through Mount, Black for SMT, Grey for Eject Latch)
- Pin Material: Phosphor-bronze
- Plating: Gold/GXT over Nickel (specific thicknesses vary by product type)
Technical Specifications
| Specification | Details |
|---|---|
| Current Rating | 3A continuous (Shrouded Headers), 1A continuous (IDC Receptacles, IDC PCB Connector) |
| Insulation Resistance | 1 x 105 M min. |
| Dielectric Withstanding Voltage | 500V RMS min. (Shrouded Headers), 1000V RMS min. (IDC Receptacles, IDC PCB Connector) |
| Operating Temperature Range | -65C to +105C (Through Mount, Eject Latch, IDC Receptacle), -65C to +125C (SMT, IDC PCB Connector) |
| Pin Retention to Housing | 20 N min. |
| Mating Cycles (IDC Receptacle) | 100 |
| Processing Compatibility | Wave soldering, IR reflow soldering, Vapor-phase soldering (specifics vary by product type) |
| File Numbers | E66906, LR46923 |
| Product Specification (Shrouded Headers - Through Mount/Eject Latch) | BUS-12-082 |
| Product Specification (SMT, Pin-in-Paste) | BUS-12-055 |
| Product Specification (IDC Receptacle/PCB Connector) | BUS-12-095 |
| Plating (Through Mount Vertical/Right Angle Headers) | 0.76m (30in.) gold/GXT on mating area, tin on solder side |
| Plating (SMT, Pin-in-Paste) | Gold/GXT over 1.27m (50in.) nickel |
| Plating (Eject Latch Headers) | Gold/GXT over 1.27m (50in.) nickel |
| Plating (IDC Receptacle) | Gold/GXT over 1.27m (50in.) nickel |
| Plating (IDC PCB Connector) | Tin over 1.27m (50in.) nickel |
| Latch Styles (Shrouded Headers) | Standard Latch (Style 1), Low profile Latch (Style 2) |
| Latch Styles (IDC Receptacle) | Standard (mates with IDC receptacle with strain relief), None (mates with shrouded eject latch header latch 2), Latching (mates with low profile headers) |
| Strain Relief Options (IDC Receptacle) | Standard Strain Relief, Latching Strain Relief For Low Profile Header, Without Strain Relief |
| SMT Packaging | Tape-and-Reel (for vertical), Tube (for right angle) |
| Through Mount Packaging | Tubes |
Note: Part numbers and specific dimensions are derived from base part numbers and are not listed exhaustively here.
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